Assignee profile:

DAYDO CO., LTD.

City:

Osaka

Country:

Japan

Published Applications:

1

Last publication date:

2023-05-25

Patent Grants:

1

Last grant date:

2024-11-19

Top Inventors for applications by DAYDO CO., LTD.

These are the the leading inventors for applications assigned to DAYDO CO., LTD.:

Recent patent applications by DAYDO CO., LTD.

DAYDO CO., LTD. based in Osaka, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

Also check out DAYDO CO., LTD.'s (Osaka, Japan) applicant profile with 1 patent applications submitted.

AssigneeID:

337518 ⎘