Assignee profile:

ALCHIMER

City:

Massy

Country:

France

Published Applications:

25

Last publication date:

2015-12-31

Patent Grants:

22

Last grant date:

2017-02-07

Top Inventors for applications by ALCHIMER

These are the the leading inventors for applications assigned to ALCHIMER:

Recent patent applications by ALCHIMER

ALCHIMER based in Massy, FR has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2015-12-31 ✅ Patent 9,564,333 granted on 2017-02-07
US20150380254A1
Electricity

Method for forming a metal silicide using a solution containing gold ions and fluorine ions

#2 | 2015-08-06 ✅ Patent 10,472,726 granted on 2019-11-12
US20150218724A1
Chemistry; metallurgy

Electrolyte and process for electroplating copper onto a barrier layer

#3 | 2015-06-11 ✅ Patent 10,011,914 granted on 2018-07-03
US20150159291A1
Chemistry; metallurgy

Copper electrodeposition bath containing an electrochemically inert cation

#4 | 2015-04-23 ✅ Patent 9,863,052 granted on 2018-01-09
US20150112426A1
Chemistry; metallurgy

Formation of organic electro-grafted films on the surface of electrically conductive or semi-conductive surfaces

#5 | 2014-10-30 ✅ Patent 10,460,945 granted on 2019-10-29
US20140318975A1
Electricity

Machine suitable for plating a cavity of a semi-conductive or conductive substrate such as a through via structure

#6 | 2014-03-27 ✅ Patent 9,190,283 granted on 2015-11-17
US20140087560A1
Electricity

Method of depositing metallic layers based on nickel or cobalt on a semiconducting solid substrate; kit for application of said method

#7 | 2014-03-27 ✅ Patent 9,368,397 granted on 2016-06-14
US20140084474A1
Electricity

Method for forming a vertical electrical connection in a layered semiconductor structure

#8 | 2013-07-04
US20130168255A1
Chemistry; metallurgy

COPPER-ELECTROPLATING COMPOSITION AND PROCESS FOR FILLING A CAVITY IN A SEMICONDUCTOR SUBSTRATE USING THIS COMPOSITION

#9 | 2012-08-02 ✅ Patent 8,883,641 granted on 2014-11-11
US20120196441A1
Chemistry; metallurgy

Solution and method for activating the oxidized surface of a semiconductor substrate

#10 | 2012-06-21 ✅ Patent 9,181,623 granted on 2015-11-10
US20120156892A1
Chemistry; metallurgy

Solution and process for activating the surface of a semiconductor substrate

#11 | 2012-01-05 ✅ Patent 8,795,503 granted on 2014-08-05
US20120000785A1
Chemistry; metallurgy

Device and method to conduct an electrochemical reaction on a surface of a semi-conductor substrate

#12 | 2011-12-01 ✅ Patent 8,524,512 granted on 2013-09-03
US20110294231A1
Chemistry; metallurgy

Method for repairing copper diffusion barrier layers on a semiconductor solid substrate and repair kit for implementing this method

#13 | 2010-02-18 ✅ Patent 8,574,418 granted on 2013-11-05
US20100038256A1
Chemistry; metallurgy

Electroplating method for coating a substrate surface with a metal

#14 | 2010-01-07 ✅ Patent 8,119,542 granted on 2012-02-21
US20100003808A1
Electricity

Method of preparing an electrically insulating film and application for the metallization of vias

#15 | 2009-12-10 ✅ Patent 8,133,549 granted on 2012-03-13
US20090301862A1
Electricity

Method for modifying insulating or semi-conductive surfaces, and resulting products

#16 | 2009-12-03 ✅ Patent 8,591,715 granted on 2013-11-26
US20090294293A1
Chemistry; metallurgy

Electrodeposition composition and method for coating a semiconductor substrate using the said composition

#17 | 2009-07-23 ✅ Patent 9,133,560 granted on 2015-09-15
US20090183993A1
Chemistry; metallurgy

Electroplating composition for coating a substrate surface with a metal

#18 | 2009-04-16 ✅ Patent 8,298,946 granted on 2012-10-30
US20090095507A1
Chemistry; metallurgy

Method of selective coating of a composite surface production of microelectronic interconnections using said method and integrated circuits

#19 | 2008-10-30 ✅ Patent 7,956,099 granted on 2011-06-07
US20080269423A1
Chemistry; metallurgy

Modification process for polymer surfaces, notably for hydroxylation of polymer surfaces and products so obtained

#20 | 2008-10-09 ✅ Patent 7,968,653 granted on 2011-06-28
US20080249272A1
Chemistry; metallurgy

Modification process for polymer surfaces, notably for hydroxylation of polymer surfaces and products so obtained

#21 | 2007-11-29 ✅ Patent 7,579,274 granted on 2009-08-25
US20070272560A1
Chemistry; metallurgy

Method and compositions for direct copper plating and filing to form interconnects in the fabrication of semiconductor devices

#22 | 2007-11-15 ✅ Patent 8,405,217 granted on 2013-03-26
US20070262449A1
Electricity

Coating method and solutions for enhanced electromigration resistance

#23 | 2007-09-13 ✅ Patent 8,784,635 granted on 2014-07-22
US20070209943A1
Chemistry; metallurgy

Formation of organic electro-grafted films on the surface of electrically conductive or semi-conductive surfaces

#24 | 2007-03-22
US20070062818A1
Chemistry; metallurgy

Electroplating composition intended for coating a surface of a substrate with a metal

#25 | 2007-03-22
US20070062817A1
Chemistry; metallurgy

Method of coating a surface of a substrate with a metal by electroplating

Also check out ALCHIMER's (Massy, France) applicant profile with 4 patent applications submitted.

AssigneeID:

28553 ⎘