SYSCOM ADVANCED MATERIALS, INC.

City:

Columbus, Ohio

Country:

United States

Published Applications:

Last publication date:

2012-07-05

Patent Grants:

Last grant date:

2016-04-26

Top Inventors for applications by SYSCOM ADVANCED MATERIALS, INC.

These are the the leading inventors for applications assigned to SYSCOM ADVANCED MATERIALS, INC.:

Jar-Wha Lee 4 Columbus, OH United States
Ching Chang 1 Gahanna, OH United States

Recent patent applications by SYSCOM ADVANCED MATERIALS, INC.

SYSCOM ADVANCED MATERIALS, INC. based in Columbus, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2012-07-05 ✅ Patent 9,324,472 granted on 2016-04-26

US20120171485A1

Electricity

Metal and metallized fiber hybrid wire

#2 | 2012-06-28 ✅ Patent 8,501,278 granted on 2013-08-06

US20120164343A1

Performing operations; transporting

Method and apparatus for the treatment of individual filaments of a multifilament yarn

#3 | 2012-01-26

US20120021218A1

Chemistry; metallurgy

ELECTRICALLY CONDUCTIVE METAL-COATED FIBERS, CONTINUOUS PROCESS FOR PREPARATION THEREOF, AND USE THEREOF

#4 | 2008-11-13 ✅ Patent 8,137,752 granted on 2012-03-20

US20080280045A1

Performing operations; transporting

Method and apparatus for the treatment of individual filaments of a multifilament yarn

AssigneeID:

174961 ⎘