VANTEC CO., LTD.

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2009-04-02

Patent Grants:

Last grant date:

2013-09-24

Top Inventors for applications by VANTEC CO., LTD.

These are the the leading inventors for applications assigned to VANTEC CO., LTD.:

Takuji Nakatogawa 2 Ichihara, Japan
Takuji Nakatogawa 2 Ichihara-shi, Japan
Takuji Nakatogawa 1 Chiba, Japan
Atushi Furutani 1 Kyoto, Japan

Recent patent applications by VANTEC CO., LTD.

VANTEC CO., LTD. based in Tokyo, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2009-04-02 ✅ Patent 8,540,289 granted on 2013-09-24

US20090084785A1

Electricity

Opening/closing structure for container for conveying thin plate

#2 | 2008-02-21 ✅ Patent 7,703,609 granted on 2010-04-27

US20080041761A1

Electricity

Wafer carrier positioning structure

#3 | 2007-12-27

US20070295638A1

Electricity

Wafer transportable container

AssigneeID:

288089 ⎘