Assignee profile:

PACPLUS CO., LTD.

City:

Osaka

Country:

Japan

Published Applications:

1

Last publication date:

2015-04-16

Patent Grants:

1

Last grant date:

2016-05-03

Top Inventors for applications by PACPLUS CO., LTD.

These are the the leading inventors for applications assigned to PACPLUS CO., LTD.:

Recent patent applications by PACPLUS CO., LTD.

PACPLUS CO., LTD. based in Osaka, JP has been assigned the rights to these inventions. The list includes both Pending Applications and Patent Grants:

Also check out PacPlus Co., Ltd.'s (Osaka, Japan) applicant profile with 1 patent applications submitted.

AssigneeID:

90781 ⎘