E-PACK, INC.

City:

Ann Arbor, Michigan

Country:

United States

Published Applications:

Last publication date:

2016-06-09

Patent Grants:

Last grant date:

2019-04-23

Top Inventors for applications by E-PACK, INC.

These are the the leading inventors for applications assigned to E-PACK, INC.:

Jay Stewart MITCHELL 1 Ypsilanti, MI United States
Sang Woo Lee 1 Ann Arbor, MI United States
Khalil Najafi 1 Ann Arbor, MI United States
Sang-Hyun Lee 1 Ann Arbor, MI United States

Onnop Srivannavit 1 Ann Arbor, MI United States

Recent patent applications by E-PACK, INC.

E-PACK, INC. based in Ann Arbor, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2016-06-09 ✅ Patent 10,266,392 granted on 2019-04-23

US20160159641A1

Performing operations; transporting

Environment-resistant module, micropackage and methods of manufacturing same

Also check out E-PACK, INC.'s (Ann Arbor, United States) applicant profile with 1 patent applications submitted.

AssigneeID:

553806 ⎘