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Assignee profile:

Dowa Mining Co., Ltd.

City:

Country:

Japan

Published Applications:

Last publication date:

2007-08-09

Patent Grants:

Last grant date:

2008-12-09

Top Inventors for applications by Dowa Mining Co., Ltd.

These are the the leading inventors for applications assigned to Dowa Mining Co., Ltd.:

Ryuichi Toba 4 Akita, Japan
Naoya Sunachi 4 Akita, Japan
Hiroshi MATSUSHIMA 1 Saitama, Japan
Kentaro Asai 1 Honjo, Japan

Masuo Okada 1 Sendai-shi, Miyagi, 982-0807, Japan
Hiroshi Miyazawa 1 Honjo-shi, Japan
Hiroshi Miyazawa 1 Honjo, Japan
Akito Inoue 1 Honjo-shi, Japan

Takahiro Kuriiwa 1 Utsunomiva-shi, Japan
Kozo Ogi 1 Saitama, Japan
Hideyo Osanai 1 Shiojiri, Japan
Makoto Namioka 1 Shiojiri-shi, Japan

Makoto Namioka 1 Shiojiri, Japan
Takahiro Kuriiwa 1 Utsunomiva, Japan
Masuo OKADA 1 Sendai-shi, Japan
Susumu Ibaraki 1 Shiojiri-shi, Japan

Akito Inoue 1 Honjo, Japan
Susumu Ibaraki 1 Shiojiri, Japan
Hideyo Osanai 1 Shiojiri-shi, Japan
Kentaro Asai 1 Honjo-shi, Japan

Recent patent applications by Dowa Mining Co., Ltd.

Dowa Mining Co., Ltd. based in , JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2007-08-09 ✅ Patent 7,462,301 granted on 2008-12-09

US20070181858A1

Electricity

Silver powder

#2 | 2006-06-01 ✅ Patent 7,256,478 granted on 2007-08-14

US20060113559A1

Chemistry; metallurgy

Notched compound semiconductor wafer

#3 | 2006-06-01 ✅ Patent 7,256,477 granted on 2007-08-14

US20060113558A1

Chemistry; metallurgy

Notched compound semiconductor wafer

#4 | 2006-03-23 ✅ Patent 7,256,476 granted on 2007-08-14

US20060060883A1

Chemistry; metallurgy

Notched compound semiconductor wafer

#5 | 2006-02-14 ✅ Patent 6,998,700 granted on 2006-02-14

US10489499

Notched compound semiconductor wafer

#6 | 2005-12-22 ✅ Patent 7,514,022 granted on 2009-04-07

US20050282006A1

Chemistry; metallurgy

Composite plated product and method for producing same

#7 | 2005-06-16 ✅ Patent 7,094,493 granted on 2006-08-22

US20050129998A1

Chemistry; metallurgy

Hydrogen storage metal alloy, method for absorption and release of hydrogen using the said alloy and hydrogen fuel battery using the said method

#8 | 2005-03-24 ✅ Patent 7,340,828 granted on 2008-03-11

US20050060887A1

Electricity

Method for producing metal/ceramic bonding circuit board

#9 | 2005-02-10 ✅ Patent 7,157,074 granted on 2007-01-02

US20050031534A1

Chemistry; metallurgy

Fine zirconium oxide powder and method for producing same

AssigneeID:

366351 ⎘