Goleta, California
United States
15
2025-10-21
15
2025-10-21
These are the the leading inventors for applications assigned to Transphorm Technology, Inc.:
Transphorm Technology, Inc. based in Goleta, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
III-N devices with improved reliability
#2 | 2024-01-11 ✅ Patent 12,324,180 granted on 2025-06-03Integrated design for III-Nitride devices
#3 | 2023-10-19 ✅ Patent 12,550,702 granted on 2026-02-10III-NITRIDE DEVICES WITH THROUGH-VIA STRUCTURES
#4 | 2023-09-28 ✅ Patent 12,074,150 granted on 2024-08-27Module configurations for integrated III-nitride devices
#5 | 2022-05-19 ✅ Patent 11,973,138 granted on 2024-04-30N-polar devices including a depleting layer with improved conductivity
#6 | 2022-04-19 ✅ Patent 11,309,884 granted on 2022-04-19Switching circuits having drain connected ferrite beads
#7 | 2021-12-30 ✅ Patent 11,810,971 granted on 2023-11-07Integrated design for III-Nitride devices
#8 | 2021-12-16 ✅ Patent 11,749,656 granted on 2023-09-05Module configurations for integrated III-Nitride devices
#9 | 2021-02-11 ✅ Patent 11,322,599 granted on 2022-05-03Enhancement mode III-nitride devices having an Al-SiO gate insulator
#10 | 2021-01-19 ✅ Patent 10,897,249 granted on 2021-01-19Switching circuits having drain connected ferrite beads
#11 | 2020-10-29 ✅ Patent 12,266,725 granted on 2025-04-01Lateral III-nitride devices including a vertical gate module
#12 | 2020-07-02 ✅ Patent 11,121,216 granted on 2021-09-14III-nitride devices including a graded depleting layer
#13 | 2020-04-21 ✅ Patent 10,630,285 granted on 2020-04-21Switching circuits having drain connected ferrite beads
#14 | 2020-04-16 ✅ Patent 10,756,207 granted on 2020-08-25Lateral III-nitride devices including a vertical gate module
#15 | 2019-06-27 ✅ Patent 10,629,681 granted on 2020-04-21III-nitride devices including a graded depleting layer
Also check out Transphorm Technology, Inc.'s (Goleta, United States) applicant profile with 19 patent applications submitted.
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