Explore the 6,503 U.S. Patent Applications published on the 42nd week of 2020, including 5,099 applications that subsequently received a Patent Grant.
STAPLE CARTRIDGE
A surgical stapling apparatus is disclosed which comprises a tissue stop configured to inhibit tissue from flowing out of the distal end of the stapling instrument as the tissue is being stapled and/or incised. Also disclosed is a surgical stapling apparatus comprising one or more interruptions, or absent staple cavities, in the rows of staple cavities defined therein. Also disclosed is a surgical stapling apparatus comprising a channel configured to receive tissue and/or another surgical instrument therein. In at least one instance, such a stapling apparatus could comprise staple cavities on one side of a longitudinal knife slot and no staple cavities on the other side of the knife slot. Further disclosed are methods for using the surgical stapling devices disclosed herein.
Published: 2020-10-15 Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION.
Tiered storage optimization and migration
Systems, methods, and computer program products for automating the management of a tiered storage system, which improves the service life and costs of the flash-based storage devices that comprise the storage system. The systems, methods and program products utilize time series learning models to predict the write frequency of each data block for the next cycle of time. Using the write frequency predictions, management of the tiered flash-based storage system can automatically organize and migrate stored data based on storage costs, migration costs and frequency in which the data is accessed. Data that is more frequently accessed and updated is migrated to high-end flash-based storage devices, which are able to endure a greater number of program/erase cycles, while less frequently accessed data is migrated to less expensive, low-end flash-based storage devices, that have a lower maximum number program/erase cycles.
Published: 2020-10-15
HYDRAULIC FRACTURING PUMP SYSTEM
A system for fracturing a subsurface formation may comprise a transport unit with hydraulic legs, an electric motor mounted on the transport unit, a fracking pump mounted on the transport unit and configured to be powered by the electric motor, and an oil tank mounted on the transport unit such that the motor and the fracking pump are above the oil tank. The oil tank may have a first tank height under the pump and a second tank height under the motor and the first tank height may be greater than the second tank height. The oil tank, motor support beam, and pump support beam may form a single structural unit. The system may also include an oil pump for pumping lubricating oil through the fracking pump, an electric motor configured to drive the oil pump, a variable frequency drive configured to control the electric motor.
Published: 2020-10-15 Assignee: Invensas Bonding Technologies, Inc..
Protective elements for bonded structures
A bonded structure is disclosed. The bonded structure can include a semiconductor element comprising active circuitry. The bonded structure can include a protective element directly bonded to the semiconductor element without an adhesive along a bonding interface. The protective element can include an obstructive material disposed over at least a portion of the active circuitry. The obstructive material can be configured to obstruct external access to the active circuitry. The bonded structure can include a disruption structure configured to disrupt functionality of the at least a portion of the active circuitry upon debonding of the protective element from the semiconductor element.
Published: 2020-10-15 Assignee: Invensas Bonding Technologies, Inc..
Wafer-level bonding of obstructive elements
A bonded structure is disclosed. The bonded structure can include a semiconductor element comprising active circuitry. The bonded structure can include an obstructive element bonded to the semiconductor element along a bond interface, the obstructive element including an obstructive material disposed over the active circuitry, the obstructive material configured to obstruct external access to the active circuitry. The bonded element can include an artifact structure indicative of a wafer-level bond in which the semiconductor element and the obstructive element formed part of respective wafers directly bonded prior to singulation.
Published: 2020-10-15 Assignee: ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC..
Protective elements for bonded structures including an obstructive element
A bonded structure is disclosed. The bonded structure can include a semiconductor element comprising active circuitry and a first bonding layer. The bonded structure can include a protective element directly bonded to the semiconductor element without an adhesive along a bonding interface. The protective element can include an obstructive material disposed over the active circuitry and a second bonding layer on the obstructive material. The second bonding layer can be directly bonded to the first bonding layer without an adhesive. The obstructive material can be configured to obstruct external access to the active circuitry.
Published: 2020-10-15 Assignee: Privitar Limited.
Computer-implemented privacy engineering system and method
A system allows the identification and protection of sensitive data in a multiple ways, which can be combined for different workflows, data situations or use cases. The system scans datasets to identify sensitive data or identifying datasets, and to enable the anonymisation of sensitive or identifying datasets by processing that data to produce a safe copy. Furthermore, the system prevents access to a raw dataset. The system enables privacy preserving aggregate queries and computations. The system uses differentially private algorithms to reduce or prevent the risk of identification or disclosure of sensitive information. The system scales to big data and is implemented in a way that supports parallel execution on a distributed compute cluster.
Published: 2020-10-15 Assignee: Government of the United States of America, as Represented by the Secretary of Commerce.
Dynamic physical resource block control apparatus and process for dynamically controlling allocation of a physical resource block
A dynamic physical resource block control apparatus dynamically controls allocation of a physical resource block and includes: a dynamic spectrum arbitrage controller in communication with LTE wireless channels and a secondary user, the dynamic spectrum arbitrage controller: produces a status request to the LTE wireless channels, receives channel status response from the LTE wireless channels in response to the channel status request; receives a PRB allocation request from the secondary user; and produces a PRB map in response to the PRB allocation request; and LTE wireless channels in communication with a primary user and the secondary user and that: communicates a PRB map to the primary user; receives primary user data from the primary user; receives secondary user data from the secondary user.
Published: 2020-10-15 Assignee: SHALEPUMPS, LLC.
Pumping system for a wellsite
A pumping system is provided. The pumping system may include a drive assembly and a pump assembly that is operatively coupled to the drive assembly. The pump assembly may include a pump configured to pressurize a fluid and a multispeed gearbox that is attached to the pump. The multispeed gearbox may be configured to transfer rotational energy from the drive assembly to the pump.
Published: 2020-10-15
FRACTURING SYSTEM COMPONENT AND ASSEMBLY, AND SYSTEM AND METHOD FOR FRACTURING
Apparatus and methods are disclosed for assembling a multi-well fracturing system, and components useful in such a system, and for performing fracturing operations. The multi-well fracturing systems include a movable conduit as a switching member between multiple branches of the fracturing system which extend to different wells within the system. Some such systems may include one or more components placed on adjustable skids to facilitate assembly of the fracturing system.