Mt. Prospect, Illinois
United States
2
2019-08-15
2
2021-08-03
These are the the leading inventors for applications assigned to MULTI-PACK CHICAGO LLC:
MULTI-PACK CHICAGO LLC based in Mt. Prospect, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:
Systems and methods for forming dual layer water soluble packets
#2 | 2016-04-28 ✅ Patent 10,273,027 granted on 2019-04-30Systems and methods for forming dual layer water soluble packets
Also check out MULTI-PACK CHICAGO LLC's (Mt. Prospect, United States) applicant profile with 1 patent applications submitted.
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