HEAT SINK

Description

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a heat sink, and in particular to a heat sink which has a simple structure and is capable of preventing from generating thermal resistance.

2. Description of Prior Art

With the advancement of the semiconductor technology, the volume of each integrated circuit is gradually decreased. In order to make the integrated circuit to process more data, several times of calculating elements than before are mounted on the integrated circuit of the same volume. The more the number of the calculating elements in the integrated circuit is, the greater the heat generated by the calculating elements is. Taking a central processor as an example, the heat generated by the central processor in its full-load duty may burn down itself. Therefore, it is an important issue to develop a heat sink for the integrated circuit.

Currently, most of the heat sinks are made by metallic materials having a high coefficient of thermal conductivity. In order to enhance the heat-dissipating effect, a fan is used together with a fin set. Further, heat pipes may be used to facilitate the heat dissipation. With the above arrangement, the integrated circuit can be prevented from burning down.

Please refer to FIG. 1, which is an assembled perspective view showing a conventional heat sink. As shown in this figure, the conventional heat sink 1 is constituted by a heat-dissipating base 11, a fin set 12 and at least one heat pipe 13. The heat-dissipating base 11 is provided with a tubular groove 111. One side of the fin set 12 is provided with a first fold 121 adhered to the heat-dissipating base 11. The first fold 121 has a curved notch 1211 corresponding to the tubular groove 111 of the heat-dissipating base 11.

During the assembly of the conventional heat sink 1, the heat pipe 13 is disposed in the tubular groove 111 of the heat-dissipating base 11. The fin set 12 is disposed on the heat-dissipating base 11 in such a manner that the curved notch 1211 of the first fold 121 of the fin set 12 is engaged with the heat pipe 13. In general, the connection between metallic materials is achieved by a soldering process. Therefore, the heat-dissipating base 11, the fin set 12 and the heat pipe 13 are assembled together by a soldering process. Thus, the first fold 121 of the fin set 12 is soldered to the heat-dissipating base 11. However, during the soldering process, some problems such as insufficient soldering, voids or waste of solders may happen. As a result, the thermal-conducting efficiency between the heat sink 1 and a heat source is reduced and a thermal resistance is generated. On the other hand, when a lot of thermal-conducting elements are assembled together, voids may often generate among the thermal-conducting elements, which increases the thermal resistance there between greatly.

According to the above, it is an important issue for the present Inventor and the manufacturers in this field to solve the problems of prior art.

SUMMARY OF THE INVENTION

In order to solve the above problems, an objective of the present invention is to provide a heat sink capable of reducing the thermal resistance between the heat sink and a heat source.

In order to achieve the above objective, the present invention provides a heat sink comprising a fin set, at least one heat pipe and at least one fastener. The fin set has a plurality of fins stacked up each other. Two opposite sides of the fin set are provided with a first fold and a second fold respectively. The heat pipe has a heat-dissipating end and a heat-absorbing end. The heat-dissipating end is disposed through the fins. The heat-absorbing end has a connecting side and a heat-absorbing side. The connecting side corresponds to the heat-absorbing side. The connecting side is brought into contact with the first side. The heat-absorbing side is brought into contact with at least one heat-generating element. The fastener has a body and a plurality of fixing ends. The fixing ends are formed by extending outwards from the body. The center of the body is provided with at least one groove. The body has a first side surface and a second side surface. The first side surface is connected to the first fold of the fin set. The first side surface is brought into thermal contact with the fin set and the heat-generating element via the connecting side and the heat-absorbing side of the heat pipe. With this arrangement, the thermal resistance is reduced while the thermal-conducting effect is increased. As a result, the heat sink has an excellent heat-dissipating effect.

According to the above, the present invention has the following advantageous features: (1) simple structure; (2) excellent heat-dissipating effect; and (3) little thermal resistance.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an exploded perspective view showing a conventional heat sink;

FIG. 2 is an exploded perspective view showing the heat sink according to an embodiment of the present invention;

FIG. 3 is an assembled perspective view showing the heat sink according to the embodiment of the present invention;

FIG. 4 is an assembled perspective view showing the heat sink according to another embodiment of the present invention; and

FIG. 5 is an assembled perspective view showing the heat sink according to another embodiment of the present invention.

DETAILED DESCRIPTION OF THE INVENTION

The above objectives and structural and functional features of the present invention will be described in more detail with reference to preferred embodiments thereof shown in the accompanying drawings

Please refer to FIGS. 2 and 3. The present invention provides a heat sink comprising a fin set 2, at least one heat pipe 3 and at least one fastener 4.

The fin set 2 has a plurality of fins 21 stacked up each other. Two opposite sides of the fin set 2 are provided with a first fold 22 and a second fold 23 respectively.

The heat pipe 3 has a heat-dissipating end 31 and a heat-absorbing end 32. The heat-dissipating end 31 is disposed through the fins 21. The heat-absorbing end 32 has a connecting side 321 and a heat-absorbing side 322. The connecting side 321 is opposite to the heat-absorbing side 322. The connecting side 321 is brought into contact with the first fold 22. The heat-absorbing side 322 is brought into contact with at least one heat-generating element 5.

The first fold 22 is provided with a curved groove 221 abutting against the contacting side 321 of the heat pipe 3.

The fastener 4 has a body 41 and a plurality of fixing ends 42. The fixing end 42 is formed by extending outwards from the body 41. The center of the body 41 is provided with at least one groove 411. The body 41 has a first side surface 412 and a second side surface 413. The first side surface 412 is connected to the first fold 22 of the fin set 2. The fixing end 42 of the fastener 4 further has at least one through-hole 421.

Please refer to FIG. 4, which is an assembled perspective view showing the heat sink according to another embodiment of the present invention. As shown in this figure, the fastener 4 further has an engaging end 43 engaged with the first fold 22 of the fin set 2. The fin set 2 is combined with the engaging end 43 of the fastener 4 by engagement.

Please refer to FIG. 5, which is an assembled perspective view showing the heat sink according to another embodiment of the present invention. As shown in this figure, the fin set 2 is combined with the fastener 2 by soldering.

Although the present invention has been described with reference to the foregoing preferred embodiments, it will be understood that the invention is not limited to the details thereof. Various equivalent variations and modifications can still occur to those skilled in this art in view of the teachings of the present invention. Thus, all such variations and equivalent modifications are also embraced within the scope of the invention as defined in the appended claims.