Assignee profile:

EVATEC AG

City:

Trubbach

Country:

Switzerland

Published Applications:

54

Last publication date:

2025-06-12

Patent Grants:

51

Last grant date:

2026-04-07

Top Inventors for applications by EVATEC AG

These are the the leading inventors for applications assigned to EVATEC AG:

Recent patent applications by EVATEC AG

EVATEC AG based in Trubbach, CH has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2025-06-12 ✅ Patent 12,595,550 granted on 2026-04-07
US20250188594A1
Chemistry; metallurgy

VACUUM LAYER DEPOSITION APPARATUS AND METHOD OF DEPOSITING A LAYER ON A SUBSTRATE, ESPECIALLY ON A SUBSTRATE COMPRISING INDENTATIONS IN THE SURFACE TO BE COATED

#2 | 2024-04-25 ✅ Patent 12,272,525 granted on 2025-04-08
US20240136156A1
Electricity

Sputtering apparatus for coating of 3D-objects

#3 | 2024-04-18 ✅ Patent 12,604,700 granted on 2026-04-14
US20240128099A1
Electricity

VACUUM TREATMENT APPARATUS AND METHODS FOR MANUFACTURING VACUUM TREATED SUBSTRATES

#4 | 2024-02-15 ✅ Patent 12,493,016 granted on 2025-12-09
US20240053301A1
Physics

MEASURING DEVICE AND METHOD FOR MEASURING PARAMETERS OF A PIEZOELECTRIC CRYSTAL ONTO WHICH A THIN FILM OF MATERIAL IS DEPOSITED AS WELL AS THIN-FILM DEPOSITION SYSTEMS WITH SUCH A DEVICE AND A METHOD FOR CONTROLLING SUCH SYSTEMS

#5 | 2023-01-19 ✅ Patent 11,848,179 granted on 2023-12-19
US20230014186A1
Electricity

Methods of and apparatus for magnetron sputtering

#6 | 2022-08-18 ✅ Patent 12,426,506 granted on 2025-09-23
US20220263009A1
Electricity

PIEZOELECTRIC COATING AND DEPOSITION PROCESS

#7 | 2022-03-31 ✅ Patent 12,209,302 granted on 2025-01-28
US20220098724A1
Chemistry; metallurgy

Vacuum system and method to deposit a compound layer

#8 | 2021-12-09 ✅ Patent 12,389,797 granted on 2025-08-12
US20210384412A1
Electricity

DEPOSITION PROCESS FOR PIEZOELECTRIC COATINGS

#9 | 2021-12-09 ✅ Patent 11,952,654 granted on 2024-04-09
US20210381099A1
Chemistry; metallurgy

Liquid sputter target

#10 | 2021-11-18 ✅ Patent 11,380,520 granted on 2022-07-05
US20210358718A1
Electricity

RF power delivery to vacuum plasma processing

#11 | 2021-05-13 ✅ Patent 12,211,715 granted on 2025-01-28
US20210143036A1
Electricity

Substrate vacuum treatment apparatus and method therefor

#12 | 2021-02-18 ✅ Patent 11,476,099 granted on 2022-10-18
US20210050193A1
Electricity

Methods of and apparatus for magnetron sputtering

#13 | 2020-12-10 ✅ Patent 11,551,950 granted on 2023-01-10
US20200388517A1
Electricity

Substrate processing apparatus and method of processing a substrate and of manufacturing a processed workpiece

#14 | 2020-12-10 ✅ Patent 11,380,530 granted on 2022-07-05
US20200388474A1
Electricity

Reactive sputtering with HIPIMS

#15 | 2020-10-01 ✅ Patent 11,217,434 granted on 2022-01-04
US20200312624A1
Electricity

RF capacitive coupled dual frequency etch reactor

#16 | 2020-07-09
US20200216955A1
Chemistry; metallurgy

PERMEATION-BARRIER

#17 | 2020-06-11 ✅ Patent 11,377,728 granted on 2022-07-05
US20200181763A1
Chemistry; metallurgy

Broadband optical monitoring

#18 | 2019-11-14 ✅ Patent 10,580,671 granted on 2020-03-03
US20190348311A1
Electricity

Chamber for degassing substrates

#19 | 2019-11-07 ✅ Patent 11,469,085 granted on 2022-10-11
US20190341234A1
Electricity

Vacuum plasma workpiece treatment apparatus

#20 | 2019-11-07 ✅ Patent 11,742,187 granted on 2023-08-29
US20190341231A1
Electricity

RF capacitive coupled etch reactor

#21 | 2019-10-03 ✅ Patent 11,387,079 granted on 2022-07-12
US20190304757A1
Electricity

Plasma etch chamber and method of plasma etching

#22 | 2019-08-15 ✅ Patent 11,145,495 granted on 2021-10-12
US20190252160A1
Electricity

Vacuum treatment chamber and method of manufacturing a vacuum treated plate-shaped substrate

#23 | 2019-03-28 ✅ Patent 11,776,825 granted on 2023-10-03
US20190096715A1
Electricity

Chamber for degassing substrates

#24 | 2019-03-28 ✅ Patent 10,590,538 granted on 2020-03-17
US20190093223A1
Chemistry; metallurgy

Vacuum treatment apparatus

#25 | 2018-09-13
US20180261473A1
Electricity

APPARATUS AND METHOD ESPECIALLY FOR DEGASSING OF SUBSTRATES

#26 | 2018-08-30 ✅ Patent 10,889,890 granted on 2021-01-12
US20180245212A1
Chemistry; metallurgy

Vacuum processing apparatus and method for vacuum processing substrates

#27 | 2018-06-21 ✅ Patent 10,403,522 granted on 2019-09-03
US20180174872A1
Electricity

Chamber for degassing substrates

#28 | 2018-01-25 ✅ Patent 12,249,523 granted on 2025-03-11
US20180025925A1
Electricity

Wafer holder and temperature conditioning arrangement and method of manufacturing a wafer

#29 | 2017-07-20 ✅ Patent 10,202,682 granted on 2019-02-12
US20170204511A1
Chemistry; metallurgy

Method of sputtering and sputter system

#30 | 2017-04-27
US20170117174A1
Electricity

ELECTRO-STATIC CHUCK WITH RADIOFREQUENCY SHUNT

#31 | 2017-01-12 ✅ Patent 10,388,559 granted on 2019-08-20
US20170011951A1
Electricity

Apparatus for depositing a layer on a substrate in a processing gas

#32 | 2016-11-17 ✅ Patent 9,934,992 granted on 2018-04-03
US20160336204A1
Electricity

Chamber for degassing substrates

#33 | 2016-09-15 ✅ Patent 10,138,553 granted on 2018-11-27
US20160265109A1
Chemistry; metallurgy

Vacuum treatment apparatus

#34 | 2016-08-18 ✅ Patent 11,211,234 granted on 2021-12-28
US20160237554A1
Chemistry; metallurgy

Arc suppression and pulsing in high power impulse magnetron sputtering (HIPIMS)

#35 | 2016-06-16 ✅ Patent 11,143,416 granted on 2021-10-12
US20160169536A1
Mechanical engineering

Radiation heater arrangement

#36 | 2015-12-31 ✅ Patent 10,066,287 granted on 2018-09-04
US20150376770A1
Chemistry; metallurgy

Direct liquid deposition

#37 | 2015-12-24 ✅ Patent 9,624,572 granted on 2017-04-18
US20150368792A1
Chemistry; metallurgy

Method of HIPIMS sputtering and HIPIMS sputter system

#38 | 2015-06-25 ✅ Patent 9,607,831 granted on 2017-03-28
US20150179430A1
Electricity

Method for depositing an aluminium nitride layer

#39 | 2015-05-21 ✅ Patent 9,478,420 granted on 2016-10-25
US20150140792A1
Electricity

Method for depositing a group III nitride semiconductor film

#40 | 2015-05-21 ✅ Patent 10,295,110 granted on 2019-05-21
US20150135730A1
Mechanical engineering

Adapter for vacuum-insulated lines

#41 | 2014-11-27 ✅ Patent 10,347,515 granted on 2019-07-09
US20140345518A1
Electricity

Method for manufacturing workpieces and apparatus

#42 | 2014-03-27 ✅ Patent 9,396,981 granted on 2016-07-19
US20140086711A1
Electricity

Vacuum treatment apparatus

#43 | 2013-12-26 ✅ Patent 9,694,990 granted on 2017-07-04
US20130343839A1
Performing operations; transporting

Transport and handing-over arrangement for disc-shaped substrates, vacuum treatment installation and method for manufacture treated substrates

#44 | 2013-10-31 ✅ Patent 9,490,166 granted on 2016-11-08
US20130288477A1
Electricity

Apparatus and method for depositing a layer onto a substrate

#45 | 2013-09-26 ✅ Patent 9,719,177 granted on 2017-08-01
US20130248358A1
Chemistry; metallurgy

In-situ conditioning for vacuum processing of polymer substrates

#46 | 2013-08-29 ✅ Patent 10,692,707 granted on 2020-06-23
US20130220802A1
Chemistry; metallurgy

RF substrate bias with high power impulse magnetron sputtering (HIPIMS)

#47 | 2013-04-25 ✅ Patent 9,593,407 granted on 2017-03-14
US20130099020A1
Performing operations; transporting

Direct liquid deposition

#48 | 2013-02-28 ✅ Patent 9,793,144 granted on 2017-10-17
US20130052834A1
Electricity

Wafer holder and temperature conditioning arrangement and method of manufacturing a wafer

#49 | 2011-08-25 ✅ Patent 9,611,537 granted on 2017-04-04
US20110203920A1
Chemistry; metallurgy

Target shaping

#50 | 2011-05-19 ✅ Patent 9,627,324 granted on 2017-04-18
US20110117702A1
Electricity

Apparatus and method for processing a substrate

#51 | 2010-05-27 ✅ Patent 10,224,188 granted on 2019-03-05
US20100126853A1
Electricity

RF sputtering arrangement

#52 | 2009-07-09 ✅ Patent 10,784,092 granted on 2020-09-22
US20090173622A1
Electricity

Reactive sputtering with HIPIMs

#53 | 2009-05-28 ✅ Patent 9,587,306 granted on 2017-03-07
US20090134011A1
Chemistry; metallurgy

Method for producing a directional layer by cathode sputtering, and device for implementing the method

#54 | 2008-06-12 ✅ Patent 9,355,824 granted on 2016-05-31
US20080135400A1
Electricity

Arc suppression and pulsing in high power impulse magnetron sputtering (HIPIMS)

Also check out Evatec AG's (Trubbach, Switzerland) applicant profile with 37 patent applications submitted.

AssigneeID:

113070 ⎘