Winbond Electronics Corp.

City:

Hsinchu

Country:

Japan

Published Applications:

Last publication date:

2008-01-31

Patent Grants:

Last grant date:

2008-06-10

Top Inventors for applications by Winbond Electronics Corp.

These are the the leading inventors for applications assigned to Winbond Electronics Corp.:

Po-An CHEN 1 Hsinchu, Taiwan
Lu-Ping Chiang 1 Hsinchu, Taiwan
Lu-Ping CHIANG 1 Hsinchu City, Taiwan

Recent patent applications by Winbond Electronics Corp.

Winbond Electronics Corp. based in Hsinchu, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2008-01-31 ✅ Patent 7,385,867 granted on 2008-06-10

US20080025086A1

Physics

Memory device and operating method thereof

AssigneeID:

406403 ⎘