CADMIUM BLOOM MITIGATION SYSTEM

Description

BACKGROUND

Certain metallic structures include cadmium as protective coating to reduce decay or degradation of the structure. The addition of cadmium coatings on metallic structures can provide protection against corrosion of metal components. For example, metal structures used to form vehicles, such as aerospace, marine or terrestrial vehicles can include a cadmium coating to protect the metal structure. In other examples, metallic structures in electronics can include a cadmium coating to increase the resistance to decay or degradation. For instance, a cadmium coating acts as a barrier against corrosion, helping to extend the lifespan of electronic components, especially in harsh environments.

Cadmium can be electroplated onto various metal parts and assemblies. For example, cadmium can be electroplated onto engines, fasteners, electronic systems, including circuit card assemblies (CCAs), or other metallic structures. In one example, cadmium is electroplated onto landing gear or fasteners on aircraft. In another example, electrical connectors and fasteners undergo electroplating applying cadmium to reduce corrosion and increase the reliability of electrical connections. In other examples, some printed circuit boards incorporate cadmium-coated components or use cadmium to increase corrosion resistance.

Smaller metallic components (e.g., relative to the size of a vehicle), such as fasteners or electronics are optionally protected from environmental conditions with protective packaging. For example, electronics are placed or stored in barrier bags that are designed to protect the electronics, or electrical components from external sources of corrosion or damage. For example, a packaging protects the electrical components from moisture or particulate matter that may be present in the surrounding environment. In other examples, the packaging protects the electrical components from temperature fluctuations, or exposure to temperatures outside of a predetermined threshold.

In certain situations, electrical components are stored for extended periods of time in a protective packaging. For example, the electrical components are stored for months or years before being used. The packaging used when electrical components are stored for extended periods of time can also protect against degradation of the electrical components due to a combination of external environmental conditions or internal conditions within the packaging.

SUMMARY

Metallic structures are optionally formed to include cadmium as a coating, such as a sacrificial anode coating. Metallic structures that include cadmium are, for example, computer system components (e.g., connectors, adapters, wires, fasteners or the like), printed circuit boards including metallic elements, mechanical components (e.g., parts of aircraft, automotive vehicles, or underwater vehicles), or other structures that incorporate metal.

In some instances, a cadmium coating is applied with electroplating, thermal vapor deposition or ion deposition. During electroplating, the metallic structure is submerged in a bath containing cadmium ions. The cadmium ions are then caused to migrate into the surface of the metallic structure and form a layer on the surface of the metallic structure. During thermal vapor deposition, the metallic structure is exposed to cadmium in a low-pressure environment. The cadmium is heated and then condenses onto the surface of the metallic structure. During ion deposition, the metallic structure is, for example, placed in an atmospheric condition where cadmium atoms are energized and directed towards the metallic substrate where the energized atoms condense onto the substate.

Cadmium is optionally coated onto various metal components to reduce the likelihood of corrosion and to increase the reliability of electrical connections. For example, cadmium can act as a protective agent to reduce reactions between the metallic structure and environmental conditions such as moisture, mold, bacterial, salts or harsh chemicals. Cadmium can also be coated on a metallic structure as a sacrificial coating such that the cadmium degrades over time instead of the underlying metallic structure.

When cadmium degrades, it can result in, for example, an occurrence known as cadmium bloom. Cadmium bloom occurs when a cadmium coating is exposed to environmental conditions such as, for example, moisture, humidity, acids or the like. The cadmium bloom can render the metallic component unsuitable or undesirable for the purpose.

In an example, a system for reducing cadmium bloom formation on a packaged article can include a protective enclosure and a cadmium containing component positioned within the protective enclosure. In an example, the packaged article includes the cadmium containing component and the packaged article releases acid into the protective enclosure. The system also includes an acid-offset element included within the protective enclosure and the acid-offset element is configured to mitigate acid within protective enclosure generated by the packaged article.

In another example, the acid-offset element can include a porous substrate where the porous substrate is configured to receive gaseous acid and release gaseous solvents. The acid-offset element also includes one or more acid mitigating materials within the porous substrate and the one or more acid mitigating materials is configured to react with a quantity of acid in a surrounding environment. The one or more acid mitigating materials is configured to mitigate the quantity of acid in the surrounding environment.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 illustrates an example of a cadmium containing component exposed to acid according to at least one example of the present disclosure.

FIG. 2 illustrates an example of a system for reducing cadmium bloom formation according at least one example of the present disclosure.

FIG. 3A illustrates an example of a system for reducing cadmium bloom formation according to at least one example of the present disclosure.

FIG. 3B illustrates an example of a schematic of a cross section of an acid-offset element according to at least one example of the present disclosure.

FIG. 4 illustrates an example a system for reducing cadmium bloom formation according to at least one example of the present disclosure.

FIG. 5 illustrates a method for reducing cadmium bloom formation according to at least one example of the present disclosure.

DETAILED DESCRIPTION

Metallic structures of all sizes can include cadmium, such as a layer or coating on an outer portion of the metallic structure. In some examples, the metallic structure can be a component of an aircraft, automotive vehicle, or marine vehicle. The metallic structure can also be a component of an electrical system or a computer system. The metallic structure can include larger structures such as engines or landing gears on an aircraft, or smaller structures such as couplings, fasteners, connectors, wiring, or the like on a vehicle, static structure, even smaller structures such as those associated with a circuit board.

In some situations, metallic structures include a protective coating to shield the structure from environmental elements that cause or increase degradation. For example, oils, varnishes or polymers are added to articles as a protective coating. For instance, an oil, varnish or polymer coating can be applied to certain portions of a metallic structure as a protective agent or coating. In another example, cadmium can also be applied as a protective agent or coating. A cadmium coating can be used to reduce or slow down degradation of an underlying metallic structure. In some examples, polymers and cadmium are jointly used as protective coatings for the same or different components of an article.

The component of a metallic structure containing a cadmium coating, and optionally additional coatings, can be placed in packaging. The packaging can encase (e.g., envelop, retain, contain, surround, or the like) the metallic structure containing cadmium or a full article, such as a circuit board with metallic structures. The packaging can completely encase or partially encase the article. For example, the packaging can encase the article such that the article is completely sealed, or have openings, or be porous. The packaging can protect the article from environmental conditions such as humidity, moisture, particulates, or temperature. The packaging can also be porous and allow gases or microscopic matter to be released from within the packaging to the environment but prevent environmental conditions from passing through the packaging.

In certain situations, the packaging can retain by-products from degradation of the packaged article. For example, a packaged article can decompose or degrade and release acids as a gas (or vapor) or as molecular substance into the packaging. In some instances, the acid release occurs due to improperly cured coatings. The improperly cured coatings react with the oxygen in the packaging and releases acids into the packaging.

Acids within the packaging, in some instances, react with the cadmium either incorporated with the article or applied as a coating to the article. As the cadmium naturally begins to degrade or corrode, within an encased environment, such as the packaging, the cadmium can react with acids (e.g., gaseous or vapor) present within the encased environment.

Illustrated in FIG. 1 is an example of a fastener 100, as a cadmium containing component, which includes a cadmium coating 110 on an exterior surface 102. In some examples the cadmium coating 110 covers an entire outer, or exterior portion of a fastener 100, or part of the fastener 100. The fastener 100 can be a component of an electronic system 150. A fastener 100 is used as an example of an object that includes a cadmium coating applied; however, the similar concepts discussed herein can be applied to any size or form of an article containing a cadmium layer or has a cadmium coating. For example, the fastener 100 and the electronic system 150 is a small article, relative to the size of a vehicular structure (land, aerospace or marine). In another example, the fastener 100 and the electronic system 150 are metallic structures associated with computers, electrical system or circuitry.

In examples, the electronic system 150 is stored within a protective enclosure 120 (e.g., envelope, container, package, capsule, or the like). The protective enclosure 120, for instance, protects the electronic system 150 from environmental elements such as moisture (e.g., humidity, water or the like) or particulates (e.g., dust, dirt, sand or the like). In some examples, the protective enclosure 120 encases (e.g., envelopes, surrounds, encompasses, confines or the like) the electronic system 150. For example, encasing includes completely encases, encases with a porous structure (e.g., releases certain gases or molecules), encases with an opening or the like.

In some examples, the protective enclosure 120 encases the electronic system 150 and the protective enclosure 120 does not release or only minimally releases acid 140 (e.g., gaseous acid, acid vapors, molecular acid) from the protective enclosure 120. The acid 140 released or liberated within the protective enclosure 120 can interact with the cadmium coating 110. For example, when the acid 140 interacts with the cadmium coating 110, a cadmium bloom 142 forms on the exterior surface 102 of the fastener 100. Cadmium bloom is the reaction or result from, for example, an interaction of acids liberated from the fastener 100, as a cadmium containing component, or the protective enclosure 120 and contained within the protective enclosure 120.

Illustrated in FIG. 2 is an example of a system for reducing cadmium bloom formation 200 on a packaged article 210. The system for reducing cadmium bloom formation 200 includes, for example, a packaged article 210 retained within a protective enclosure. The protective enclosure 230, for example, is an environmental protective enclosure to reduce environmental conditions from damaging the packaged article 210. For instance, the protective enclosure 230 protects the packaged article 210 from moisture (e.g., humidity, rain, water or the like) or particulate matter (e.g., dust, dirt, debris or the like). In some examples, the protective enclosure 230 while protecting the packaged article 210 from environmental elements also retains vapors, gases, or small molecular substance liberated into the environment within the protective enclosure 230.

For instance, the packaged article 210 is an electric component, a fastener, a component of an aerospace system, marine system, terrestrial system or the like. While an electronic component is illustrated in the figures, this disclosure is applicable to other components, articles, systems or the like that contain cadmium. Containing cadmium includes, for example, a cadmium layer associated with the metallic structures. In other examples, containing cadmium includes cadmium coated on a metallic structure.

The packaged article 210, as a circuit board or computer system for example, can included a cadmium containing component 220. In some examples, the packaged article 210 is coated with a protective coating 212 such as an acrylic, hydrocarbon blend, or the like, in addition to a cadmium coating applied to the cadmium containing component 220.

As the protective coating 212 degrades or decomposes over time acid 240 is released within the protective enclosure 230. In other examples, the packaging material 232 releases acid 240 into the protective enclosure 230. The acids 240 released from either the packaged article 210 or the packaging material 232 includes, for example, formic acids or acetic acids. One or more of the formic acid and acetic acids, in some examples, when released from the packaged article 210 or the packaging material 232, engages with elements, or components, of the packaged article 210.

The system for reducing cadmium bloom formation 200 also includes an acid-offset element 250. The acid-offset element 250 mitigates the quantity or potency of acid 240 generated within the protective enclosure 230. For example, the acid-offset element 250 is an acid mitigating material 255. In one example, the acid mitigating material 255 is a particulate matter dispersed within the protective enclosure 230. In another example, the acid-offset element 250 includes an acid mitigating packaging 252 that retains the acid mitigating material 255. In another example, the acid-offset element is included as a component of the protective enclosure, as discussed in relation to FIGS. 3A and 3B.

The acid mitigating material 255 includes, for example, inorganic carbonates such as magnesium, calcium, barium and transition metal carbonates. Other examples of the acid mitigating material 255 includes porous amine and amide polymers for formation of acid base adducts. In other instances, the acid mitigating material 255 includes inorganic salts capable of forming stable complexes with the acids such as phosphates, sulfates, and the like. Inorganic salts can also include inorganic hydroxide salts such as aluminum hydroxide and/or aluminum oxide-hydroxide. Other metal hydroxides and oxides can also serve the function of reducing the presence of acids within the protective enclosure 230.

The acid-offset element 250 is, for example, a trap that interacts with the acid 240 (e.g., vaporous or molecular). For example, the acid-offset element 250 interacts with the acid 240 and reduces the potency of the acid 240. In some examples, the acid-offset element 250 traps (e.g., retains, holds) the acid 240. The acid-offset element 250, for instance, irreversibly reacts with the acid 240 to reduce the potency of the acid 240. For example, the acid-offset element 250 neutralizes the acid 240. In an example, the acid-offset element 250 is the acid mitigating material 255 that reacts with the acid 240 and converts (e.g., transforms) the acid 240 into a neutral (e.g., pH balanced, substantially balanced or balanced relative to the potency of the acid) state. In another example, the acid mitigating material 255 includes the acid mitigating packaging 252 containing the acid mitigating material 255. The acid mitigating packaging 252, for example, is formed from a porous substrate that allows the acid 240 to pass through the acid mitigating packaging 252 and not release the acid 240 from the acid mitigating packaging 252, thereby trapping the acid 240 inside the acid mitigating packaging 252. The acid 240 exposed to the acid mitigating material 255 within the acid mitigating packaging 252 can react with the acid mitigating material 255, as described above to reduce the potency of the acid 240. In some examples, the acid mitigating material 255 within the acid mitigating packaging 252 can convert the acid 240 into a neutral state (e.g., pH balanced, substantially balanced or balanced relative to the potency of the acid). The neutralized acid is then retained (e.g., completely retained, allowing a small amount to escape, or released according to parameters of the design) within the acid mitigating packaging 252.

In an example, the acid mitigating packaging 252 is a receptacle (e.g., envelope, enclosure, capsule, pouch or the like). The acid mitigating packaging 252 is, in another example, a multilayered structure as described related to FIGS. 3A and 3B. In both the example with the acid mitigating packaging 252 as a receptacle and a layer or multilayered structure, the acid mitigating packaging 252, for example, retains or includes the acid mitigating material 255. The acid mitigating packaging 252 is a porous structure that is porous to, for example, acids but is not porous to moisture, bases or other undesired substance.

The acid-offset element 250 is an example of an element that mitigates the quantity, or potency, of acid within the surrounding environment, such as within the protective enclosure 230. The acid-offset element 250 positioned within the protective enclosure 230 proximate to the packaged article 210 including the cadmium containing component 220 reduces cadmium bloom from forming on the cadmium containing component 220, as indicated by the transitional arrow 260.

Reducing the acid 240 present in the environment within the protective enclosure 230 can reduce the likelihood of cadmium bloom forming on the cadmium containing component. The reduction of acid 240 occurs because the acid 240 is not interacting with the cadmium components, but is instead drawn to the acid-offset element 250 where the acid 240 is converted to a form that does not interact with the cadmium either because it is retained or trapped within the acid-offset element 250 or is released in a neutral, or not-reactive, form.

Illustrated in FIG. 3A is an example of a system for reducing cadmium bloom formation 300 including a protective enclosure 320. In the system for reducing cadmium bloom formation 300, the protective enclosure 320 an acid-offset element 350 is, for example, included in the material forming the protective enclosure 320. For example, as illustrated FIG. 3B, a cross section 321 of the protective enclosure 320 is formed from one or more layers 325. For instance, the one or more layers 325 includes one or more porous substrates such as a porous layer 327. The one or more porous layers 327 can include an aerogel, porous silicone, or other porous material. In an example, the one or more porous layers 327 allows acid such as acid vapors 340 to permeate through the one or more porous layers 327.

In an example, a packaged article 310 is positioned, retained, contained, held or the like within the protective enclosure 330. The packaged article 310 includes a cadmium containing component 315. In an example, the cadmium containing component 315 is a metallic component that includes a cadmium layer or is coated with cadmium.

The protective enclosure 320 can protect the packaged article 310 from external environmental elements. As discussed, related to FIG. 2, the packaged article 310 releases (e.g., emits, liberates or the like) acid (e.g., acid vapors 340) into the protective enclosure 320. The acid vapors 340 permeates, for example, through the one or more porous layer 327.

The one or more porous layers 327 can be placed proximate to an intermediary layer 329. The intermediary layer 329 can be the acid-offset element 350. For example, one or more acid mitigating materials 355 are disposed (e.g., embedded, layered, positioned, or the like) between the one or more porous layers 327. While one intermediary layer 329 is disclosed or discussed, more than one intermediary layer 329 and more than one porous layer 327 can sandwich the intermediary layer 329. For instance, acid vapors 340 pass from an interior of the protective enclosure 320 to the acid-offset element 350, as a component of the protective enclosure 320. The acid-offset element 350, as discussed related to FIG. 2, reacts with the acid vapors 340 to reduce the potency of the acid vapors 340. In an example, the acid-offset element 350 neutralizes the acid vapors 340 that permeate through the porous layers 327.

In some instances, the acid-offset element 350 traps the acid vapors, or molecular acid. For example, the acid offset element 350 includes acid mitigating material 355 similar to those discussed related to FIG. 2. The acid mitigating material 355 optionally retains the acid. In another example, the acid mitigating material 355 reduces the potency of the acid within the 320 and retains or releases the converted or transformed acid vapors 340, as discussed related to FIG. 2. Either, or both, retaining the acid 340 or releasing a non-reactive converted acid (e.g., a base or neutral particle) reduces or prevents cadmium bloom from occurring on the cadmium coated component.

FIG. 4 illustrates an example of another of a system for reducing cadmium bloom formation 400. In the example system for reducing cadmium bloom formation 400, a packaged article 410 is positioned within a protective enclosure 430. The packaged article 410 includes a cadmium containing component 420. Similar to the packaged article 210, 310, acid can be released (e.g., emitted, liberated or the like) within the environment contained by the protective enclosure 430.

In one example, an acid-offset element 450 is positioned within the protective enclosure 430 proximate to the packaged article 410. For example, the acid-offset element 450 includes a porous substrate such as a sheet that contains an acid mitigating material 455. In another example, the acid-offset element 450 includes a porous substrate such as an acid mitigating packaging 452 that contains acid mitigating material 455. In an example, the acid mitigating packaging 452 is formed from a porous material that is porous to acids. In some examples, the acid mitigating packaging 452 is not porous to other substances such as moisture, solvents or the like.

Similar to the acid-offset elements 250 and 350, the acid-offset element 450 receives acid 440, emitted from the packaged article 410. The acid 440 permeates through the acid mitigating packaging 452 and is received by the acid mitigating material 455. The acid mitigating material 455 transforms, converts or the like the acid received into a less porous, or neutral material. The acid mitigating material 455, similar to the acid mitigating material 255, 355 can reduce the quantity or potency of acid within the protective enclosure, or the environment surrounding the packaged article. Either, or both, retaining the acid 440 or releasing a non-reactive converted acid (e.g., a base or neutral particle) reduces or prevents cadmium bloom from occurring on the cadmium coated component.

Illustrated in FIG. 5 is an example of a method for reducing cadmium bloom formation 500 on a packaged article. For example, an acid-offset element is positioned within a protective enclosure 510. The protective enclosure, for instance, reduces damage or degradation of the packaged article due to external environmental conditions. In an example, the packaged article positioned within the protective enclosure includes one or more cadmium components. The packaged article, for example, releases an acid into the protective enclosure.

The acid is mitigated within the protective enclosure 520. For example, the acid is mitigated with, for example, an acid mitigating element that includes, for example inorganic carbonate, a porous amine polymer, a porous amide polymer, a metal hydroxide or an oxide. In an example, the acid permeates through an acid-offset element 530. The acid-offset element is, for example formed from a porous material, such as a porous polymer, aerogel, or the like. The acid-offset element of 530 can be any of the acid-offset elements discussed related to FIG. 2, 3A, 3B or 4.

Optionally, the acid is trapped within the acid-offset element 535. For example, the acid is trapped within the acid mitigating material, as described related to FIG. 2, 3A, 3B or 4. In an example, the trapped acid interacts with the acid mitigating material 540. For example, the acid mitigating material and the acid combine to form a non-acidic, or a less acidic substance than the initial acid. For instance, the acid mitigating material reduces the potency of the acid or neutralizes the acid 550. Either, or both, retaining the acid or releasing a non-reactive converted acid (e.g., a base or neutral particle) reduces or prevents cadmium bloom from occurring on the cadmium coated component.

Aspects

Aspect 1 can include subject matter such as a system for reducing cadmium bloom formation on a packaged article, the system comprising: a protective enclosure; a cadmium containing component positioned within the protective enclosure; wherein the packaged article includes the cadmium containing component; wherein the packaged article releases an acid into the protective enclosure; and an acid-offset element included within the protective enclosure; wherein the acid-offset element is configured to mitigate the acid within the protective enclosure generated by the packaged article.

Aspect 2 can include, or can optionally be combined with the subject matter of Aspect 1, to optionally include the acid-offset element includes: an acid mitigating packaging; and an acid mitigating material; wherein the acid mitigating material is configured to irreversibly reacts with the acid within the protective enclosure.

Aspect 3 can include, or can optionally be combined with the subject matter of one or any combination of Aspects 1 or 2 to optionally include the acid-offset element includes inorganic salts; wherein the inorganic salts are configure to form stable complexes with the acid.

Aspect 4 can include, or can optionally be combined with the subject matter of one or any combination of Aspects 1 to 3 to optionally include the protective enclosure includes two or more layers; wherein the two or more layers includes the acid-offset element.

Aspect 5 can include, or can optionally be combined with the subject matter of one or any combination of Aspects 1 to 4 to optionally include the acid-offset element is formed as a sheet; wherein the sheet is positioned in the protective enclosure.

Aspect 6 can include, or can optionally be combined with the subject matter of one or any combination of Aspects 1 to 5 to optionally include the acid-offset element is retained within an acid mitigating packaging; wherein the acid mitigating packaging is configured to be positioned within with the protective enclosure proximate to the packaged article.

Aspect 7 can include, or can optionally be combined with the subject matter of one or any combination of Aspects 1 to 6 to optionally include the acid mitigating packaging is porous and configured to allow acid to permeate through the acid mitigating packaging and retains the mitigated acid within the acid mitigating packaging.

Aspect 8 can include, or can optionally be combined with the subject matter of one or any combination of Aspects 1 to 7 to optionally include the acid-offset element is positioned between one or more layers of aerogel.

Aspect 9 can include subject matter such as an acid-offset element configured to reduce cadmium bloom within an enclosure, the acid-offset element comprising: a porous substrate; wherein the porous substrate is configured to receive gaseous acid and release gaseous solvents; and one or more acid mitigating materials within the porous substrate; wherein the one or more acid mitigating materials is configured to react with a quantity of acid in a surrounding environment; wherein the one or more acid mitigating materials is configured to mitigate the quantity of acid in the surrounding environment.

Aspect 10 can include, or can optionally be combined with the subject matter of one or any combination of Aspect 9 to optionally include the porous substrate is formed as a sheet including one or more layers.

Aspect 11 can include, or can optionally be combined with the subject matter of one or any combination of Aspects 9 or 10 to optionally include the one or more acid mitigating materials are positioned between two or more porous layers.

Aspect 12 can include, or can optionally be combined with the subject matter of one or any combination of Aspects 9 to 11 to optionally include the porous substrate includes a receptacle configured to retain the one or more acid mitigating materials.

Aspect 13 can include, or can optionally be combined with the subject matter of one or any combination of Aspects 9 to 12 to optionally include the one or more acid mitigating materials includes porous substrates; wherein the porous substrate includes one or more of porous silicones or an aerogel.

Aspect 14 can include or can optionally be combined with the subject matter of one or any combination of Aspects 9 to 13 to optionally include the one or more acid mitigating materials includes one or more of an inorganic carbonate, a porous amine polymer, a porous amide polymer, a metal hydroxide or an oxide.

Aspect 15 can include or can optionally be combined with the subject matter of one or any combination of Aspects 9 to 14 to optionally include the porous substrate includes an acid mitigating packaging configured allow acid to permeate through the acid mitigating packaging and retain the mitigated acid within the acid mitigating packaging.

Aspect 16 can include subject matter such as a method for reducing cadmium bloom formation on a packaged article, the method including: providing an acid-offset element within a protective enclosure; wherein the packaged article is positioned within the protective enclosure and the packaged article includes one or more cadmium containing components; wherein the packaged article releases an acid into the protective packaging; and mitigating a presence of the acid within the protective enclosure includes: allowing the acid to permeate through the acid-offset element; wherein the acid-offset element includes one or more acid mitigating materials; and interacting the acid with the one or more acid mitigating materials.

Aspect 17 can include or can optionally be combined with the subject matter of one or any combination of Aspect 16 to optionally include trapping the acid within the acid-offset element.

Aspect 18 can include or can optionally be combined with the subject matter of one or any combination of Aspects 16 or 17 to optionally include the one or more acid mitigating element includes one or more of an inorganic carbonate, a porous amine polymer, a porous amide polymer, a metal hydroxide or an oxide.

Aspect 19 can include, or can optionally be combined with the subject matter of one or any combination of Aspects 16 to 18 to optionally include the acid-offset element includes a porous layer; wherein the porous layer includes aerogels.

Aspect 20 can include, or can optionally be combined with the subject matter of one or any combination of Aspects 16 to 19 to optionally include neutralizing the acid when the acid interacts with the acid mitigating material.

The above description includes references to the accompanying drawings, which form a part of the detailed description. The drawings show, by way of illustration, specific embodiments in which the disclosed concepts can be practiced. These embodiments are also referred to herein as “aspects” or “examples.” Such aspects or example can include elements in addition to those shown or described. However, the description also contemplates aspects or examples in which only those elements shown or described are provided. Moreover, the description also contemplates aspects or examples using any combination or permutation of those elements shown or described (or one or more features thereof), either with respect to a particular aspects or examples (or one or more features thereof), or with respect to other Aspects (or one or more features thereof) shown or described herein.

In the event of inconsistent usages between this document and any documents so incorporated by reference, the usage in this document controls.

In this document, the terms “a” or “an” are used, as is common in patent documents, to include one or more than one, independent of any other instances or usages of “at least one” or “one or more.” In this document, the term “or” is used to refer to a nonexclusive or, such that “A or B” includes “A but not B,” “B but not A,” and “A and B,” unless otherwise indicated. In this document, the terms “including” and “in which” are used as the plain-English equivalents of the respective terms “comprising” and “wherein.” Also, in the following claims, the terms “including” and “comprising” are open-ended, that is, a system, device, article, composition, formulation, or process that includes elements in addition to those listed after such a term in a claim are still deemed to fall within the scope of that claim. Moreover, in the following claims, the terms “first,” “second,” and “third,” etc. are used merely as labels, and are not intended to impose numerical requirements on their objects.

Geometric terms, such as “parallel,” “perpendicular”, “round”, or “square”, are not intended to require absolute mathematical precision, unless the context indicates otherwise. Instead, such geometric terms allow for variations due to manufacturing or equivalent functions. For example, if an element is described as “round” or “generally round,” a component that is not precisely circular (e.g., one that is slightly oblong or is a many-sided polygon) is still encompassed by this description.

The above description is intended to be illustrative, and not restrictive. For example, the above-described aspects or examples (or one or more aspects thereof) may be used in combination with each other. Other embodiments can be used, such as by one of ordinary skill in the art upon reviewing the above description. The Abstract is provided to comply with 37 C.F.R. § 1.72(b), to allow the reader to quickly ascertain the nature of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims. Also, in the above Detailed Description, various features may be grouped together to streamline the disclosure. This should not be interpreted as intending that an unclaimed disclosed feature is essential to any claim. Rather, subject matter may lie in less than all features of a particular disclosed embodiment. Thus, the following claims are hereby incorporated into the Detailed Description as aspects, examples or embodiments, with each claim standing on its own as a separate embodiment, and it is contemplated that such embodiments can be combined with each other in various combinations or permutations. The scope of the disclosed concepts should be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled.