Dowa Electronics Materials., Ltd.

City:

Tokyo

Country:

Japan

Published Applications:

Last publication date:

2006-09-28

Patent Grants:

Last grant date:

2009-05-19

Top Inventors for applications by Dowa Electronics Materials., Ltd.

These are the the leading inventors for applications assigned to Dowa Electronics Materials., Ltd.:

Koji Hirata 1 Honjo-shi, Japan
Tomoya Yamada 1 Okayama, Japan
Koji Hirata 1 Honjo, Japan
Tomoya Yamada 1 Okayama-shi, Japan

Recent patent applications by Dowa Electronics Materials., Ltd.

Dowa Electronics Materials., Ltd. based in Tokyo, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2006-09-28 ✅ Patent 7,534,283 granted on 2009-05-19

US20060213328A1

Performing operations; transporting

Method of producing copper powder and copper powder

AssigneeID:

415815 ⎘