Assignee profile:

PROTEC CO., LTD.

City:

Gyeonggi-do

Country:

South Korea

Published Applications:

35

Last publication date:

2026-02-12

Patent Grants:

24

Last grant date:

2026-04-21

Top Inventors for applications by PROTEC CO., LTD.

These are the the leading inventors for applications assigned to PROTEC CO., LTD.:

Recent patent applications by PROTEC CO., LTD.

PROTEC CO., LTD. based in Gyeonggi-do, KR has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2026-02-12
US20260045476A1
Electricity

ELECTRODE MANUFACTURING EQUIPMENT FOR RECHARGEABLE BATTERY

#2 | 2025-08-28
US20250269451A1
Performing operations; transporting

HEAD ASSEMBLY FOR MOUNTING CONDUCTIVE BALL

#3 | 2025-07-10
US20250226237A1
Electricity

METHOD FOR MOUNTING BONDING MATERIAL DEPOSITS

#4 | 2025-06-26
US20250205732A1
Performing operations; transporting

MULTI-NOZZLE PUMP FOR DISPENSING VISCOUS LIQUID

#5 | 2025-05-01
US20250136428A1
Performing operations; transporting

COUPLER SUPPORTING MODULE FOR DRUM CONTAINER

#6 | 2024-10-03 ✅ Patent 12,610,841 granted on 2026-04-21
US20240332233A1
Electricity

METHOD OF BONDING COLUMN TYPE DEPOSITS

#7 | 2024-09-19 ✅ Patent 12,568,589 granted on 2026-03-03
US20240314939A1
Electricity

METHOD OF BONDING COLUMN TYPE DEPOSITS

#8 | 2024-05-30
US20240178182A1
Electricity

APPARATUS AND METHOD FOR FLIP CHIP LASER BONDING

#9 | 2024-03-21 ✅ Patent 12,117,004 granted on 2024-10-15
US20240093685A1
Mechanical engineering

Progressive cavity pump

#10 | 2024-03-21 ✅ Patent 12,595,787 granted on 2026-04-07
US20240093682A1
Mechanical engineering

Diaphragm Pump

#11 | 2024-01-11 ✅ Patent 12,325,088 granted on 2025-06-10
US20240009747A1
Performing operations; transporting

HEAD ASSEMBLY FOR MOUNTING CONDUCTIVE BALL

#12 | 2023-06-29 ✅ Patent 12,104,588 granted on 2024-10-01
US20230204028A1
Mechanical engineering

Low hysteresis piezo-electric pump

#13 | 2023-06-29 ✅ Patent 12,427,537 granted on 2025-09-30
US20230201858A1
Performing operations; transporting

HYBRID SPRAY PUMP

#14 | 2023-06-29
US20230201848A1
Performing operations; transporting

SPRAY PUMP

#15 | 2023-03-30 ✅ Patent 12,217,995 granted on 2025-02-04
US20230093905A1
Electricity

Method of mounting conductive balls using electrostatic chuck

#16 | 2022-10-13
US20220330436A1
Electricity

SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD FOR MANUFACTURING FLEXIBLE CIRCUIT BOARD

#17 | 2022-06-23 ✅ Patent 12,138,650 granted on 2024-11-12
US20220193706A1
Performing operations; transporting

Apparatus for ejecting viscous liquid aerosol

#18 | 2022-02-17 ✅ Patent 12,237,296 granted on 2025-02-25
US20220052019A1
Electricity

System for laser bonding of flip chip

#19 | 2022-02-03 ✅ Patent 12,023,698 granted on 2024-07-02
US20220032332A1
Performing operations; transporting

Dispensing apparatus having nozzle cleaning function

#20 | 2021-10-28 ✅ Patent 12,237,295 granted on 2025-02-25
US20210335749A1
Electricity

Flip chip laser bonding system

#21 | 2021-10-28 ✅ Patent 11,810,890 granted on 2023-11-07
US20210335748A1
Electricity

Flip-chip bonding apparatus using VCSEL device

#22 | 2021-06-17
US20210178421A1
Performing operations; transporting

VISCOUS LIQUID DISPENSING METHOD USING THREE-DIMENSIONAL SCANNER

#23 | 2020-07-09 ✅ Patent 11,358,236 granted on 2022-06-14
US20200215645A1
Performing operations; transporting

Mask changing unit for laser bonding apparatus

#24 | 2020-05-07 ✅ Patent 10,804,240 granted on 2020-10-13
US20200144220A1
Electricity

Method of mounting conductive ball

#25 | 2020-05-07 ✅ Patent 10,804,239 granted on 2020-10-13
US20200144219A1
Electricity

Apparatus for mounting conductive ball

#26 | 2019-10-10 ✅ Patent 10,867,818 granted on 2020-12-15
US20190311925A1
Electricity

Wafer level dispenser

#27 | 2019-01-03 ✅ Patent 10,384,286 granted on 2019-08-20
US20190001426A1
Performing operations; transporting

Method for bonding flexible part including inclined leads

#28 | 2018-12-20 ✅ Patent 10,497,665 granted on 2019-12-03
US20180366435A1
Electricity

Apparatus for laser bonding of flip chip and method for laser bonding of flip chip

#29 | 2018-12-20 ✅ Patent 10,483,228 granted on 2019-11-19
US20180366433A1
Electricity

Apparatus for bonding semiconductor chip and method for bonding semiconductor chip

#30 | 2018-11-29 ✅ Patent 10,475,728 granted on 2019-11-12
US20180342445A1
Electricity

Apparatus for bonding flexible part including inclined leads

#31 | 2018-02-01
US20180035575A1
Electricity

SLURRY DISPENSING APPARATUS FOR EMI SHIELDING

#32 | 2018-01-25 ✅ Patent 10,384,229 granted on 2019-08-20
US20180021805A1
Performing operations; transporting

Apparatus and method for dispensing adhesive liquid for dust trap

#33 | 2017-05-04
US20170120280A1
Performing operations; transporting

FLOWRATE MEASURING TYPE VISCOUS LIQUID DISPENSER AND DISPENSING METHOD

#34 | 2017-05-04 ✅ Patent 10,304,701 granted on 2019-05-28
US20170120279A1
Performing operations; transporting

Pump position feedback type dispenser and dispensing method

#35 | 2016-11-24 ✅ Patent 9,613,913 granted on 2017-04-04
US20160343671A1
Electricity

Method of forming electromagnetic interference shielding layer of ball grid array semiconductor package and base tape for the method

Also check out PROTEC CO., LTD.'s (Gyeonggi-do, South Korea) applicant profile with 30 patent applications submitted.

AssigneeID:

116022 ⎘