MicroAssembly Technologies, Inc.

City:

Richmond, California

Country:

United States

Published Applications:

Last publication date:

2012-08-02

Patent Grants:

Last grant date:

2012-10-23

Top Inventors for applications by MicroAssembly Technologies, Inc.

These are the the leading inventors for applications assigned to MicroAssembly Technologies, Inc.:

Michael B. Cohn 6 Berkeley, CA United States
Joseph T. Kung 3 Santa Clara, CA United States
Ji-Hai Xu 3 El Sobrante, CA United States
Michael Bennett Cohn 3 Berkeley, CA United States

Recent patent applications by MicroAssembly Technologies, Inc.

MicroAssembly Technologies, Inc. based in Richmond, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2012-08-02 ✅ Patent 8,295,027 granted on 2012-10-23

US20120193754A1

Electricity

MEMS device with integral packaging

#2 | 2010-07-06 ✅ Patent 7,750,462 granted on 2010-07-06

US11929115

Microelectromechanical systems using thermocompression bonding

#3 | 2010-04-06 ✅ Patent 7,692,521 granted on 2010-04-06

US11433044

High force MEMS device

#4 | 2008-11-06 ✅ Patent 8,179,215 granted on 2012-05-15

US20080272867A1

Electricity

MEMS device with integral packaging

#5 | 2007-10-02 ✅ Patent 7,276,789 granted on 2007-10-02

US10851751

Microelectromechanical systems using thermocompression bonding

#6 | 2005-03-29 ✅ Patent 6,872,902 granted on 2005-03-29

US10608294

MEMS device with integral packaging

#7 | 2005-02-08 ✅ Patent 6,853,067 granted on 2005-02-08

US10377999

Microelectromechanical systems using thermocompression bonding

AssigneeID:

187405 ⎘