Assignee profile:

STMicroelectronics, Inc.

City:

Calamba, Laguna

Country:

Philippines

Published Applications:

10

Last publication date:

2017-06-29

Patent Grants:

10

Last grant date:

2017-11-21

Top Inventors for applications by STMicroelectronics, Inc.

These are the the leading inventors for applications assigned to STMicroelectronics, Inc.:

Recent patent applications by STMicroelectronics, Inc.

STMicroelectronics, Inc. based in Calamba, Laguna, PH has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2017-06-29 ✅ Patent 9,824,979 granted on 2017-11-21
US20170186698A1
Electricity

Electronic package having electromagnetic interference shielding and associated method

#2 | 2017-06-08 ✅ Patent 9,947,612 granted on 2018-04-17
US20170162479A1
Electricity

Semiconductor device with frame having arms and related methods

#3 | 2016-12-29 ✅ Patent 10,008,472 granted on 2018-06-26
US20160379916A1
Electricity

Method for making semiconductor device with sidewall recess and related devices

#4 | 2016-10-06 ✅ Patent 9,818,675 granted on 2017-11-14
US20160293523A1
Electricity

Semiconductor device including conductive clip with flexible leads and related methods

#5 | 2016-04-26 ✅ Patent 9,324,643 granted on 2016-04-26
US14566826
Electricity

Integrated circuit device having exposed contact pads and leads supporting the integrated circuit die and method of forming the device

#6 | 2015-12-03 ✅ Patent 9,947,636 granted on 2018-04-17
US20150348891A1
Electricity

Method for making semiconductor device with lead frame made from top and bottom components and related devices

#7 | 2015-12-03 ✅ Patent 9,490,146 granted on 2016-11-08
US20150348879A1
Electricity

Semiconductor device with encapsulated lead frame contact area and related methods

#8 | 2015-10-20 ✅ Patent 9,165,867 granted on 2015-10-20
US14449492
Electricity

Semiconductor device with lead frame contact solder balls and related methods

#9 | 2014-10-02 ✅ Patent 9,177,903 granted on 2015-11-03
US20140291842A1
Electricity

Enhanced flip-chip die architecture

#10 | 2013-07-04 ✅ Patent 9,022,773 granted on 2015-05-05
US20130168898A1
Performing operations; transporting

Compensating mold plunger for integrated circuit manufacture

Also check out STMicroelectronics, Inc.'s (Calamba, Laguna, Philippines) applicant profile with 14 patent applications submitted.

AssigneeID:

492878 ⎘