Process for forming an anti-oxidant metal layer on an electronic device

Testing of semiconductor chips with microbumps

Semiconductor chip and fabricating method thereof

MEMS and protection structure thereof

PRINTED CIRCUIT BOARD AND FLIP CHIP PACKAGE USING THE SAME WITH IMPROVED BUMP JOINT RELIABILITY

Chip package and fabrication method thereof

BUMP AND SEMICONDUCTOR DEVICE HAVING THE SAME

Stacked package including spacers and method of manufacturing the same

Semiconductor chip package structure, semiconductor chip and semiconductor chip group

Lateral Power MOSFET With Integrated Schottky Diode

Semiconductor-on-insulator with back side strain inducing material

METHOD OF FORMING UNDERBUMP METALLURGY STRUCTURE EMPLOYING SPUTTER-DEPOSITED NICKEL COPPER ALLOY

IC device having low resistance TSV comprising ground connection

WAFER-LEVEL CHIP SCALE PACKAGING OF METAL-OXIDE-SEMICONDUCTOR FIELD-EFFECT-TRANSISTORS (MOSFET'S)

Semiconductor module having deflecting conductive layer over a spacer structure

METHOD OF MANUFACTURING ELECTRONIC DEVICE, ELECTRONIC DEVICE, AND APPARATUS FOR MANUFACTURING ELECTRONIC DEVICE

Semiconductor device, method for manufacturing the same, and data processing device

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SEMICONDUCTOR DEVICE

Silicon-based thin substrate and packaging schemes

Semiconductor device having a vertical interconnect structure using stud bumps

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

Interconnection structure

Elongated bump structure for semiconductor devices

Extended under-bump metal layer for blocking alpha particles in a semiconductor device

Integrated microelectronic package temperature sensor

Chip package structure with ENIG plating

Implementing multiple different types of dies for memory stacking

Method of making ferroelectric memory device with barrier layer and novolac resin passivation layer

IC device having low resistance TSV comprising ground connection

Semiconductor packages and methods of packaging semiconductor devices

Circuit substrate and method of manufacturing same

3D integrated circuit structure and method for manufacturing the same

Chip package and method for forming the same

Multichip Packages

Semiconductor device, method of manufacturing semiconductor device, and electronic device

CUSTOMIZED RF MEMS CAPACITOR ARRAY USING REDISTRIBUTION LAYER

Semiconductor device including a stack of semiconductor chips, underfill material and molding material

3D integration method using SOI substrates and structures produced thereby

Electronic system with expansion feature

Method of making glass core substrate for integrated circuit devices

Area efficient through-hole connections

METHOD FOR PACKAGING WAFER

Method for connecting substrate and method for manufacturing semiconductor device

Injection molding system and method of chip package

Semiconductor device and method of forming B-stage conductive polymer over contact pads of semiconductor die in Fo-WLCSP

Packaged semiconductor device for high performance memory and logic

Direct edge connection for multi-chip integrated circuits

Layered chip package and method of manufacturing the same

Semiconductor device and method of forming a fan-out structure with integrated passive device and discrete component

Hybrid bonding techniques for multi-layer semiconductor stacks

Semiconductor package and method for fabricating the same

Forming semiconductor chip connections

Semiconductor chip module, semiconductor package having the same and package module

Structures for improving current carrying capability of interconnects and methods of fabricating the same

Thermally enhanced semiconductor package system

DIRECT THROUGH VIA WAFER LEVEL FANOUT PACKAGE

Using backside passive elements for multilevel 3D wafers alignment applications

Semiconductor device and stacked semiconductor device

DEVICE ALLOWING SUPPRESSION OF STRESS ON CHIP

Accurate alignment for stacked substrates

Method for forming chip package

Method for bonding of chips on wafers

Method of manufacturing semiconductor device

Method of room temperature covalent bonding

DRAM device with built-in self-test circuitry

Method of making an electronic device having a liquid crystal polymer solder mask laminated to an interconnect layer stack and related devices

Shared Electrostatic Discharge Protection For Integrated Circuits, Integrated Circuit Assemblies And Methods For Protecting Input/Output Circuits

Patternable adhesive composition, semiconductor package using the same, and method of manufacturing semiconductor package

PACKAGE STRUCTURE, PACKAGING SUBSTRATE AND CHIP

Method of forming vertically offset bond on trace interconnects on recessed and raised bond fingers

Semiconductor Device and Method of Forming Bond Wires and Stud Bumps in Recessed Region of Peripheral Area around the Device for Electrical Interconnection to Other Devices

Packaging substrate with conductive structure

Materials, structures and methods for microelectronic packaging

METHOD OF PREPARING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DIE FOR SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE PACKAGE WITH TWO COMPONENT LEAD FRAME

Semiconductor device and method of stacking die on leadframe electrically connected by conductive pillars

Chip package and method for forming the same

Apparatus and methods for constructing semiconductor chip packages with silicon space transformer carriers

LED with remote phosphor layer and reflective submount

Multilayer pillar for reduced stress interconnect and method of making same

Increasing dielectric strength by optimizing dummy metal distribution

Dummy metal design for packaging structures

Method of forming metal pillar

Chip Scale Package structure with can attachment

METHOD FOR FORMING AN OVER PAD METALIZATION (OPM) ON A BOND PAD

Semiconductor package

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Warpage control features on the bottomside of TSV die lateral to protruding bottomside tips

Semiconductor device and method of forming no-flow underfill material around vertical interconnect structure

Semiconductor device and method of forming conductive pillars in recessed region of peripheral area around the device for electrical interconnection to other devices

Semiconductor device and method for manufacturing the same

Semiconductor package with through silicon vias and method for making the same

Achieving mechanical and thermal stability in a multi-chip package

Semiconductor device and method of forming IPD on molded substrate

Semiconductor device

Semiconductor Package with Reduced On-Resistance and Top Metal Spreading Resistance with Application to Power Transistor Packaging

Methods for forming conductive elements and vias on substrates

Wiring board and method of producing the same

Continuously referencing signals over multiple layers in laminate packages

Integrated circuit chip and fabrication method

Method of manufacturing semiconductor device

Method of forming adaptive interconnect structure having programmable contacts

Stacked semiconductor device and method of manufacturing the same

Multi chip package

Semiconductor device having a copper plug

Copper pillar full metal via electrical circuit structure

Methods and designs for localized wafer thinning

PLASMA TREATMENT ON SEMICONDUCTOR WAFERS

Apparatus and method of applying a film to a semiconductor wafer and method of processing a semiconductor wafer

Chip package and method for forming the same

FLIP CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME

MULTI-CHIP STACK PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF

Flip chip device having simplified routing

Wafer level molding structure

Carbon nanotube structures for enhancement of thermal dissipation from semiconductor modules

Methods and Structures Involving Terminal Connections

Semiconductor package with a metal post and manufacturing method thereof

Power semiconductor device package method

Method of manufacturing semiconductor device including plural semiconductor chips stacked together

Vacuum wafer level packaging method for micro electro mechanical system device

Stacked device identification assignment

Semiconductor device and assembling method thereof

Method for producing vias in fan-out wafers using dry film and conductive paste, and a corresponding semiconductor package

BALL GRID ARRAY METHOD AND STRUCTURE

Substrate with embedded stacked through-silicon via die

Three-dimensional system-in-package package-on-package structure

LIGHT EMITTING DEVICE

LIGHT EMITTING DEVICE

Method and apparatus of fabricating a pad structure for a semiconductor device

Method of forming a ring-shaped metal structure

Method of forming semiconductor device

Solder paste, joining method using the same and joined structure

Enhanced stacked microelectronic assemblies with central contacts

Thermosetting encapsulation adhesive sheet

Semiconductor device with thin profile WLCSP with vertical interconnect over package footprint

Microelectronic package and method of manufacturing same

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Semiconductor devices and methods of manufacturing semiconductor devices

Semiconductor device and method of forming the same

Integrated circuit having a three dimensional stack package structure

Method of fabricating a TSV for 3D packaging of semiconductor device

Simultaneous wafer bonding and interconnect joining

Light emitting semiconductor element bonded to a base by a silver coating

Method of assembling two integrated circuits and corresponding structure

Semiconductor device with thin profile WLCSP with vertical interconnect over package footprint

Package structure

Package structure

Localized alloying for improved bond reliability

Semiconductor device and method of manufacturing semiconductor device

Bump structure and manufacturing method thereof

Method for chip scale package and package structure thereof

IC device having electromigration resistant feed line structures

Metallic thermal joint for high power density chips

Double-Sided Semiconductor Device and Method of Forming Top-Side and Bottom-Side Interconnect Structures

Self-organizing network with chip package having multiple interconnection configurations

Tuning the efficiency in the transmission of radio-frequency signals using micro-bumps

LIGHT EMITTING DEVICE

Method for manufacturing printed wiring board

Electronic assemblies including mechanically secured protruding bonding conductor joints

Method for manufacturing heat dissipation bulk of semiconductor device

Integrated circuit package connected to a data transmission medium

Semiconductor device and method of manufacturing the same

Integrated circuit packaging system with bump conductors and method of manufacture thereof

Semiconductor wiring patterns

Semiconductor device and method of manufacture thereof

Integrated circuit chip and fabrication method

Wafer-level interconnect for high mechanical reliability applications

BONDING PAD STRUCTURE AND INTEGRATED CIRCUIT COMPRISING A PLURALITY OF BONDING PAD STRUCTURES

Solder bump connections

Semiconductor device including a DC-DC converter with schottky barrier diode

Compliant interconnects in wafers

Packaging substrate having through-holed interposer embedded therein and fabrication method thereof

Stacked structure and stacked method for three-dimensional chip

Semiconductor device and method of forming an inductor within interconnect layer vertically separated from semiconductor die

Semiconductor device and method of forming recesses in substrate for same size or different sized die with vertical integration

Manufacturing of a camera module

Chip package and method for forming the same

Chip package and method for forming the same

Wafer-scale X-ray detector and method of manufacturing the same

Blister package with integrated electronic tag and method of manufacture

Wiring board and electronic component device

Methods of manufacturing a semiconductor device

Method of fabricating oxide material layer with openings attached to device layers

Aluminum enhanced palladium CMP process

Method of Avoiding Resin Outflow from the Wafer Scribe line in WLCSP

Integrated circuits secure from invasion and methods of manufacturing the same

Bonding structure of semiconductor package, method for fabricating the same, and stack-type semiconductor package

Stacked microelectronic assembly with TSVs formed in stages with plural active chips

Offset solder vias, methods of manufacturing and design structures

SEMICONDUCTOR CHIP AND SEMICONDUCTOR DEVICE USING THE CHIP

Semiconductor device and a method of manufacturing the same

Semiconductor structure with conductive plug in an oxide layer

Semiconductor device with stacked power converter

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Stacked microelectronic assemby with TSVS formed in stages and carrier above chip

Multi-chip package

METHOD OF MANUFACTURING ELECTRONIC COMPONENT EMBEDDED CIRCUIT BOARD

Mechanisms for resistivity measurement of bump structures

Semiconductor device having semiconductor substrate electrode pads, and external electrodes

Surface mount semiconductor device

SEMICONDUCTOR STRUCTURE AND PROCESS THEREOF

MOUNTING STRUCTURE OF CHIP AND MODULE USING THE SAME

Package having ESD and EMI preventing functions and fabrication method thereof

TSV SUBSTRATE STRUCTURE AND THE STACKED ASSEMBLY THEREOF

Semiconductor device comprising a capacitor and an electrical connection via and fabrication method

Through silicon via for use in integrated circuit chips

STRUCTURES AND METHODS FOR IMPROVING SOLDER BUMP CONNECTIONS IN SEMICONDUCTOR DEVICES

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Semiconductor packages and methods of manufacturing the same

METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE MANUFACTURED USING THE SAME

Method of making stackable semiconductor assembly with bump/base/flange heat spreader and build-up circuitry

Method of making stackable semiconductor assembly with bump/flange heat spreader and dual build-up circuitry

4D Device, process and structure

Method and apparatus for sharing internal power supplies in integrated circuit devices

Integrated circuit package strip with stiffener

CYLINDRICAL PACKAGES, ELECTRONIC APPARATUS INCLUDING THE SAME, AND METHODS OF FABRICATING THE SAME

Semiconductor Device with Cross-shaped Bumps and Test Pads Alignment

SEMICONDUCTOR PACKAGE

Semiconductor device and method of forming base substrate with recesses for capturing bumped semiconductor die

Semiconductor chip including a chip via plug penetrating a substrate, a semiconductor stack, a semiconductor device package and an electronic apparatus including the semiconductor chip

Semiconductor device having conductive vias and semiconductor package having semiconductor device

Semiconductor device and semiconductor package having the same

Contact Array for Substrate Contacting

Wafer level chip package and a method of fabricating thereof

Solder interconnect pads with current spreading layers

Semiconductor device including chip with complementary I/O cells

STACKABLE SEMICONDUCTOR ASSEMBLY WITH BUMP/BASE/FLANGE HEAT SPREADER AND ELECTROMAGNETIC SHIELDING

THERMALLY ENHANCED SEMICONDUCTOR ASSEMBLY WITH BUMP/BASE/FLANGE HEAT SPREADER AND BUILD-UP CIRCUITRY

Integrated circuit package and physical layer interface arrangement

SEMICONDUCTOR SUBSTRATE AND METHOD THEREOF

Stackable semiconductor assembly with bump/flange heat spreader and dual build-up circuitry

Electronic devices

Semiconductor device and method of forming passive devices

Semiconductor package

METHOD FOR MANUFACTURING SEMICONDUCTOR CHIPS, MOUNTING METHOD AND SEMICONDUCTOR CHIP FOR VERTICAL MOUNTING ONTO CIRCUIT SUBSTRATES

PACKAGE CARRIER

Wiring structure for improving crown-like defect and fabrication method thereof

Solder mold plates used in packaging process and method of manufacturing solder mold plates

METAL LAYER FORMATION METHOD FOR DIODE CHIPS/WAFERS

Method Of Manufacturing Semiconductor Package Board

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Semiconductor device and method of forming interposer frame electrically connected to embedded semiconductor die

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Stacked integrated circuit package having recessed sidewalls

Semiconductor packages and methods of packaging semiconductor devices

SEMICONDUCTOR CHIPS AND METHODS OF FORMING THE SAME

Through silicon via with improved reliability

Wafer level semiconductor package and manufacturing methods thereof

Conductive pads defined by embedded traces

Adding cap to copper passivation flow for electroless plating

Grain refinement by precipitate formation in Pb-free alloys of tin

Ni plating of a BLM edge for Pb-free C4 undercut control

Semiconductor device and method of forming overlapping semiconductor die with coplanar vertical interconnect structure

Bump structure including nano-wires and a body connecting ends of the nano-wires, semiconductor package having the bump structure and method of manufacturing the semiconductor package

SEMICONDUCTOR APPARATUS

Semiconductor device

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH DEVICE MOUNT AND METHOD OF MANUFACTURE THEREOF

Semiconductor device and method of manufacturing semiconductor device

Method of forming top electrode for capacitor and interconnection in integrated passive device (IPD)

Wafer level packaging

METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE HAVING A REFRACTORY METAL CONTAINING FILM

Semiconductor device manufacturing method and semiconductor device

Method and apparatus for supporting a computer chip on a printed circuit board assembly

Light emitting device with electrode having recessed concave portion

Semiconductor devices and methods of manufacturing the same

Semiconductor device and method of forming stepped interconnect layer for stacked semiconductor die

Electroplated posts with reduced topography and stress

SEMICONDUCTOR DEVICE AND STACKED SEMICONDUCTOR PACKAGE

Bonding process and bonded structures

Semiconductor device and method of forming prefabricated EMI shielding frame with cavities containing penetrable material over semiconductor die

Semiconductor device and method of forming prefabricated EMI shielding frame with cavities containing penetrable material over semiconductor die

Seal ring in an integrated circuit die

Reducing formation of oxide on solder

Electronic element unit and reinforcing adhesive agent

MANUFACTURING PROCESS OF SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

Method of Fabricating Semiconductor Device

Stacked microelectronic devices and methods for manufacturing stacked microelectronic devices

Electrode connection structure of semiconductor chip, conductive member, and semiconductor device and method for manufacturing the same

Electronic component and electronic device

Semiconductor module

Interposer for semiconductor package

Semiconductor packages

Semiconductor device and method of stacking semiconductor die in mold laser package interconnected by bumps and conductive vias

Semiconductor device and method of forming stepped interposer for stacking and electrically connecting semiconductor die

Wafer level package having a stress relief spacer and manufacturing method thereof

BALL GRID ARRAY SEMICONDUCTOR DEVICE AND ITS MANUFACTURE

Crack arrest vias for IC devices

Interconnect assemblies and methods of making and using same

Semiconductor device and method of forming wafer level ground plane and power ring

Structure, semiconductor structure and method of manufacturing a semiconductor structure and packaging thereof

Flip chip bump array with superior signal performance

Grounded seal ring structure in semiconductor devices

Semiconductor device and method of forming penetrable film encapsulant around semiconductor die and interconnect structure

Substrateless power device packages

Integrated circuit package system with encapsulation lock

Integrated antennas in wafer level package

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Semiconductor device and method for manufacturing semiconductor device

Semiconductor device and method of forming stepped interconnect layer for stacked semiconductor die