Microwave Bonding Instruments, Inc.

City:

Arcadia, California

Country:

United States

Published Applications:

Last publication date:

2011-07-26

Patent Grants:

Last grant date:

2011-07-26

Top Inventors for applications by Microwave Bonding Instruments, Inc.

These are the the leading inventors for applications assigned to Microwave Bonding Instruments, Inc.:

Nasser K. Budraa 2 La Crescenta, CA United States
Boon Ng 2 Alhambra, CA United States

Recent patent applications by Microwave Bonding Instruments, Inc.

Microwave Bonding Instruments, Inc. based in Arcadia, US has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

#1 | 2011-07-26 ✅ Patent 7,985,657 granted on 2011-07-26

US11684553

Systems and methods for bonding materials using microwave energy

#2 | 2011-06-28 ✅ Patent 7,968,426 granted on 2011-06-28

US11551915

Systems and methods for bonding semiconductor substrates to metal substrates using microwave energy

AssigneeID:

667149 ⎘