ELECTRONICS PACKAGING SOLUTIONS, INC.

City:

EVERGREEN, Colorado

Country:

United States

Published Applications:

Last publication date:

2011-03-10

Patent Grants:

Last grant date:

2011-08-02

Top Inventors for applications by ELECTRONICS PACKAGING SOLUTIONS, INC.

These are the the leading inventors for applications assigned to ELECTRONICS PACKAGING SOLUTIONS, INC.:

DAVID H. STARK 5 EVERGREEN, CO United States
KEN BETTGER 1 PELLA, IA United States
EDWARD N. BOULOS 1 TROY, MI United States
ELLIOT BROWN 1 GOLDEN, CO United States

Recent patent applications by ELECTRONICS PACKAGING SOLUTIONS, INC.

ELECTRONICS PACKAGING SOLUTIONS, INC. based in EVERGREEN, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2011-03-10

US20110059275A1

Chemistry; metallurgy

INSULATED GLAZING UNITS

#2 | 2010-05-13

US20100119740A1

Fixed constructions

GLASS-TO-METAL BOND STRUCTURE

#3 | 2009-03-19 ✅ Patent 7,989,040 granted on 2011-08-02

US20090074997A1

Fixed constructions

Insulating glass unit having multi-height internal standoffs and visible decoration

#4 | 2006-08-24 ✅ Patent 7,832,177 granted on 2010-11-16

US20060187608A1

Chemistry; metallurgy

Insulated glazing units

#5 | 2006-07-20 ✅ Patent 7,517,712 granted on 2009-04-14

US20060157274A1

Performing operations; transporting

Wafer-level hermetic micro-device packages

AssigneeID:

212646 ⎘