Die stacking with an annular via having a recessed socket

INTEGRATED CIRCUIT CARRIER ASSEMBLY

Method of manufacture of integrated circuit packaging system with multi-tier conductive interconnects

Semiconductor device and automotive ac generator

Pin-type chip tooling

Distributed semiconductor device methods, apparatus, and systems

CIRCUIT BOARD WITH ANCHORED UNDERFILL

Method of sensing magnitude of current through semiconductor power device

ELECTRONIC DEVICE AND MANUFACTURING METHOD OF ELECTRONIC DEVICE

Semiconductor device having a semiconductor element buried in an insulating layer and method of manufacturing the same

Methods of forming semiconductor chip underfill anchors

Process for fabricating electronic components using liquid injection molding

QUAD FLAT NON-LEADED SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

Semiconductor device and method of forming vertically offset bond on trace interconnects on different height traces

Semiconductor device and method of forming conductive vias through interconnect structures and encapsulant of WLCSP

Semiconductor device and method of forming insulating layer around semiconductor die

Semiconductor devices and methods for forming patterned radiation blocking on a semiconductor device

ELECTRODE PORTION STRUCTURE

Wiring substrate and method of manufacturing the same

Carrier system with multi-tier conductive posts and method of manufacture thereof

Method for singulating electronic components from a substrate

INKS AND PASTES FOR SOLAR CELL FABRICATON

Semiconductor device

SEMICONDUCTOR ELEMENT-EMBEDDED WIRING SUBSTRATE

Method for fabricating circuit component

Through Silicon via Bridge Interconnect

METHOD FOR FORMING A DOUBLE EMBOSSING STRUCTURE

MULTI-CHIP INTEGRATED CIRCUIT

Semiconductor package with embedded die and its methods of fabrication

Stacked semiconductor chips with separate encapsulations

Chip package and method for fabricating the same

Multichip semiconductor device, chip therefor and method of formation thereof

Stacked semiconductor package having discrete components

Manufacturing method of a bump structure having a reinforcement member

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE

Semiconductor device with copper wirebond sites and methods of making same

SEMICONDUCTOR POWER DEVICE HAVING A STACKED DISCRETE INDUCTOR STRUCTURE

Rigid-backed, membrane-based chip tooling

Through-substrate via and redistribution layer with metal paste

Methods of forming a metal pattern and semiconductor device structure

Semiconductor device with hollow structure

SEMICONDUCTOR DEVICE HAVING BUCKET-SHAPED UNDER-BUMP METALLIZATION AND METHOD OF FORMING SAME

CHIP PACKAGE

Thermal vias in an integrated circuit package with an embedded die

Semiconductor chip and film and TAB package comprising the chip and film

Semiconductor substrate, package and device

Metal interconnect structure with a side wall spacer that protects an ARC layer and a bond pad from corrosion and method of forming the metal interconnect structure

Method of manufacturing semiconductor device

METHOD OF PRODUCING ELECTRICAL COMPONENT, ELECTRICAL COMPONENT PRODUCTION DEVICE, AND PHOTOSENSITIVE RESIST

Optical interconnect device and method for manufacturing the same

Integrated chip package structure using organic substrate and method of manufacturing the same

Double-face heat removal of vertically integrated chip-stacks utilizing combined symmetric silicon carrier fluid cavity and micro-channel cold plate

Circuit component with conductive layer structure

IC die including RDL capture pads with notch having bonding connectors or its UBM pad over the notch

System and Method for Improving Reliability of Integrated Circuit Packages

Chip structure

Semiconductor device and method of forming IPD in fan-out level chip scale package

SEMICONDUCTOR DEVICE AND ELECTRONIC APPARATUS

Semiconductor Device and Method of Forming 3D Inductor from Prefabricated Pillar Frame

Semiconductor device and penetrating electrode testing method

Light-emitting device, light-emitting element and method of manufacturing same

Direct IMS (injection molded solder) without a mask for forming solder bumps on substrates

Method of making a semiconductor device having a conductive particle on an electric pad

METAL-EMBEDDED SUBSTRATE AND METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE USING THE SAME

Stress-reduced Ni-P/Pd stacks for bondable wafer surfaces

MOS transistor device in common source configuration

Method and apparatus providing integrated circuit having redistribution layer with recessed connectors

Solder alloy and semiconductor device

Wafer level chip scale package without an encapsulated via

Method of fabricating a conductive post on an electrode

Wafer-level packaged device having self-assembled resilient leads

Semiconductor device and method of patterning resin insulation layer on substrate of the same

Chip package and method for forming the same

Semiconductor package through-electrode suitable for a stacked semiconductor package and semiconductor package having the same

III-nitride power device with solderable front metal

Semiconductor chip with a bonding pad having contact and test areas

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Solder bump structure for flip chip semiconductor devices and method of manufacturing therefore

FLIP-CHIP ASSEMBLY WITH ORGANIC CHIP CARRIER HAVING MUSHROOM-PLATED SOLDER RESIST OPENING

Memory dies, stacked memories, memory devices and methods

Polymer matrices for polymer solder hybrid materials

Conductive pillar structure for semiconductor substrate and method of manufacture

Microelectronic devices with through-substrate interconnects and associated methods of manufacturing

SEMICONDUCTOR DEVICE, CHIP-ON-CHIP MOUNTING STRUCTURE, METHOD OF MANUFACTURING THE SEMICONDUCTOR DEVICE, AND METHOD OF FORMING THE CHIP-ON-CHIP MOUNTING STRUCTURE

Semiconductor module, method for fabricating the semiconductor module, and mobile apparatus

Pillar structure having a non-planar surface for semiconductor devices

Solder interconnect with non-wettable sidewall pillars and methods of manufacture

Manufacturing of a device including a semiconductor chip

Package structure

Semiconductor package having improved heat spreading performance

Stacked semiconductor package

Systems and Methods Providing Arrangements of Vias

Surface Preparation of Die for Improved Bonding Strength

Electromigration immune through-substrate vias

Semiconductor memory devices and semiconductor packages

Method and apparatus for interconnect layout in an integrated circuit

Method to form solder deposits on substrates

Semiconductor device and method of forming cavity adjacent to sensitive region of semiconductor die using wafer-level underfill material

Package assembly including a semiconductor substrate in which a first portion of a surface of the semiconductor substrate is recessed relative to a second portion of the surface of the semiconductor substrate to form a recessed region in the semiconductor substrate

Solder bump interconnect

Semiconductor module and portable apparatus provided with semiconductor module

Recessed semiconductor substrates and associated techniques

Stress buffer structures in a mounting structure of a semiconductor device

STACK PACKAGE

Method of forming thin profile WLCSP with vertical interconnect over package footprint

High frequency flip chip package structure of polymer substrate

TECHNIQUES AND CONFIGURATIONS FOR RECESSED SEMICONDUCTOR SUBSTRATES

SEMICONDUCTOR DEVICE WITH A VARIABLE INTEGRATED CIRCUIT CHIP BUMP PITCH

Electronic device and manufacturing method of the same

Dual carrier for joining IC die or wafers to TSV wafers

ELECTRONIC CIRCUIT DEVICE, METHOD FOR MANUFACTURING THE SAME, AND DISPLAY DEVICE

Semiconductor device structures and electronic devices including same hybrid conductive vias

Etched recess package on package system

Encapsulation, MEMS and encapsulation method

Method for encapsulating an MEMS component

Polishing solution for CMP, and method for polishing substrate using the polishing solution for CMP

PACKAGING BOARD AND MANUFACTURING METHOD THEREFOR, SEMICONDUCTOR MODULE AND MANUFACTURING METHOD THEREFOR, AND PORTABLE DEVICE

Stable Gold Bump Solder Connections

Semiconductor device

Precision high-frequency capacitor formed on semiconductor substrate

Semiconductor device and manufacturing method thereof

Chip package and method for fabricating the same

Method of forming an EM protected semiconductor die

Stacked semiconductor components having conductive interconnects

SEMICONDUCTOR PACKAGE

Chip package and fabrication method thereof

Semiconductor device having conductive pads and a method of manufacturing the same

Integrated void fill for through silicon via

3D chip stack having encapsulated chip-in-chip

METHOD OF FORMING AN EM PROTECTED SEMICONDUCTOR DIE

Semiconductor assemblies and methods of manufacturing such assemblies including trench and channel intersects with through-hole in the mold material

Method of manufacturing an interconnect structure for a semiconductor device

Semiconductor device manufacturing method

Reworkable electronic device assembly and method

CHIP PACKAGE AND FABRICATION METHOD THEREOF

4D device process and structure

Dual Interconnection in Stacked Memory and Controller Module

Grid array connection device and method

Semiconductor device sealed in a resin section and method for manufacturing the same

REAL TIME MONITORING OF INDIUM BUMP REFLOW AND OXIDE REMOVAL ENABLING OPTIMIZATION OF INDIUM BUMP MORPHOLOGY

Chip package and fabrication method thereof

Solder Pillars in Flip Chip Assembly

Semiconductor package and manufacturing method thereof and encapsulating method thereof

Microelectronic devices

Semiconductor package with single sided substrate design and manufacturing methods thereof

Chip package structure and package substrate

Chip package and fabrication method thereof

Wireless Communication Device for Remote Authenticity Verification of Semiconductor Chips, Multi-Chip Modules and Derivative Products

Light emitting diode with high aspect ratio submicron roughness for light extraction and methods of forming

Plating method, semiconductor device fabrication method and circuit board fabrication method

Bond pad connection to redistribution lines having tapered profiles

Power integrity circuits with EMI benefits

Electroless plating of porous and non-porous nickel layers, and gold layer in semiconductor device

Semiconductor device and method for manufacturing the same

Electronic packages with fine particle wetting and non-wetting zones

Wiring board, semiconductor device and method for manufacturing the same

Semiconductor device and method of manufacturing the same

Dice Rearrangement Package Structure Using Layout Process to Form a Compliant Configuration

Semiconductor device

Germanium film optical device

Wafer level stack die package

High voltage devices and methods of forming the high voltage devices

ELECTRICALLY-CONDUCTIVE FOAM EMI SHIELD

Method for making a stackable package

Fan-out wafer level package with polymeric layer for high reliability

Semiconductor Process, Semiconductor Element and Package Having Semiconductor Element

Semiconductor element and package having semiconductor element

Electromigration-resistant under-bump metallization of nickel-iron alloys for Sn-rich solder bumps in Pb-free flip-clip

Micro-bump structure

Flip-chip fan-out wafer level package for package-on-package applications, and method of manufacture

Semiconductor device and method for manufacturing the same

RELIABLE LARGE DIE FAN-OUT WAFER LEVEL PACKAGE AND METHOD OF MANUFACTURE

Semiconductor package having chip using copper process

Fan-out chip scale package

Stack package

Semiconductor memory device, semiconductor package and system having stack-structured semiconductor chips

Chip package

Multilayer wiring board having lands with tapered side surfaces

Method for fabricating electrical bonding pads on a wafer

Manufacturing method of semiconductor device

Fabrication method for semiconductor device

Method for assembling at least one chip with a wire element, electronic chip with a deformable link element, fabrication method of a plurality of chips, and assembly of at least one chip with a wire element

Systems employing a stacked semiconductor package

METALLIZATION LAYER STRUCTURE FOR FLIP CHIP PACKAGE

Wafer-level stack package and method of fabricating the same

Semiconductor apparatus having a high-aspect penetrating electrode and manufacturing method thereof

Multiple surface finishes for microelectronic package substrates

Contact-based encapsulation

Semiconductor device and method for fabricating the same

Semiconductor Device and Method of Forming the Device Using Sacrificial Carrier

Structures and methods to reduce maximum current density in a solder ball

Integrated circuit package with embedded components

Combined power mesh transition and signal overpass/underpass

Stackable circuit structures and methods of fabrication thereof

Integrated circuit package system employing device stacking

METHOD OF VERTICALLY MOUNTING AN INTEGRATED CIRCUIT

OPTICAL DEVICE AND METHOD OF MANUFACTURING THE SAME

Display device utilizing conductive adhesive to electrically connect IC substrate to non-display region and manufacturing method of the same

Structure, electronic device, and method for fabricating a structure

Glass core substrate for integrated circuit devices and methods of making the same

Semiconductor processing methods

Production of TSV interconnection structures made up of an insulating contour and a conductive zone situated in the contour and disconnected from the contour

Method for low stress flip-chip assembly of fine-pitch semiconductor devices

Method of room temperature covalent bonding

Memory module and memory system

DETECTION CIRCUITRY FOR DETECTING BONDING CONDITIONS ON BOND PADS

Multilayer wiring substrate mounted with electronic component and method for manufacturing the same

Semiconductor device and electronic device

Substrate for electronic device, stack for electronic device, electronice device, and method for manufacturing the same

Ball grid array package enhanced with a thermal and electrical connector

Semiconductor mounting substrate and method for manufacturing the same

Semiconductor device and method for manufacturing the same

Semiconductor device and manufacturing method thereof

Panel based lead frame packaging method and device

Semiconductor device and manufacturing method thereof

Integrated circuit packaging system with shielded package and method of manufacture thereof

Integrated circuit with pads connected by an under-bump metallization and method for production thereof

Lateral Power MOSFET With Integrated Schottky Diode

Heat conduction for chip stacks and 3-D circuits

Bonding structure and method for manufacturing same

Method for inhibiting growth of nickel-copper-tin intermetallic layer in solder joints

Integrated circuit package with multiple dies and interrupt processing

Semiconductor Device with Improved Contacts

Method for manufacturing semiconductor device

CONNECTION STRUCTURE FOR CHIP-ON-GLASS DRIVER IC AND CONNECTION METHOD THEREFOR

Conductor bump method and apparatus

AREA REDUCTION FOR SURFACE MOUNT PACKAGE CHIPS

Microelectronic devices including conductive vias, conductive caps and variable thickness insulating layers

Interface structure for copper-copper peeling integrity

Multi-chip stacked package and its mother chip to save interposer

Semiconductor device

Method of manufacturing a circuit board

Manufacturing method of a tray, a socket for inspection, and a semiconductor device

Integrated circuit packaging system with embedded circuitry and post

Solder structure, method for forming the solder structure, and semiconductor module including the solder structure

Semiconductor Device and Method of Forming Bump Structure with Multi-Layer UBM Around Bump Formation Area

Semiconductor-device mounted board and method of manufacturing the same

Semiconductor device and method for making the same

Packaged device and method of manufacturing the same

Heat transfer device in a rotating structure

First-level interconnects with slender columns, and processes of forming same

EPOXY RESIN FORMULATIONS FOR UNDERFILL APPLICATIONS

Semiconductor chip and semiconductor package including the same

Semiconductor device having vertically offset bond on trace interconnects on recessed and raised bond fingers

Semiconductor device and method of forming compliant stress relief buffer around large array WLCSP

EXTENDED UNDER-BUMP METAL LAYER FOR BLOCKING ALPHA PARTICLES IN A SEMICONDUCTOR DEVICE

Semiconductor chip and stacked semiconductor package having the same

Semiconductor device with improved ESD protection

Semiconductor device and structure

Structure for bumped wafer test

Method for releasing a microelectronic assembly from a carrier substrate

Methods for forming semiconductor device structures

Apparatus and method for processing a substrate

Fiducial scheme adapted for stacked integrated circuits

SEMICONDUCTOR DEVICE

Area efficient through-hole connections

Semiconductor device and method of manufacturing same

Lead-free solder connection structure and solder ball

Configurable interposer

Semiconductor device having multi-layered wiring layer and fabrication process thereof

Bumping free flip chip process

WAFER BUMPING USING PRINTED UNDER BUMP METALIZATION

Pad structure for semiconductor devices

ELECTRONIC DEVICE INCLUDING A PACKAGING SUBSTRATE AND AN ELECTRICAL CONDUCTOR WITHIN A VIA AND A PROCESS OF FORMING THE SAME

Semiconductor device and method of forming IPD on molded substrate

Compliant bonding structures for semiconductor devices

Mounting structure, and method of manufacturing mounting structure

Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methods

Integrated-circuit package for proximity communication

Solid-state imaging device, its production method, camera with the solid-state imaging device, and light receiving chip

Via structures and semiconductor devices having the via structures

Circuit board and chip package structure

Integrated Circuit

Redistribution layer enhancement to improve reliability of wafer level packaging

Stable gold bump solder connections

Package structure and manufacturing method thereof

Chip package structure and method for fabricating the same

Semiconductor flip chip package having substantially non-collapsible spacer and method of manufacture thereof

Method of fabricating backside-illuminated image sensor

Wafer level chip scale package and process of manufacture

Smart card module with flip-chip-mounted semiconductor chip

Method of making substrate package with through holes for high speed I/O flex cable

Semiconductor devices having redistribution structures and packages, and methods of forming the same

Semiconductor element and method of manufacturing the same

Manufacturing method of semiconductor package

Method of manufacturing a semiconductor device having a heat spreader

Light emitting device including a sealing portion, and method of making the same

Lead pin and wiring substrate with lead pin, and method of manufacturing the same

Clocking architecture in stacked and bonded dice

Integrated chip carrier with compliant interconnects

Semiconductor device including bottom surface wiring and manfacturing method of the semiconductor device

Mechanisms for forming copper pillar bumps

Copper bump joint structures with improved crack resistance

Semiconductor device with trench-like feed-throughs

PILLAR BUMP WITH BARRIER LAYER

Multichip semiconductor device, chip therefor and method of formation thereof

Post passivation interconnect with oxidation prevention layer

Semiconductor die contact structure and method

Robust joint structure for flip-chip bonding

Microelectronic package and method of manufacturing same