Hewlett-PackardDevelopmentCompany,L.P.

City:

Spring, Texas

Country:

United States

Published Applications:

Last publication date:

2022-05-12

Patent Grants:

Last grant date:

2023-12-12

Top Inventors for applications by Hewlett-PackardDevelopmentCompany,L.P.

These are the the leading inventors for applications assigned to Hewlett-PackardDevelopmentCompany,L.P.:

Albert Teishev 1 Nes Ziona, Israel
Katty NOORANY 1 NesZiona, Israel
Daniel SKVIRSKY 1 NesZiona, Israel
Katty Noorany 1 Nes Ziona, Israel

Daniel Skvirsky 1 Nes Ziona, Israel
Inna Tzomik 1 Nes Ziona, Israel

Recent patent applications by Hewlett-PackardDevelopmentCompany,L.P.

Hewlett-PackardDevelopmentCompany,L.P. based in Spring, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2022-05-12 ✅ Patent 11,841,682 granted on 2023-12-12

US20220146956A1

Physics

Printed shrink sleeves

AssigneeID:

323650 ⎘