Assignee profile:

Octavo Systems LLC

City:

Austin, Texas

Country:

United States

Published Applications:

14

Last publication date:

2020-04-30

Patent Grants:

13

Last grant date:

2022-04-19

Top Inventors for applications by Octavo Systems LLC

These are the the leading inventors for applications assigned to Octavo Systems LLC:

Recent patent applications by Octavo Systems LLC

Octavo Systems LLC based in Austin, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2020-04-30 ✅ Patent 11,308,290 granted on 2022-04-19
US20200134268A1
Physics

Mixed signal computer architecture

#2 | 2020-02-27 ✅ Patent 11,257,803 granted on 2022-02-22
US20200066702A1
Electricity

System in a package connectors

#3 | 2020-02-20 ✅ Patent 11,309,056 granted on 2022-04-19
US20200058364A1
Physics

Automatic test equipment method for testing system in a package devices

#4 | 2019-11-14 ✅ Patent 11,157,676 granted on 2021-10-26
US20190347378A1
Physics

Method for routing bond wires in system in a package (SiP) devices

#5 | 2019-09-05 ✅ Patent 11,211,369 granted on 2021-12-28
US20190273073A1
Electricity

Service module for SIP devices

#6 | 2019-07-04 ✅ Patent 11,502,030 granted on 2022-11-15
US20190206779A1
Electricity

System and method of assembling a system

#7 | 2019-04-18 ✅ Patent 10,867,979 granted on 2020-12-15
US20190115331A1
Electricity

Circuit mounting structure and lead frame for system in package (SIP) devices

#8 | 2019-03-07 ✅ Patent 11,171,126 granted on 2021-11-09
US20190074268A1
Electricity

Configurable substrate and systems

#9 | 2019-01-24 ✅ Patent 10,714,430 granted on 2020-07-14
US20190027443A1
Electricity

EMI shield for molded packages

#10 | 2018-11-08 ✅ Patent 11,416,050 granted on 2022-08-16
US20180321313A1
Physics

Component communications in system-in-package systems

#11 | 2018-11-01 ✅ Patent 11,032,910 granted on 2021-06-08
US20180317323A1
Electricity

System-in-Package device ball map and layout optimization

#12 | 2018-11-01 ✅ Patent 10,470,294 granted on 2019-11-05
US20180317316A1
Electricity

Reduction of passive components in system-in-package devices

#13 | 2017-10-05 ✅ Patent 10,204,890 granted on 2019-02-12
US20170287885A1
Electricity

Substrate for system in package (SIP) devices

#14 | 2017-08-03
US20170221871A1
Electricity

SYSTEMS AND METHODS FOR MANUFACTURING ELECTRONIC DEVICES

Also check out Octavo Systems LLC's (Austin, United States) applicant profile with 3 patent applications submitted.

AssigneeID:

125159 ⎘