207020 ⎘
Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof; Manufacture or treatment of semiconductor devices or of parts thereof; Forming layers; Forming insulating materials on a substrate characterised by the type of layer, e.g. type of material, porous/non-porous, pre-cursors, mixtures or laminates characterised by the material of the layer carbon based polymeric organic or inorganic material, e.g. polyimides, poly cyclobutene or PVC
Epoxy-containing polymer, photo-curable resin composition, patterning process, and electric/electronic part protective film
#902Formulations for voltage switchable dielectric materials having a stepped voltage response and methods for making the same
#903Materials and methods for stress reduction in semiconductor wafer passivation layers
#904Sacrificial inorganic polymer intermetal dielectric damascene wire and via liner
#905Insulating film, process for producing the same and electronic device using the same
#906High-performance gate oxides such as for graphene field-effect transistors or carbon nanotubes
#907Low-K interlevel dielectric materials and method of forming low-K interlevel dielectric layers and structures
#908Photosensitive insulating resin composition, hardening product thereof, and circuit board equipped therewith
#909Formulations for voltage switchable dielectric material having a stepped voltage response and methods for making the same
#910Carbosilane polymer compositions for anti-reflective coatings
#911Method of integrating an air gap structure with a substrate
#912Thermally imageable dielectric layers, thermal transfer donors and receivers
#913Circuit device including a nano-composite dielectric film
#914ORGANIC TRANSISTOR AND MANUFACTURING METHOD THEREOF
#915Ultraviolet-curing resin material for pattern transfer and magnetic recording medium manufacturing method using the same
#916Semiconductor device having silicon-diffused metal wiring layer and its manufacturing method
#917FERROELECTRIC MATERIAL AND METHOD OF FORMING FERROELECTRIC LAYER USING THE SAME
#918SEMICONDUCTOR DEVICE HAVING A INTERLAYER INSULATION FILM WITH LOW DIELECTRIC CONSTANT AND HIGH MECHANICAL STRENGTH
#919TREATED SUBSTRATE HAVING HYDROPHILIC REGION AND WATER REPELLENT REGION, AND PROCESS FOR PRODUCING IT
#920POSITIVE PHOTOSENSITIVE RESIN COMPOSITION FOR SPRAY COATING, METHOD FOR FORMING CURED FILM USING THE SAME, CURED FILM, AND SEMICONDUCTOR DEVICE
#921Process for producing semiconductor device
#922MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE, INSULATING FILM FOR SEMICONDUCTOR DEVICE, AND MANUFACTURING APPARATUS OF THE SAME
#923Electrical passivation of silicon-containing surfaces using organic layers
#924Reducing defects in electronic switching devices
#925INSULATING RESIN COMPOSITION
#926Stabilization of Bicycloheptadiene
#927Gate insulating film forming agent for thin-film transistor
#928Polymer for forming insulating film, composition for forming insulating film, insulating film, and electronic device having same
#929Photosensitive resin composition, process for producing patterned hardened film with use thereof and electronic part
#930Photosensitive resin composition, insulating film, protective film, and electronic equipment
#931PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM, PROTECTIVE FILM, INSULATING FILM, SEMICONDUCTOR DEVICE AND DISPLAY DEVICE USING THE SAME
#932Nanoporous media with lamellar structures
#933Source material for preparing low dielectric constant material
#934ORGANIC INSULATING MATERIAL, VARNISH FOR RESIN FILM USING THE SAME, RESIN FILM AND SEMICONDUCTOR DEVICE
#935Method of preparing an electrically insulating film and application for the metallization of vias
#936Pore-forming precursors and porous dielectric layers obtained therefrom
#937ORGANIC INSULATING MATERIALS, VARNISHES FOR ORGANIC INSULATING FILM EMPLOYING THEM, ORGANIC INSULATING FILMS AND SEMICONDUCTOR DEVICES
#938Nonvolatile memory device using semiconductor nanocrystals and method forming same
#939Mesa type semiconductor device and manufacturing method thereof
#940INTEGRATED SYSTEM FOR SEMICONDUCTOR SUBSTRATE PROCESSING USING LIQUID PHASE METAL DEPOSITION
#941Graphoepitaxial self-assembly of arrays of downward facing half-cylinders
#942Functionalized, hydrogen-passivated silicon surfaces
#943Process for fabricating nanowire arrays
#944Method of fine patterning semiconductor device
#945Borazine-based resin, process for its production, borazine-based resin composition, insulating film and method for its formation
#946Electrodeposition of dielectric coatings on semiconductive substrates
#947Micro electro mechanical system, semiconductor device, and manufacturing method thereof
#948Resin composition, varnish, resin film and semiconductor device
#949Polymer interlayer dielectric and passivation materials for a microelectronic device
#950Superjunction device having a dielectric termination and methods for manufacturing the device
#951METHOD AND APPARATUS FOR TREATING A SEMI-CONDUCTOR SUBSTRATE
#952Dielectric nanostructure and method for its manufacture
#953METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#954Method for manufacturing porous structure and method for forming pattern
#955Method of manufacturing semiconductor device
#956Insulating film-forming composition
#957Resin composition, varnish, resin film and semiconductor device using the same
#958Over-passivation process of forming polymer layer over IC chip
#959Field-effect transistor
#960Self-assembled sidewall spacer
#961Composition for low dielectric material, low dielectric material and method for production thereof
#962Method to improve a copper/dielectric interface in semiconductor devices
#963METHOD OF PREPARING CROSS-LINKED ORGANIC GLASSES FOR AIR-GAP SACRIFICIAL LAYERS
#964Patternable dielectric film structure with improved lithography and method of fabricating same
#965Method of forming a carbon polymer film using plasma CVD
#966Microelectronic device
#967Method for producing chip stacks, and associated chip stacks
#968Treated substrate having hydrophilic region and water repellent region, and process for producing it
#969Thin-film materials, thin films and producing method thereof
#970Device having high aspect-ratio via structure in low-dielectric material and method for manufacturing the same
#971Electronic device having a dielectric layer
#972Semiconductor substrates including vias of nonuniform cross-section and associated structures
#973Manufacturing method of semiconductor device and film deposition system
#974Insulating film for semiconductor integrated circuit
#975Formation of a masking layer on a dielectric region to facilitate formation of a capping layer on electrically conductive regions separated by the dielectric region
#976Heat-resistant photosensitive resin composition, method for forming pattern using the composition, and electronic part
#977Photosensitive composition, and cured relief pattern production method and semiconductor device using the same
#978Method of manufacturing semiconductor device
#979THIN FILM FORMED FROM POLYCYCLIC ALICYCLIC COMPOUND AS PRECUSER AND PRODUCTION METHOD THEREOF
#980Benzoxazole resin precursor, polybenzoxazole resin, resin film and semiconductor device
#981Method for producing a metal article intended for at least partially coating with a substance
#982Composite photoresist structure
#983Polymers with high internal free volume
#984Semiconductor wafer with improved crack protection
#985Low-K interlevel dielectric materials and method of forming low-K interlevel dielectric layers and structures
#986COMPOSITION FOR FORMING LOW-DIELECTRIC-CONSTANT FILM, INSULATING FILM, AND ELECTRONIC DEVICE
#987Multilayered interconnect structure and method for fabricating the same
#988METHOD FOR MAKING ELECTRONIC DEVICES HAVING A DIELECTRIC LAYER SURFACE TREATMENT
#989POROUS COMPOSITION OF MATTER, AND METHOD OF MAKING SAME
#990Semiconductor device having a interlayer insulation film with low dielectric constant and high mechanical strength
#991UV CURABLE COMPOSITION FOR FORMING DIELECTRIC COATINGS AND RELATED METHOD
#992Organic semiconductor device, process for producing the same, and organic semiconductor apparatus
#993Film forming composition, insulating film, and electronic device
#994PRODUCTION METHOD OF INSULATING FILM, INSULATING FILM, STACKED PRODUCT AND ELECTRONIC DEVICE
#995Polybenzoxazole precursor, photosensitive resin composition using the same, and manufacturing method of semiconductor device
#996Patterned deposition using compressed carbon dioxide
#997Patternable low dielectric constant materials and their use in ULSI interconnection
#998Insulating layer, organic thin film transistor using the insulating layer, and method of fabricating the organic thin film transistor
#999Method of forming an insulative film
#1000Laminated body and semiconductor device
#1001Sacrificial inorganic polymer intermetal dielectric damascene wire and via liner
#1002Dual damascene fabrication with low k materials
#1003Semiconductor device and manufacturing method for the same
#1004Multilayer device with organic and inorganic dielectric material
#1005Organometallic compounds
#1006N-channel transistor
#1007Method of forming a component having dielectric sub-layers
#1008Ambipolar, Light-Emitting Field-Effect Transistors
#1009LIKE INTEGRATED CIRCUIT DEVICES WITH DIFFERENT DEPTH
#1010Deposition of Polymeric Materials and Precursors Therefor
#1011Method of making a molecule-surface interface
#1012Method of forming carbon polymer film using plasma CVD
#1013Method of forming a carbon polymer film using plasma CVD
#1014Semiconductor device having silicon-diffused metal wiring layer and its manufacturing method
#1015Micro electro mechanical system, semiconductor device, and manufacturing method thereof
#1016Semiconductor substrate surface protection method
#1017Dielectric media including surface-treated metal oxide particles
#1018Semiconductor method having silicon-diffused metal wiring layer
#1019Method for manufacturing insulating resin layer, substrate for electro-optical devices, method for manufacturing electro-optical device, and electro-optical device
#1020Sacrificial inorganic polymer intermetal dielectric damascene wire and via liner
#1021Composition of polyimide and sterically-hindered hydrophobic epoxy
#1022Photosensitive polyimide compositions
#1023Semiconductor memory device and method of fabricating the same
#1024PREVENTING DAMAGE TO INTERLEVEL DIELECTRIC
#1025Like integrated circuit devices with different depth
#1026Molecular caulk: a pore sealant for ultra-low k dielectrics
#1027METHODS OF FABRICATING A SEMICONDUCTOR DEVICE USING A PHOTOSENSITIVE POLYIMIDE LAYER AND SEMICONDUCTOR DEVICES FABRICATED THEREBY
#1028Method of forming low-K interlevel dielectric layers and structures
#1029Sacrificial benzocyclobutene copolymers for making air gap semiconductor devices
#1030Semiconductor substrates including vias of nonuniform cross section, methods of forming and associated structures
#1031Method of fabricating a semiconductor device
#1032Method for forming high-resolution pattern and substrate having prepattern formed thereby
#1033Sealing porous dielectric material using plasma-induced surface polymerization
#1034Semiconductor device and the manufacturing method for the same
#1035Multifunctional unsymmetrically substituted monomers and polyarylene compositions therefrom
#1036Sacrificial styrene benzocyclobutene copolymers for making air gap semiconductor devices
#1037Process for producing dielectric insulating thin film, and dielectric insulating material
#1038Electronic apparatus having polynorbornene foam insulation
#1039Formation of a masking layer on a dielectric region to facilitate formation of a capping layer on electrically conductive regions separated by the dielectric region
#1040Forming semiconductor structures
#1041Sacrificial benzocyclobutene/norbornene polymers for making air gap semiconductor devices
#1042Micropattern forming material and method for forming micropattern
#1043Atmospheric glow discharge with concurrent coating deposition
#1044Nanoporous media with lamellar structures
#1045Organic polymers, electronic devices, and methods
#1046Method for manufacturing porous structure and method for forming pattern
#1047Method for forming a resist film on a substrate having non-uniform topography
#1048Laminate and method of forming the same, insulating film, and semiconductor device
#1049Methods for producing a dielectric, dielectric having self-generating pores, monomer for porous dielectrics, process for preparing poly-o-hydroxyamides, process for preparing ploybenzoxazoles, and processes for producing an electronic component
#1050Insulating film and method of forming the same
#1051Insulating film, process for producing the same and electronic device using the same
#1052Insulating film, process for producing the same and electronic device using the same
#1053Method and apparatus for processing organosiloxane film
#1054Metal structure with sidewall passivation and method
#1055Integrated high voltage capacitor having a top-level dielectric layer and a method of manufacture therefor
#1056METHOD OF FORMING CHIP-TYPE LOW-K DIELECTRIC LAYER
#1057Dielectric material
#1058Resin composition, heat-resistant resin paste and semiconductor device using these and method of preparing the same
#1059Organic insulator composition comprising high dielectric constant insulator dispersed in hyperbranched polymer and organic thin film transistor using the same
#1060CHsacrificial layer for cu/low-k interconnects
#1061Method of forming a nonvolatile memory device using semiconductor nanoparticles
#1062Organic insulator, organic thin film transistor array panel including organic insulator, and manufacturing method therefor
#1063Sacrificial layers comprising water-soluble compounds, uses and methods of production thereof
#1064Adhesion promoter for ferroelectric polymer films
#1065Organic-inorganic composite insulating material for electronic element, method of producing same and field-effect transistor comprising same
#1066Method for fabricating semiconductor device
#1067Semiconductor device fabrication method
#1068Selectively growing a polymeric material on a semiconductor substrate
#1069Borazine-based resin, and method for production thereof, borazine based resin composition, insulating coating and method for formation thereof, and electronic parts having the insulating coating
#1070Planarization films for advanced microelectronic applications and devices and methods of production thereof
#1071Patternable low dielectric constant materials and their use in ULSI interconnection
#1072Low dielectric constant insulating material and semiconductor device using the material
#1073Cyclic olefin polymers and catalyst for semiconductor applications
#1074Low dielectric constant material having thermal resistance, insulation film between semiconductor layers using the same, and semiconductor device
#1075Method of forming a component having dielectric sub-layers
#1076Method of forming a carbon polymer film using plasma CVD
#1077Display and method for fabricating the same
#1078Method for making electronic devices having a dielectric layer surface treatment
#1079Organosilicate resins as hardmasks for organic polymer dielectrics in fabrication of microelectronic devices
#1080Method of patterning surfaces while providing greater control of recess anisotropy
#1081Shallow trench isolation depth extension using oxygen implantation
#1082Method of forming a solution processed device
#1083Semiconductor device having a multilayer wiring structure
#1084Method for making hybrid dielectric film
#1085Top anti-reflective coating composition and method for pattern formation of semiconductor device using the same
#1086Porous composite polymer dielectric film
#1087Alkali-soluble gap fill material forming composition for lithography
#1088Film
#1089Thin film transistor and method of fabricating the same
#1090Method and apparatus for providing shear-induced alignment of nanostructure in thin films
#1091Organic thin film transistor with polymeric interface
#1092Materials with enhanced properties for shallow trench isolation/premetal dielectric applications
#1093Electrical passivation of silicon-containing surfaces using organic layers
#1094Organic thin film transistor with polymeric interface
#1095Organic semicounductor device, process for producing the same, and organic semiconductor apparatus
#1096Composition for low dielectric material, low dielectric material and method for production thereof
#1097Method for forming a plane structure
#1098Structure and method to preserve STI during etching
#1099Final passivation scheme for integrated circuits
#1100Surface modification of a porous organic material through the use of a supercritical fluid
#1101Porous materials
#1102Method of manufacturing semiconductor device
#1103Over-passivation process of forming polymer layer over IC chip
#1104Method for synthesizing polymeric material, method for forming polymer thin film and method for forming interlayer insulating film
#1105Layered components, materials, methods of production and uses thereof
#1106Surface modification of CVD polymer films
#1107Composite polymer dielectric film
#1108Composition for film formation, coating solution containing the same and electronic device having insulating film obtained by using the coating solution
#1109Preparation of crosslinked particles from polymers having activatible crosslinking groups
#1110Heat treatment apparatus and substrate processing apparatus
#1111Method for forming semiconductor device
#1112Process for preparing low dielectric constant material
#1113Formation of interconnect structures by removing sacrificial material with supercritical carbon dioxide
#1114Interlayer dielectric film, and method for forming the same and interconnection
#1115Method for manufacturing semiconductor device
#1116Crosslinkable fill compositions for uniformly protecting via and contact holes
#1117UV-activated dielectric layer
#1118Sacrificial inorganic polymer intermetal dielectric damascene wire and via liner
#1119Fabricating a semiconductor device using fully cured bisbenzocyclobutene
#1120Developer-soluble materials and methods of using the same in via-first dual damascene applications
#1121Method and apparatus for forming insulating layer
#1122Lithography pattern shrink process and articles
#1123Material for forming silica based film
#1124Metal article intended for at least partially coating with a substance and a method for producing the same
#1125Composition for forming organic insulating film and organic insulating film formed from the same
#1126Process for making air gap containing semiconducting devices and resulting semiconducting device
#1127Semiconductor constructions
#1128Semiconductor device and method for manufacturing the same
#1129Composition for film formation, method for preparing the composition, and method for forming insulating film
#1130Organic field effect transistor with an organic dielectric
#1131UV curable composition for forming dielectric coatings and related method
#1132UV curable composition for forming dielectric coatings and related method
#1133Via-filling material and process for fabricating semiconductor integrated circuit using the material
#1134Process for sealing plasma-damaged, porous low-k materials
#1135Method for evaluating solution for a coating film for semiconductors
#1136Layer incorporating particles with a high dielectric constant
#1137Insulating layer having decreased dielectric constant and increased hardness
#1138Methods of making thin dielectric layers on substrates
#1139Low K dielectric integrated circuit interconnect structure
#1140Process for producing semiconductor device and semiconductor device
#1141Organic thin film transistor enhanced in charge carrier mobility by virtue of surface relief structure
#1142Fabrication method of a semiconductor device using liquid repellent film
#1143Structure and method for improved adhesion between two polymer films
#1144Electronic device with organic insulator
#1145Process modules for transport polymerization of low epsilon thin films
#1146Polynorbornene foam insulation for integrated circuits
#1147Method of fabricating a semiconductor device having a photo-sensitive polyimide layer and a device fabricated in accordance with the method
#1148Composition for porous organic film
#1149Semiconductor chip with FIB protection
#1150Organic compositions
#1151Organic polymers, laminates, and capacitors
#1152Composition containing a cross-linkable matrix precursor and a poragen, and porous matrix prepared therefrom
#1153Polyparaxylylene film, production method therefor and semiconductor device
#1154Photodefinable polymers for semiconductor applications
#1155Polyelectrolyte nanolayers as diffusion barriers in semiconductor devices
#1156Organic thin film transistor comprising multi-layered gate insulator
#1157Methods for anisotropic etch of silicon-based materials with selectivity to organic materials
#1158Semiconductor device with selective dielectric deposition
#1159Nanofluidic channel fabrication by controlled spontaneous fracturing
#1160Method for forming thermally stable organosilicon polymer film
#1161Covalent chemical surface modification of surfaces with available silicon or nitrogen
#1162Method for polymer-assisted chip transfer
#1163Graphoepitaxy directed self assembly
#1164Selective dry etch for directed self assembly of block copolymers
#1165Crack prevent and stop for thin glass substrates
#1166Methods for forming different shapes in different regions of the same layer
#1167Conductive structure in semiconductor structure and method for forming the same
#1168Back end of line (BEOL) method for polymer and biphenyl claddings
#1169Pillar formation for heat dissipation and isolation in vertical field effect transistors
#1170FinFET structures and methods of forming the same
#1171Semiconductor device and manufacturing method
#1172Curable polymeric materials and their use for fabricating electronic devices
#1173Method of cyclic dry etching using etchant film
#1174Threshold voltage and well implantation method for semiconductor devices
#1175Methods for forming patterns in honeycomb array
#1176Method of patterning a film layer
#1177Method of forming patterns
#1178Method of patterning a material layer
#1179Semiconductor device structure comprising a plurality of metal oxide fibers and method for forming the same
#1180Semiconductor device with diffusion barrier film and method of manufacturing the same
#1181Curable polymeric materials and their use for fabricating electronic devices
#1182Method of forming line pattern
#1183Copper interconnect
#1184Opening structure and manufacturing method thereof and interconnection structure
#1185Fast process flow, on-wafer interconnection and singulation for MEPV
#1186Fin field effect transistor (FinFET) device structure
#1187Method for fabricating memory device
#1188Single walled carbon nanotube triode
#1189T-shaped single diffusion barrier with single mask approach process flow
#1190Ink-based layer fabrication using halftoning to control thickness
#1191Three dimensional NAND devices with air gap or low-k core
#1192Methods and structures for back end of line integration