Mitsui High-Tec, Inc.

City:

Country:

Japan

Published Applications:

Last publication date:

2011-11-01

Patent Grants:

Last grant date:

2011-11-01

Top Inventors for applications by Mitsui High-Tec, Inc.

These are the the leading inventors for applications assigned to Mitsui High-Tec, Inc.:

Katsufusa Fujita 5 Fukuoka, Japan
Yoshiaki Mitsui 2 Fukuoka, Japan
Tetsuyuki Hirashima 1 Fukuoka, Japan
Kiyoshi Matsunaga 1 Fukuoka, Japan

Takao Shioyama 1 Fukuoka, Japan
Keiji Takai 1 Fukuoka, Japan
Chikaya Mimura 1 Fukuoka, Japan

Recent patent applications by Mitsui High-Tec, Inc.

Mitsui High-Tec, Inc. based in , JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2011-11-01 ✅ Patent 8,048,509 granted on 2011-11-01

US10250848

Laminated core and method of producing laminated core

#2 | 2010-08-05 ✅ Patent 8,205,322 granted on 2012-06-26

US20100192357A1

Electricity

Method of manufacturing laminated core

#3 | 2008-05-01 ✅ Patent 7,698,803 granted on 2010-04-20

US20080098587A1

Electricity

Method of manufacturing laminated core

#4 | 2007-08-09 ✅ Patent 8,003,444 granted on 2011-08-23

US20070181983A1

Electricity

Semiconductor device and manufacturing method thereof

#5 | 2007-05-31 ✅ Patent 7,665,205 granted on 2010-02-23

US20070119050A1

Electricity

Method of manufacturing a laminated leadframe

#6 | 2006-09-12 ✅ Patent 7,103,961 granted on 2006-09-12

US10482861

Production method of amorphous laminate core and amorphous laminate core

#7 | 2005-08-30 ✅ Patent 6,936,915 granted on 2005-08-30

US10399819

Lead frame having chip mounting part and leads of different thicknesses

AssigneeID:

423605 ⎘