DETECTION SYSTEM, DETECTION METHOD, AND STORAGE MEDIUM
#6602 ✅ Patent 11,961,753 granted on 2024-04-16Substrate-bonding device
#6603MOUNTING DEVICE AND MOUNTING METHOD
#6604WAFER TO BASEPLATE ARC PREVENTION USING TEXTURED DIELECTRIC
#6605 ✅ Patent 12,293,933 granted on 2025-05-06Electrostatic chuck with multiple heater zones
#6606SUBSTRATE HOLDER
#6607ELECTROSTATIC CHUCK INCLUDING UPPER PLATE AND SUBSTRATE PROCESSING APPARATUS INCLUDING THE SAME
#6608 ✅ Patent 12,040,211 granted on 2024-07-16Devices, systems and methods for electrostatic force enhanced semiconductor bonding
#6609SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
#6610 ✅ Patent 11,862,503 granted on 2024-01-02Method for producing a 3D semiconductor device and structure with memory cells and multiple metal layers
#6611LASER-RELEASABLE BONDING MATERIALS FOR 3-D IC APPLICATIONS
#6612STAMP TOOL, TRANSFER DEVICE, AND ELEMENT ARRAY MANUFACTURING METHOD
#6613SUBSTRATE HOLDER AND METHOD FOR FIXING AND BONDING A SUBSTRATE
#6614LIFT PIN ASSEMBLY
#6615WAFER PLACEMENT TABLE
#6616SUPPORT RING WITH PLASMA SPRAY COATING
#6617SUBSTRATE HOLDER AND METHOD OF PRODUCING SUBSTRATE HOLDER
#6618METHODS FOR BONDING SEMICONDUCTOR ELEMENTS
#6619Stress Modulation Using STI Capping Layer for Reducing Fin Bending
#6620 ✅ Patent 11,830,762 granted on 2023-11-28Method of manufacturing semiconductor structure
#6621SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
#6622SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
#6623METHOD FOR FORMING CONTACT STRUCTURE, SEMICONDUCTOR STRUCTURE AND MEMORY
#6624 ✅ Patent 12,057,345 granted on 2024-08-06Etch profile control of gate contact opening
#6625METHOD OF MANUFACTURING SEMICONDUCTOR MEMORY DEVICE AND SEMICONDUCTOR MEMORY DEVICE
#6626 ✅ Patent 12,080,590 granted on 2024-09-03Manufacturing method of interconnect structure
#6627ETCH STOP LAYER FOR BACKSIDE PROCESSING ARCHITECTURE
#6628DIELECTRIC PLANARIZATION USING A METAL OVERBURDEN WITH ETCH-STOP LAYERS
#6629 ✅ Patent 12,154,823 granted on 2024-11-26Semiconductor device and a method of manufacturing the same
#6630 ✅ Patent 12,046,508 granted on 2024-07-23Method of dielectric material fill and treatment
#6631 ✅ Patent 11,996,329 granted on 2024-05-28Method and IC design with non-linear power rails
#6632VIA ALIGNMENT IN SINGLE DAMASCENE STRUCTURE
#6633METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
#6634 ✅ Patent 12,317,577 granted on 2025-05-273D semiconductor device with 2D semiconductor material and method of forming the same
#6635 ✅ Patent 11,984,361 granted on 2024-05-14Multi-gate devices and method of fabricating the same
#6636 ✅ Patent 12,094,785 granted on 2024-09-17Dual silicide process using ruthenium silicide
#6637 ✅ Patent 11,923,253 granted on 2024-03-05Integrated circuit structure
#6638IN-SITU FEEDBACK FOR LOCALIZED COMPENSATION
#6639METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE
#6640ELECTRONIC DEVICE MANUFACTURING METHOD
#6641MAGNETIC PROPERTY MEASURING SYSTEM, A METHOD FOR MEASURING MAGNETIC PROPERTIES, AND A METHOD FOR MANUFACTURING A MAGNETIC MEMORY DEVICE USING THE SAME
#6642 ✅ Patent 12,198,988 granted on 2025-01-14Gate formation of semiconductor devices
#6643 ✅ Patent 12,211,757 granted on 2025-01-28Semiconductor device and method of forming the same
#6644SEMICONDUCTOR DEVICE
#6645Housing, Semiconductor Module Comprising a Housing and Method for Producing a Housing
#6646SEMICONDUCTOR MODULE
#6647SEMICONDUCTOR MODULE, METHOD OF MANUFACTURING SEMICONDUCTOR MODULE, AND CASE UNIT
#6648 ✅ Patent 12,278,151 granted on 2025-04-15Semiconductor wafer seal ring having protrusion extending into trench in semiconductor substrate
#6649MODULE
#6650DIE ATTACHMENT METHOD FOR SEMICONDUCTOR DEVICES AND CORRESPONDING SEMICONDUCTOR DEVICE
#6651MODULE
#6652 ✅ Patent 12,112,992 granted on 2024-10-08Package having an electronic component and an encapsulant encapsulating a dielectric layer and a semiconductor die of the electronic component
#6653 ✅ Patent 12,198,998 granted on 2025-01-14Dielectric sidewall protection and sealing for semiconductor devices in a in wafer level packaging process
#6654BACKSIDE HEAT DISSIPATION USING BURIED HEAT RAILS
#6655FAN-OUT WAFER-LEVEL PACKAGE
#6656 ✅ Patent 12,074,080 granted on 2024-08-27Self-cleaning heatsink for electronic components
#6657SEMICONDUCTOR PACKAGE
#6658SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
#6659POWER MODULE
#6660 ✅ Patent 12,009,280 granted on 2024-06-11IC package with heat spreader
#6661 ✅ Patent 12,272,616 granted on 2025-04-08Heat-dissipating structures for semiconductor devices and methods of manufacture
#6662 ✅ Patent 12,300,569 granted on 2025-05-13Semiconductor device
#6663DOUBLE-SIDED HEAT DISSIPATION POWER SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME
#6664BONDED BODY, CERAMIC CIRCUIT SUBSTRATE, AND SEMICONDUCTOR DEVICE
#6665SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#6666 ✅ Patent 12,002,736 granted on 2024-06-04Jet impingement cooling for high power semiconductor devices
#6667TUNABLE TRANSMISSION LINES USING BURIED POWER RAIL TECHNOLOGY
#6668 ✅ Patent 12,148,682 granted on 2024-11-19Memory cell in wafer backside
#6669 ✅ Patent 12,288,735 granted on 2025-04-29Through via structure
#6670SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE
#6671INTERCONNECT STRUCTURES
#6672 ✅ Patent 11,948,863 granted on 2024-04-02Package structure and method of forming the same
#6673METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE MODULE BY USING A REACTIVE TAPE AND A SEMICONDUCTOR DEVICE MODULE
#6674SEMICONDUCTOR MODULE
#6675 ✅ Patent 12,068,228 granted on 2024-08-20Leadless semiconductor package with shielded die-to-pad contacts
#6676SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE
#6677SEMICONDUCTOR DEVICE
#6678 ✅ Patent 12,113,001 granted on 2024-10-08Lead frame assembly having a plurality of dicing holes
#6679 ✅ Patent 11,929,310 granted on 2024-03-12Radio frequency packages containing substrates with coefficient of thermal expansion matched mount pads and associated fabrication methods
#6680 ✅ Patent 11,915,999 granted on 2024-02-27Semiconductor device having a carrier, semiconductor chip packages mounted on the carrier and a cooling element
#6681 ✅ Patent 12,300,586 granted on 2025-05-13Leadless semiconductor package with internal gull wing lead structures
#6682PACKAGE, METHOD FOR FORMING A PACKAGE, CHIP CARD, AND METHOD FOR FORMING A CHIP CARD
#6683 ✅ Patent 12,191,238 granted on 2025-01-07Semiconductor package
#6684 ✅ Patent 11,990,397 granted on 2024-05-21Semiconductor device having conductive patterns with mesh pattern and differential signal wirings
#6685INTERPOSER WITH A GLASS CORE THAT INCLUDES OPENINGS AND THROUGH GLASS VIAS
#6686 ✅ Patent 11,955,417 granted on 2024-04-09Electronic device having substrate with electrically floating vias
#6687SUBSTRATE STRUCTURE AND ELECTRONIC DEVICE
#6688SEMICONDUCTOR DEVICE
#6689 ✅ Patent 11,869,836 granted on 2024-01-09Method for forming a semiconductor device
#6690 ✅ Patent 11,776,891 granted on 2023-10-03Semiconductor device
#6691FLEXIBLE LIQUID METAL CONNECTION DEVICE AND METHOD
#6692LAMINATED BODY AND LAMINATED BODY MANUFACTURING METHOD
#6693Terminal Member, Assembly, Semiconductor Device, and Methods for Manufacturing Same
#6694 ✅ Patent 12,009,292 granted on 2024-06-11Metal-insulator-metal (MIM) capacitor structure for layer count reduction and lower capacitance variation
#6695BARRIER LINER FREE INTERFACE FOR METAL VIA
#6696DOPANT-FREE INHIBITOR FOR AREA SELECTIVE DEPOSITIONS
#6697TOP VIA INTERCONNECT STRUCTURE WITH TEXTURE SUPPRESSION LAYERS
#6698SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#6699 ✅ Patent 11,973,028 granted on 2024-04-30Redistribution substrate, method of fabricating the same, and semiconductor package including the same
#6700 ✅ Patent 12,154,853 granted on 2024-11-26Apparatuses including device structures including pillar structures
#6701 ✅ Patent 12,107,043 granted on 2024-10-01Multilayer-type on-chip inductor structure
#6702 ✅ Patent 12,191,252 granted on 2025-01-07Semiconductor fuse with multi-bond wire
#6703LOCAL INTERCONNECTS HAVING DIFFERENT MATERIAL COMPOSITIONS
#6704DUAL-METAL ULTRA THICK METAL (UTM) STRUCTURE
#6705 ✅ Patent 12,300,607 granted on 2025-05-13Three-dimensional memory device
#6706SEMICONDUCTOR MEMORY DEVICE
#6707SIGNAL ROUTING USING STRUCTURES BASED ON BURIED POWER RAILS
#6708 ✅ Patent 12,300,610 granted on 2025-05-13Method and apparatus for electromigration reduction
#6709Method to Produce Buried Nb Lines Surrounded by Ti
#6710JUMPER GATE FOR ADVANCED INTEGRATED CIRCUIT STRUCTURES
#6711SEMICONDUCTOR DEVICE
#6712INTEGRATED CIRCUIT DEVICE INCLUDING GATE CONTACT
#6713 ✅ Patent 12,062,615 granted on 2024-08-13Memory device
#6714SUBSTRATE INCLUDING BRIDGE AND ELECTRONIC DEVICE
#6715ELECTRONIC DEVICE HAVING SUBSTRATE
#6716PACKAGING ARCHITECTURE WITH PATTERNED THROUGH-DIELECTRIC VIAS AND REDISTRIBUTION LAYERS
#6717PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
#6718SEMICONDUCTOR CHIP DEVICE
#6719Field Programmable Multichip Package Based on Field-Programmable-Gate-Array (FPGA) Integrated-Circuit (IC) Chip
#6720PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
#6721ELECTRONIC PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
#6722HYBRID SEMICONDUCTOR PACKAGE FOR IMPROVED POWER INTEGRITY
#6723 ✅ Patent 12,368,108 granted on 2025-07-22ELECTRONIC MODULE AND ELECTRONIC DEVICE
#6724 ✅ Patent 11,887,934 granted on 2024-01-30Package structure and fabrication methods
#6725DISAGGREGATED ENTROPY SERVICES FOR MICROELECTRONIC ASSEMBLIES
#6726ELECTRONIC DEVICE HAVING ALIGNMENT MARK
#6727MICROCHIP CHARGE PATTERNING
#6728 ✅ Patent 12,237,272 granted on 2025-02-25Electronic device and method of manufacturing the same
#6729 ✅ Patent 11,894,316 granted on 2024-02-06Containing electromagnetic interference radiation in lidless semiconductor packages
#6730SEMICONDUCTOR MODULE
#6731SEMICONDUCTOR PACKAGE WITH INTEGRATED ANTENNA AND SHIELDING PILLARS
#6732SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#6733 ✅ Patent 12,148,715 granted on 2024-11-19Electronic device including a substrate, a structure, and an adhesive and a process of forming the same
#6734SEMICONDUCTOR PACKAGE INCLUDING A BARRIER STRUCTURE
#6735 ✅ Patent 12,094,837 granted on 2024-09-17Method of manufacturing semiconductor devices by filling grooves formed in a front side surface of a wafer with a side face protection material
#6736 ✅ Patent 12,107,055 granted on 2024-10-01Electronic package and fabrication method thereof
#6737 ✅ Patent 12,176,299 granted on 2024-12-24Semiconductor device and manufacturing method thereof
#6738 ✅ Patent 12,080,657 granted on 2024-09-03Die embedded in substrate with stress buffer
#6739RFLDMOS DEVICE AND MANUFACTURING METHOD THEREOF
#6740MICROELECTRONIC ASSEMBLIES WITH GLASS SUBSTRATES AND PLANAR INDUCTORS
#6741 ✅ Patent 11,996,373 granted on 2024-05-28Semiconductor device package and method of manufacturing the same
#6742MODULE
#6743METHOD OF MANUFACTURING A REDISTRIBUTION LAYER, REDISTRIBUTION LAYER, INTEGRATED CIRCUIT AND METHODS FOR ELECTRICALLY TESTING AND PROTECTING THE INTEGRATED CIRCUIT
#6744SEMICONDUCTOR DIE WITH DISSOLVABLE METAL LAYER
#6745 ✅ Patent 12,154,875 granted on 2024-11-26Package and method of fabricating the same
#6746 ✅ Patent 11,967,573 granted on 2024-04-23Redistribution layers and methods of fabricating the same in semiconductor devices
#6747SEMICONDUCTOR DEVICE
#6748 ✅ Patent 12,283,558 granted on 2025-04-22Half-bridge circuit package structure
#6749OXIDE AND CARBON LAYERS AT A SURFACE OF A SUBSTRATE FOR HYBRID BONDING
#6750SEMICONDUCTOR MEMORY DEVICE
#6751 ✅ Patent 12,183,699 granted on 2024-12-313D semiconductor device and structure with logic circuits and memory cells
#6752BOND ENHANCEMENT FOR DIRECT-BONDING PROCESSES
#6753 ✅ Patent 12,040,297 granted on 2024-07-16Methods of manufacturing semiconductor packages
#6754 ✅ Patent 12,119,319 granted on 2024-10-15Electronic devices and methods of manufacturing electronic devices
#6755 ✅ Patent 11,842,973 granted on 2023-12-12Pillars as stops for precise chip-to-chip separation
#6756ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
#6757METHOD FOR MANUFACTURING DOUBLE-SIDED COOLING TYPE POWER MODULE AND DOUBLE-SIDED COOLING TYPE POWER MODULE
#6758POWER SEMICONDUCTOR MODULE
#6759SEMICONDUCTOR DEVICE
#6760Packages With Deep Bond Pads and Method Forming Same
#6761FINE-GRAINED DISAGGREGATED SERVER ARCHITECTURE
#6762 ✅ Patent 12,033,976 granted on 2024-07-09Semiconductor package having a through intervia through the molding compound and fan-out redistribution layers disposed over the respective die of the stacked fan-out system-in-package
#6763 ✅ Patent 12,074,137 granted on 2024-08-27Multi-chip package and manufacturing method thereof
#6764 ✅ Patent 12,080,682 granted on 2024-09-03Semiconductor devices and methods of manufacturing semiconductor devices
#6765 ✅ Patent 12,230,605 granted on 2025-02-18Semiconductor package and manufacturing method thereof
#6766POWER DISTRIBUTION FOR STACKED ELECTRONIC DEVICES
#6767Memory Device Including Arrangement of Independently And Concurrently Operable Tiles of Memory Transistors
#6768 ✅ Patent 11,676,945 granted on 2023-06-133D semiconductor device and structure with metal layers
#6769 ✅ Patent 12,062,640 granted on 2024-08-13Semiconductor device and manufacturing method thereof
#6770 ✅ Patent 11,901,340 granted on 2024-02-13Semiconductor power module
#6771 ✅ Patent 12,322,735 granted on 2025-06-03Display panel including opaque encapsulation and doped planarization layers and manufacturing method thereof
#6772FULL-COLOR LED DISPLAY USING MICRO-NANOPIN LED ELEMENTS, AND METHOD FOR PRODUCING SAME
#6773LED ELECTRICAL CONTACT FOR 3D LEDS
#6774 ✅ Patent 12,132,033 granted on 2024-10-29White light emitting devices having high luminous efficiency and improved color rendering that include pass-through violet emissions
#6775LIGHT EMITTING DEVICE ARRAY
#6776PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
#6777 ✅ Patent 11,967,587 granted on 2024-04-23IC package with top-side memory module
#6778 ✅ Patent 12,283,577 granted on 2025-04-22Fan-out semiconductor package
#6779 ✅ Patent 11,948,927 granted on 2024-04-02Semiconductor die with improved thermal insulation between a power portion and a peripheral portion, method of manufacturing, and package housing the die
#6780INTEGRATED CIRCUIT LAYOUT AND INTEGRATED CIRCUIT LAYOUT METHOD FOR FILTER
#6781DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
#6782DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
#6783LED DISPLAY
#6784 ✅ Patent 12,009,354 granted on 2024-06-11SSD wafer device and method of manufacturing same
#6785 ✅ Patent 12,087,752 granted on 2024-09-10Semiconductor module
#6786 ✅ Patent 12,255,197 granted on 2025-03-18Package-on-package type semiconductor package
#6787SEMICONDUCTOR DEVICE
#6788 ✅ Patent 11,862,623 granted on 2024-01-02Semiconductor device including source/drain contact having height below gate stack
#6789DIODE CONFIGURATION FOR CIRCUIT PROTECTION
#6790ELECTROSTATIC PROTECTION CIRCUIT AND CHIP
#6791SEMICONDUCTOR DEVICE
#6792 ✅ Patent 12,310,099 granted on 2025-05-20Semiconductor device
#6793SEMICONDUCTOR DEVICE
#6794 ✅ Patent 11,973,078 granted on 2024-04-30Apparatus and circuits including transistors with different threshold voltages and methods of fabricating the same
#6795INTEGRATED CIRCUIT STRUCTURES WITH TRENCH CONTACT FLYOVER STRUCTURE
#6796VERTICAL FIELD EFFECT TRANSISTOR WITH MINIMAL CONTACT TO GATE EROSION
#6797NANOSHEET DEVICE WITH VERTICAL BLOCKER FIN
#6798INTEGRATED CIRCUIT STRUCTURES HAVING GATE CUT OFFSET
#6799SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#6800METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#6801 ✅ Patent 12,021,082 granted on 2024-06-25Enhanced channel strain to reduce contact resistance in NMOS FET devices
#6802 ✅ Patent 12,211,852 granted on 2025-01-28Semiconductor structure with a second isolation dam and manufacturing method thereof
#6803 ✅ Patent 12,342,626 granted on 2025-06-24SWITCHES IN BULK SUBSTRATE
#6804 ✅ Patent 11,901,366 granted on 2024-02-13Flat panel substrate with integrated antennas and wireless power transmission system
#6805DISPLAY DEVICE
#6806 ✅ Patent 12,249,609 granted on 2025-03-11Thin film transistor and display device comprising the same
#6807DISPLAY DEVICE
#6808 ✅ Patent 12,317,596 granted on 2025-05-27Semiconductor device and manufacturing method thereof
#6809ACTIVE DEVICE SUBSTRATE AND MANUFACTURING METHOD THEREOF
#6810TFT SUBSTRATE AND TFT SUBSTRATE MANUFACTURING METHOD
#6811 ✅ Patent 12,289,921 granted on 2025-04-29Display panel
#6812 ✅ Patent 12,132,056 granted on 2024-10-29Display panel and display device
#6813INFRARED SENSOR AND METHOD OF MANUFACTURING INFRARED SENSOR
#6814 ✅ Patent 12,364,040 granted on 2025-07-15SEMICONDUCTOR PACKAGE
#6815IMAGE SENSING DEVICE
#6816SEMICONDUCTOR LIGHT DETECTION ELEMENT
#6817IMAGE SENSOR SUBSTRATE AND IMAGE SENSOR INCLUDING THE SAME
#6818 ✅ Patent 12,119,365 granted on 2024-10-15Optical semiconductor device with integrated vias implementing inter-die connection
#6819 ✅ Patent 12,046,620 granted on 2024-07-23Optical semiconductor device with composite intervening structure
#6820PHOTOELECTRIC CONVERSION APPARATUS, EQUIPMENT, AND METHOD OF MANUFACTURING PHOTOELECTRIC CONVERSION APPARATUS
#6821 ✅ Patent 11,855,114 granted on 2023-12-26Multilevel semiconductor device and structure with image sensors and wafer bonding
#6822IMAGE SENSOR DEVICE
#6823SOLID-STATE IMAGING ELEMENT
#6824 ✅ Patent 11,869,923 granted on 2024-01-09Light-emitting array with dielectric light collection structures
#6825COLOR TUNABLE LIGHT EMITTING DEVICES
#6826DISPLAY DEVICE AND METHOD OF FABRICATING THE SAME
#6827LIGHT-EMITTING STRUCTURE
#6828 ✅ Patent 12,119,372 granted on 2024-10-15Light emitting device and display device including the same
#6829 ✅ Patent 12,191,343 granted on 2025-01-07Semiconductor device and method of manufacturing semiconductor device
#6830 ✅ Patent 11,869,928 granted on 2024-01-09Dual hydrogen barrier layer for memory devices
#6831NANORIBBON-BASED CAPACITORS
#6832METHOD TO REDUCE BREAKDOWN FAILURE IN A MIM CAPACITOR
#6833 ✅ Patent 12,218,186 granted on 2025-02-04Back-end-of-line passive device structure having common connection to ground
#6834METHOD FOR FORMING SEMICONDUCTOR STRUCTURE, LAMINATE STRUCTURE, AND METHOD FOR FORMING LAMINATE STRUCTURE
#6835 ✅ Patent 11,776,993 granted on 2023-10-03Capacitor array and method for forming the same
#6836METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR STRUCTURE
#6837 ✅ Patent 11,996,441 granted on 2024-05-28Semiconductor device for high voltage applications
#6838SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#6839SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#6840SEMICONDUCTOR DEVICE
#6841 ✅ Patent 11,862,673 granted on 2024-01-02Device for high voltage applications
#6842 ✅ Patent 12,199,141 granted on 2025-01-14Semiconductor device with gradual injection of charge carriers for softer reverse recovery
#6843SILICON CARBIDE SEMICONDUCTOR DEVICE
#6844SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME
#6845 ✅ Patent 12,310,072 granted on 2025-05-20Middle of line structure with stacked devices
#6846 ✅ Patent 11,923,412 granted on 2024-03-05Sub-fin leakage reduction for template strained materials
#6847 ✅ Patent 12,376,352 granted on 2025-07-29INTEGRATED CIRCUIT DEVICES INCLUDING A VERTICAL FIELD-EFFECT TRANSISTOR AND METHODS OF FORMING THE SAME
#6848INTEGRATED CIRCUIT STRUCTURES HAVING MAXIMIZED CHANNEL SIZING
#6849MULTILAYER WORK FUNCTION METAL IN NANOSHEET STACKS USING A SACRIFICIAL OXIDE MATERIAL
#6850 ✅ Patent 11,804,522 granted on 2023-10-31Sidewall epitaxy encapsulation for nanosheet I/O device
#6851SEMICONDUCTOR APPARATUS HAVING STAGGERED STRUCTURE AND METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC DEVICE
#6852SEMICONDUCTOR DEVICE
#6853 ✅ Patent 11,894,425 granted on 2024-02-06Semiconductor arrangement and method of manufacture
#6854SEMICONDUCTOR DEVICE
#6855SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#6856Doped Diamond SemiConductor and Method of Manufacture Using Laser Abalation
#6857 ✅ Patent 12,191,357 granted on 2025-01-07Quantum control devices and methods
#6858SIC SEMICONDUCTOR DEVICE
#6859 ✅ Patent 12,080,764 granted on 2024-09-03Semiconductor structure
#6860 ✅ Patent 12,224,378 granted on 2025-02-11Epitaxial oxide materials, structures, and devices
#6861WRAP-AROUND CONTACT WITH REDUCED RESISTANCE
#6862SEMICONDUCTOR STRUCTURES WITH WRAP-AROUND CONTACT STRUCTURE
#6863STACKED TRANSISTORS WITH REMOVED EPI BARRIER
#6864ANGLED VIA FOR TIP TO TIP MARGIN IMPROVEMENT
#6865 ✅ Patent 12,142,651 granted on 2024-11-12Integrated circuit multi-gate transistors structure with gate via and manufacturing method thereof
#6866SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SAME
#6867SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#6868CO-INTEGRATING GATE-ALL-AROUND NANOSHEET TRANSISTORS AND COMB NANOSHEET TRANSISTORS
#6869INTEGRATED CIRCUIT STRUCTURES HAVING VERSATILE CHANNEL PLACEMENT
#6870GATE-ALL-AROUND FIELD-EFFECT-TRANSISTOR WITH WRAP-AROUND-CHANNEL INNER SPACER
#6871INTEGRATED CIRCUIT STRUCTURES HAVING DIELECTRIC ANCHOR VOID
#6872 ✅ Patent 12,191,370 granted on 2025-01-07Semiconductor device with tunable channel layer usage and methods of fabrication thereof
#6873 ✅ Patent 12,342,576 granted on 2025-06-24SEMICONDUCTOR DEVICES
#6874 ✅ Patent 11,948,991 granted on 2024-04-02Semiconductor structure having an electrical contact
#6875 ✅ Patent 12,040,373 granted on 2024-07-16Liner-free resistance contacts and silicide with silicide stop layer
#6876SEMICONDUCTOR STRUCTURE AND METHOD FOR MANUFACTURING SEMICONDUCTOR STRUCTURE
#6877HYBRID GATE FIELD EFFECT TRANSISTOR, METHOD FOR PREPARING HYBRID GATE FIELD EFFECT TRANSISTOR, AND SWITCH CIRCUIT
#6878Nano-Structure Transistors with Air Inner Spacers and Methods Forming Same
#6879Insulated Gate Structure, Wide Bandgap Material Power Device With the Same and Manufacturing Method Thereof
#6880GATE STRUCTURES IN SEMICONDUCTOR DEVICES
#6881 ✅ Patent 11,855,173 granted on 2023-12-26Transistor with monocrystalline base structures
#6882Method for Forming a Precursor Semiconductor Device Structure
#6883 ✅ Patent 12,166,103 granted on 2024-12-10Semiconductor device for power amplification
#6884 ✅ Patent 12,211,924 granted on 2025-01-28Semiconductor device and method of forming the same
#6885FORMING NS GATES WITH IMPROVED MECHANICAL STABILITY
#6886NANOSHEET DEVICE WITH T-SHAPED DUAL INNER SPACER
#6887 ✅ Patent 12,107,147 granted on 2024-10-01Self-aligned gate contact for VTFETs
#6888SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
#6889SEMICONDUCTOR STRUCTURE WITH MODIFIED SPACER AND METHOD FOR FORMING THE SAME
#6890SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#6891METHOD OF FORMING POWER SEMICONDUCTOR DEVICE
#6892 ✅ Patent 11,990,532 granted on 2024-05-21Method of forming transistor
#6893Vertically Stacked Transistor Structures
#6894 ✅ Patent 12,336,210 granted on 2025-06-17SOURCE/DRAIN STRUCTURE FOR SEMICONDUCTOR DEVICE
#6895CROSS BAR VERTICAL FETS
#6896 ✅ Patent 11,996,472 granted on 2024-05-28Multi-layer dielectric refill for profile control in semiconductor devices
#6897 ✅ Patent 11,901,441 granted on 2024-02-13Fin field-effect transistor and method of forming the same
#6898 ✅ Patent 11,908,926 granted on 2024-02-20Assembling of molecules on a 2D material and an electronic device
#6899 ✅ Patent 12,062,714 granted on 2024-08-13Back end of line nanowire power switch transistors
#6900 ✅ Patent 12,272,747 granted on 2025-04-08Electronic device including a transistor structure