College Point, New York
United States
4
2011-03-17
4
2011-10-18
These are the the leading inventors for applications assigned to Interplex QLP, Inc.:
Interplex QLP, Inc. based in College Point, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Plastic electronic component package
#2 | 2009-12-03 ✅ Patent 7,803,307 granted on 2010-09-28Ultra high-temperature plastic package and method of manufacture
#3 | 2008-06-05 ✅ Patent 7,679,185 granted on 2010-03-16Microcircuit package having ductile layer
#4 | 2005-01-20 ✅ Patent 7,736,573 granted on 2010-06-15Thermoplastic material
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