SHANGHAI SILVER PASTE SCI. &TECH. CO., LTD.

City:

Shanghai

Country:

China

Published Applications:

Last publication date:

2025-02-13

Patent Grants:

Last grant date:

2023-09-12

Top Inventors for applications by SHANGHAI SILVER PASTE SCI. &TECH. CO., LTD.

These are the the leading inventors for applications assigned to SHANGHAI SILVER PASTE SCI. &TECH. CO., LTD.:

Xiaolong Chen 2 Shanghai, China
Jie Liu 2 Shanghai, China
Bing LIU 1 Shanghai, China
Liang Wang 1 Shanghai, China

Liang Qiao 1 Shanghai, China
Can Ma 1 Shanghai, China
Yun Wang 1 Shanghai, China
Mingfei SHU 1 Shanghai, China

Recent patent applications by SHANGHAI SILVER PASTE SCI. &TECH. CO., LTD.

SHANGHAI SILVER PASTE SCI. &TECH. CO., LTD. based in Shanghai, CN has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2025-02-13

US20250055079A1

Electricity

CONDUCTIVE SILVER ALUMINUM PASTE, PREPARATION METHOD, ELECTRODE, AND N-TYPE TOPCON BATTERY

#2 | 2023-09-12 ✅ Patent 11,756,699 granted on 2023-09-12

US17986785

Electricity

Conductive silver aluminum paste, preparation method, electrode and cell

Also check out SHANGHAI SILVER PASTE SCI. &TECH. CO., LTD.'s (Shanghai, China) applicant profile with 2 patent applications submitted.

AssigneeID:

636632 ⎘