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Assignee profile:

Hitachi High-Tech Electronics Engineering Co., Ltd.

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2008-05-22

Patent Grants:

Last grant date:

2009-03-31

Top Inventors for applications by Hitachi High-Tech Electronics Engineering Co., Ltd.

These are the the leading inventors for applications assigned to Hitachi High-Tech Electronics Engineering Co., Ltd.:

Hidetoshi NISHIYAMA 4 Fujisawa, Japan
Minori Noguchi 4 Mitsukaido, Japan
Akira HAMAMATSU 4 Yokohama, Japan
Yoshimasa Ohshima 3 Yokohama, Japan

Tetsuya Watanabe 2 Honjyou, Japan
Kenya Wada 2 Tokyo, Japan
Jun Onoshiro 2 Tokyo, Japan
Kenji WATANABE 2 Oume, Japan

Tetsuya Watanabe 2 Honjo, Japan
Takahiro Jingu 2 Takasaki, Japan
Minori NOGUCHI 2 Mitsukaidou, Japan
Yasuo YATSUGAKE 1 Kamisato, Japan

Takanori Ninomiya 1 Hiratsuka, Japan
Masami Makuuchi 1 Yokohama, Japan
Masayoshi Takahashi 1 Yokohama, Japan
Masahiko Nakada 1 Okegawa, Japan

Ritsurou Orihashi 1 Yokohama, Japan
Aritoshi Sugimoto 1 Bunkyo-ku, Japan
Tsutomu Nagakura 1 Hadano, Japan
Toshihiko Nakata 1 Hiratsuka, Japan

Norio Chujo 1 Shibuya, Japan
Takeshi Sato 1 Ninomiya-machi, Japan
Hirofumi TSUCHIYAMA 1 Hitachinaka, Japan
Teruaki Tokutomi 1 Odawara, Japan

Kazuyuki Sonobe 1 Ninomiya-machi, Japan
Ichiro MORIYAMA 1 Hamura, Japan
Hideaki KATAHO 1 Tokyo, Japan
Sachio UTO 1 Yokohama, Japan

Yoshihiko Hayashi 1 Setagaya, Japan
Takahisa Ishida 1 Hadano, Japan
Masami Ikoto 1 Higashiyamato, Japan
Junichi Taguchi 1 Kodama-gun, Japan

Kenji Watanabe 1 Ome, Japan
Kenji Aikou 1 Ninomiya-machi, Japan
Yoshikazu TANABE 1 Irima, Japan
Yasunori Fukuyama 1 Odawara, Japan

Shinji Homma 1 Ashigarakami, Japan
Yoshio Morishige 1 Honjyou, Japan
Ichiyo Ando 1 Tokyo, Japan
Kenji OKA 1 Hitachinaka, Japan

Ichiro ISHIMARU 1 Mure, Japan
Hideaki Amano 1 Odawara, Japan
Noritake Shizawa 1 Ninomiya-machi, Japan
Takahiko Suzuki 1 Honjou, Japan

Yukio KENBOU 1 Tokyo, Japan
Wakana Shinke 1 Hamura, Japan
Maki Tanaka 1 Yokohama, Japan
Izuo Horai 1 Odawara, Japan

Yoshimasa Ooshima 1 Yokohama, Japan
Kyoichi Mori 1 Oiso-machi, Japan
Fujio Tajima 1 Hiratsuka, Japan
Yuko Inoue 1 Okegawa, Japan

Shunji MAEDA 1 Yokohama, Japan
Taketo UENO 1 Fujisawa, Japan

Recent patent applications by Hitachi High-Tech Electronics Engineering Co., Ltd.

Hitachi High-Tech Electronics Engineering Co., Ltd. based in Tokyo, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2008-05-22 ✅ Patent 7,511,806 granted on 2009-03-31

US20080117415A1

Physics

Apparatus and method for inspecting defects

#2 | 2007-03-29 ✅ Patent 7,586,593 granted on 2009-09-08

US20070070339A1

Physics

Inspection method and inspection apparatus

#3 | 2005-09-13 ✅ Patent 6,944,325 granted on 2005-09-13

US10656221

Inspecting method and apparatus for repeated micro-miniature patterns

#4 | 2005-08-30 ✅ Patent 6,936,835 granted on 2005-08-30

US10230416

Method and its apparatus for inspecting particles or defects of a semiconductor device

#5 | 2005-06-28 ✅ Patent 6,911,101 granted on 2005-06-28

US10613005

ACF tape feeder machine, and method for feeding ACF tape

#6 | 2005-05-24 ✅ Patent 6,897,956 granted on 2005-05-24

US10235656

Apparatus and method for measuring alignment accuracy, as well as method and system for manufacturing semiconductor device

#7 | 2005-05-17 ✅ Patent 6,894,489 granted on 2005-05-17

US10735909

TESTING APPARATUS FOR CONDUCTING A TEST ON A MAGNETIC RECORDING MEDIUM OR A MAGNETIC HEAD, THROUGH RECORDING TEST DATA ON THE MAGNETIC RECORDING MEDIUM AND REPRODUCING RECORDED TEST DATA THEREFROM BY MEANS OF THE MAGNETIC HEAD

#8 | 2005-05-17 ✅ Patent 6,893,329 granted on 2005-05-17

US10656926

Polishing apparatus with abrasive tape, polishing method using abrasive tape and manufacturing method for magnetic disk

#9 | 2005-05-17 ✅ Patent 6,894,302 granted on 2005-05-17

US9791742

Surface inspection apparatus and method thereof

#10 | 2005-05-03 ✅ Patent 6,888,918 granted on 2005-05-03

US10715767

Surface inspection method and surface inspection apparatus

#11 | 2005-05-03 ✅ Patent 6,887,330 granted on 2005-05-03

US10613008

Machine for punching out electronic circuitry parts, method for replacing tape supply reels, and method for producing electronic circuitry parts from tape

#12 | 2005-05-03 ✅ Patent 6,888,959 granted on 2005-05-03

US9791682

Method of inspecting a semiconductor device and an apparatus thereof

AssigneeID:

414481 ⎘