Advanced Interconect Materials, LLC

City:

Sendai-shi

Country:

Japan

Published Applications:

Last publication date:

2012-01-05

Patent Grants:

Last grant date:

2013-11-12

Top Inventors for applications by Advanced Interconect Materials, LLC

These are the the leading inventors for applications assigned to Advanced Interconect Materials, LLC:

Akihiro Shibatomi 1 Sendai, Japan
Junichi Koike 1 Sendai, Japan

Recent patent applications by Advanced Interconect Materials, LLC

Advanced Interconect Materials, LLC based in Sendai-shi, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2012-01-05 ✅ Patent 8,580,688 granted on 2013-11-12

US20120003390A1

Electricity

Copper interconnection structure and method for forming copper interconnections

AssigneeID:

472076 ⎘