Germany
3
2010-03-04
3
2011-04-19
These are the the leading inventors for applications assigned to Smart Pac GmbH Technology Services:
Smart Pac GmbH Technology Services based in , DE has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Method and device for transferring a solder deposit configuration
#2 | 2008-12-11 ✅ Patent 7,762,446 granted on 2010-07-27Method and device for transferring a solder deposit configuration
#3 | 2006-09-12 ✅ Patent 7,106,599 granted on 2006-09-12Chip module and chip card module for producing a chip card
429337 ⎘