Austin, Texas
United States
14
2020-04-30
13
2022-04-19
These are the the leading inventors for applications assigned to Octavo Systems LLC:
Octavo Systems LLC based in Austin, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Mixed signal computer architecture
#2 | 2020-02-27 ✅ Patent 11,257,803 granted on 2022-02-22System in a package connectors
#3 | 2020-02-20 ✅ Patent 11,309,056 granted on 2022-04-19Automatic test equipment method for testing system in a package devices
#4 | 2019-11-14 ✅ Patent 11,157,676 granted on 2021-10-26Method for routing bond wires in system in a package (SiP) devices
#5 | 2019-09-05 ✅ Patent 11,211,369 granted on 2021-12-28Service module for SIP devices
#6 | 2019-07-04 ✅ Patent 11,502,030 granted on 2022-11-15System and method of assembling a system
#7 | 2019-04-18 ✅ Patent 10,867,979 granted on 2020-12-15Circuit mounting structure and lead frame for system in package (SIP) devices
#8 | 2019-03-07 ✅ Patent 11,171,126 granted on 2021-11-09Configurable substrate and systems
#9 | 2019-01-24 ✅ Patent 10,714,430 granted on 2020-07-14EMI shield for molded packages
#10 | 2018-11-08 ✅ Patent 11,416,050 granted on 2022-08-16Component communications in system-in-package systems
#11 | 2018-11-01 ✅ Patent 11,032,910 granted on 2021-06-08System-in-Package device ball map and layout optimization
#12 | 2018-11-01 ✅ Patent 10,470,294 granted on 2019-11-05Reduction of passive components in system-in-package devices
#13 | 2017-10-05 ✅ Patent 10,204,890 granted on 2019-02-12Substrate for system in package (SIP) devices
#14 | 2017-08-03SYSTEMS AND METHODS FOR MANUFACTURING ELECTRONIC DEVICES
Also check out Octavo Systems LLC's (Austin, United States) applicant profile with 3 patent applications submitted.
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