209543 ⎘
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by; Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto; Bonding areas; Manufacturing methods related thereto; Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area; External layer Material
Chip package thermal interface materials with dielectric obstructions for body-biasing, methods of using same, and systems containing same
#4502Integrated capacitors in package-level structures, processes of making same, and systems containing same
#4503Electronic circuit package
#4504Multi-chip package system
#4505Circuit board and electronic assembly
#4506Semiconductor package
#4507Semiconductor device
#4508Semiconductor device
#4509Manufacturing method for semiconductor device and semiconductor device
#4510Article having metal impregnated within carbon nanotube array
#4511Semiconductor multi-package module having package stacked over ball grid array package and having wire bond interconnect between stacked packages
#4512Electronic device and method of manufacturing the same, circuit board, and electronic instrument
#4513Wafer-level processing of chip-packaging compositions including bis-maleimides
#4514Electronic component assemblies with electrically conductive bonds
#4515Chip package dielectric sheet for body-biasing
#4516Stacked-type chip package structure
#4517Chip-packaging compositions including bis-maleimides, packages made therewith, and methods of assembling same
#4518Electrical ground method for ball stack package
#4519Multichip leadframe package
#4520Array capacitors for broadband decoupling applications
#4521Electronic part mounting method
#4522Electrical connection methods employing corresponding, insulator-coated members of interconnection elements
#4523Methods for fabricating reinforced, self-aligning conductive structures for semiconductor device components
#4524Semiconductor package having improved thermal performance
#4525Vertical power semiconductor component, semiconductor device and methods for the production thereof
#4526Semiconductor device
#4527Sequential fabrication of vertical conductive interconnects in capped chips
#4528Packaged chip having features for improved signal transmission on the package
#4529Techniques for packaging multiple device components
#4530Hermetically sealed integrated circuits and method
#4531Package having exposed integrated circuit device
#4532STACK TYPE SURFACE ACOUSTIC WAVE PACKAGE, AND METHOD FOR MANUFACTURING THE SAME
#4533Optimized contact design for thermosonic bonding of flip-chip devices
#4534METHOD FOR MANUFACTURING WIRING BOARD
#4535Wire bonding system and method of use
#4536Heat spreader and package structure utilizing the same
#4537Device package
#4538HEAT FIXTURE FOR WIRE BONDING
#4539Multi-strand substrate for ball-grid array assemblies and method
#4540Method for fabricating semiconductor component with adjustment circuit for adjusting physical or electrical characteristics of substrate conductors
#4541Combination quad flat no-lead and thin small outline package
#4542Space-efficient package for laterally conducting device
#4543FINE-SIZED CHIP PACKAGE STRUCTURE
#4544Electrical microfilament to circuit interface
#4545Chip package structure
#4546Relay board provided in semiconductor device, semiconductor device, and manufacturing method of semiconductor device
#4547System-in-package structure
#4548Semiconductor device
#4549Microelectronic devices having a curved surface and methods for manufacturing the same
#4550Printed circuit board
#4551Integrated circuit devices including compliant material under bond pads and methods of fabrication
#4552Stacked semiconductor device
#4553Power semiconductor component with semiconductor chip stack in a bridge circuit and method for producing the same
#4554High temperature package flip-chip bonding to ceramic
#4555Transferring die(s) from an intermediate surface to a substrate
#4556Microelectronic component assemblies having lead frames adapted to reduce package bow
#4557Bonding apparatus having adjacent hot-heads for liquid crystal display manufacture
#4558Semiconductor device and method of manufacturing the same
#4559Semiconductor device and method of manufacturing the same
#4560Semiconductor device with a wiring substrate and method for producing the same
#4561Semiconductor module and manufacturing method thereof
#4562Package substrate
#4563Stacked microelectronic packages having at least two stacked microelectronic elements adjacent one another
#4564Semiconductor device and IC card including supply voltage wiring lines formed in different areas and having different shapes
#4565Semiconductor device having high frequency components and manufacturing method thereof
#4566Circuit under pad structure and bonding pad process
#4567Camera module package
#4568Protection for an integrated circuit chip containing confidential data
#4569Built-in capacitor type wiring board and method for manufacturing the same
#4570Radio-frequency system in package including antenna
#4571Flip chip hermetic seal using pre-formed material
#4572Semiconductor device
#4573Semiconductor wafer, semiconductor device and method of manufacturing the same, circuit board, and electronic equipment
#4574Semiconductor packages having leadframe-based connection arrays
#4575Interposer and stacked chip package
#4576Semiconductor device
#4577Assembly jig and manufacturing method of multilayer semiconductor device
#4578Semiconductor/printed circuit board assembly, and computer system
#4579Method and apparatus that provides differential connections with improved ESD protection and routing
#4580Component mounting tool, and method and apparatus for mounting component using this tool
#4581Two-step high bottleneck type capillary for wire bonding device
#4582Power module
#4583Wiring board, electronic component mounting structure, and electronic component mounting method
#4584Methods for fabricating protective layers on semiconductor device components
#4585Apparatus incorporating small-feature-size and large-feature-size components and method for making same
#4586Interconnecting a port of a microwave circuit package and a microwave component mounted in the microwave circuit package
#4587Radio-frequency amplifier and radio-frequency wireless communication apparatus
#4588Semiconductor package structure and method of manufacture
#4589Integrated circuit package system with bump pad
#4590Flip-chip light emitting diode device without sub-mount
#4591Damascene patterning of barrier layer metal for C4 solder bumps
#4592PROCESSING METHOD FOR SEMICONDUCTOR STRUCTURE
#4593Method of forming a leaded molded array package
#4594Method of manufacturing a semiconductor device
#4595INTEGRATED CIRCUIT PACKAGE SYSTEM
#4596Reversible leadless package and methods of making and using same
#4597Semiconductor product and method for forming a semiconductor product
#4598Semiconductor device
#4599Semiconductor device and method for producing it, and use of an electrospinning method
#4600Semiconductor device and method for manufacturing the same
#4601Package and package module of the package
#4602Microelectronic connection component
#4603EMBEDDED SEMICONDUCTOR DEVICE SUBSTRATE AND PRODUCTION METHOD THEREOF
#4604Bump chip carrier semiconductor package system
#4605Low voltage drop and high thermal performance ball grid array package
#4606Method for fabricating semiconductor package
#4607Offset integrated circuit package-on-package stacking system
#4608Semiconductor wafer, panel and electronic component with stacked semiconductor chips, and also method for producing same
#4609Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor
#4610Chip stack package and manufacturing method thereof
#4611Semiconductor device and method of manufacturing the same
#4612SEMICONDUCTOR STRUCTURE
#4613Wire bonding method
#4614Electrical interconnection structure formation
#4615Small chips with fan-out leads
#4616Microelectronic devices and microelectronic support devices, and associated assemblies and methods
#4617Method of designing package for semiconductor device, layout design tool for performing the same, and method of manufacturing semiconductor device using the same
#4618Packaging methods
#4619Photosensitive composition
#4620Mm-wave antenna using conventional IC packaging
#4621Constant voltage diode
#4622Ball grid array (BGA) package and method thereof
#4623Semiconductor device, method of manufacturing a semiconductor device and substrate to be used to manufacture a semiconductor device
#4624Method for making stacked integrated circuits (ICs) using prepackaged parts
#4625IC card with bonding wire connections of different lengths
#4626IC card
#4627Lead arrangement and chip package using the same
#4628IC card
#4629CIRCUIT DEVICE AND METHOD OF MANUFACTURING THE SAME
#4630Methods and apparatus for Flip-Chip-On-Lead semiconductor package
#4631Ultrathin leadframe BGA circuit package
#4632Method of making stacked die package
#4633METHOD FOR REDUCING OR ELIMINATING SEMICONDUCTOR DEVICE WIRE SWEEP IN A MULTI-TIER BONDING DEVICE AND A DEVICE PRODUCED BY THE METHOD
#4634Electronic assembly having graded wire bonding
#4635Optimal stacked die organization
#4636Printed wiring board
#4637Semiconductor device and manufacturing method thereof
#4638Semiconductor chip with post-passivation scheme formed over passivation layer
#4639Active device bases and leadframes utilizing the same
#4640Double-sided circuit board and multi-chip package including such a circuit board and method for manufacture
#4641Integrated circuit package system including high-density small footprint system-in-package
#4642Packaging for high speed integrated circuits
#4643Supporting frame for surface-mount diode package
#4644Light emitting diode package
#4645High frequency chip packages with connecting elements
#4646Method and apparatus for attaching a workpiece to a workpiece support
#4647Interposer and method for fabricating the same
#4648Semiconductor component of semiconductor chip size with flip-chip-like external contacts
#4649Semiconductor module including a plurality of IC chips therein
#4650Chip-packaging composition of resin and cycloaliphatic amine hardener
#4651Semiconductor device that attains a high integration
#4652Structure and method of molded QFN device suitable for miniaturization, multiple rows and stacking
#4653Semiconductor component and methods to produce a semiconductor component
#4654Integrated circuit mounting for thermal stress relief useable in a multi-chip module
#4655Circuit device and method of manufacturing the same
#4656Stacked die package with thermally conductive block embedded in substrate
#4657Housed DRAM chip for high-speed applications
#4658Production process for manufacturing such semiconductor package
#4659Thin package system with external terminals
#4660Electro-optical device, transferred chip, and transfer origin substrate
#4661SEMICONDUCTOR DEVICE
#4662Electronic Part Manufacturing Method
#4663Circuit board providing coplanarity of solders and high soldering reliability for semiconductor component
#4664Method of producing image display unit
#4665Substrate embedded with passive device
#4666CHIP PACKAGE METHOD
#4667Semiconductor chip package
#4668Method of improving power distribution in wirebond semiconductor packages
#4669Circuit board structure of integrated optoelectronic component
#4670Method for manufacturing semiconductor module using interconnection structure
#4671Printed wiring board
#4672FLIP CHIP PACKAGE
#4673Semiconductor device having a semiconductor chip, and method for the production thereof
#4674Stack structure of carrier board embedded with semiconductor components and method for fabricating the same
#4675Stacked-type chip package structure
#4676Power semiconductor module with overcurrent protective device
#4677Conductor substrate, semiconductor device and production method thereof
#4678Semiconductor device with semiconductor chip and adhesive film and method for producing the same
#4679Method for manufacturing liquid crystal display device
#4680Electronic component packaging structure and method for producing the same
#4681Connecting structure, printed substrate, circuit, circuit package and method of forming connecting structure
#4682Support structures for semiconductor devices
#4683Semiconductor chip having a bump with conductive particles and method of manufacturing the same
#4684Bump structure and its forming method
#4685Electronic apparatus
#4686Semiconductor module having a coupling substrate, and methods for its production
#4687Semiconductor package having an interfacial adhesive layer
#4688Wiring board, semiconductor device, and method of manufacturing the same
#4689Semiconductor device and a manufacturing method of the same
#4690Microelectronic packages and methods therefor
#4691Wiring board and capacitor
#4692Electronic device with conductive connection structure
#4693Interposer and electronic device fabrication method
#4694Method of forming a magnetic device having a conductive clip
#4695Relay board and semiconductor device having the relay board
#4696Semiconductor device
#4697Semiconductor device for radio frequency applications and method for making the same
#4698Optical device
#4699Method of forming a power module with a magnetic device having a conductive clip
#4700Method of assembly for multi-flip chip on lead frame on overmolded IC package
#4701Flash memory card
#4702Packaged die on PCB with heat sink encapsulant and methods
#4703Semiconductor sensor device with sensor chip and method for producing the same
#4704Semiconductor device with a plastic housing composition that includes filler particles and that at least partially embeds a semiconductor chip
#4705Chip stacking structure
#4706Integrated circuit solder bumping system
#4707Molded semiconductor package
#4708Insulated gate semiconductor device having a clamping element to clamp gate-emitter voltage and method of manufacturing thereof
#4709LSI design support apparatus and LSI design support method
#4710Electronic plug unit
#4711Semiconductor device and a method of manufacturing the same
#4712Substrate sheet material for a semiconductor device and a manufacturing method thereof, a molding method using a substrate sheet material, a manufacturing method of semiconductor devices
#4713Cooling system for a semiconductor device and method of fabricating same
#4714Ceramic capacitor
#4715Wire sweep resistant semiconductor package and manufacturing method therefor
#4716Chip package structure and bumping process
#4717Complete power management system implemented in a single surface mount package
#4718Complete power management system implemented in a single surface mount package
#4719QFN/SON compatible package with SMT land pads
#4720BGA package with stacked semiconductor chips and method of manufacturing the same
#4721Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
#4722Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
#4723Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
#4724Chip package structure and bumping process
#4725Method for producing bonding connection of semiconductor device
#4726Semiconductor apparatus integrating an electrical device under an electrode pad
#4727Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice
#4728Monitoring deformation and time to logically constrain a bonding process
#4729Selective consolidation methods for fabricating semiconductor device components and conductive features thereof
#4730INDUCTIVE STRUCTURE
#4731Light-receiving element, manufacturing method for the same, optical module, and optical transmitting device
#4732System in package (SIP) structure
#4733Multi-part lead frame with dissimilar materials
#4734Multi-part lead frame with dissimilar materials
#4735Electronic component embedded board and its manufacturing method
#4736Grooved substrates for uniform underfilling solder ball assembled electronic devices
#4737Multi-chip stack structure
#4738Carrier-free semiconductor package with stand-off member and fabrication method thereof
#4739Electronic circuit module and manufacturing method thereof
#4740Support with solder ball elements and a method for populating substrates with solder balls
#4741Electronic device and method of manufacturing thereof
#4742Electronic device and method of manufacturing same
#4743Multi-chip stacking package structure
#4744Semiconductor package with a conductive post and wiring pattern
#4745Die pad for semiconductor packages and methods of making and using same
#4746Light emitting diode and method for manufacturing the same
#4747Chip package structure and method for manufacturing bumps
#4748Semiconductor device and method of manufacturing the same
#4749Radiant energy heating for die attach
#4750Multi-chip package type semiconductor device
#4751Underfill compounds including electrically charged filler elements, microelectronic devices having underfill compounds including electrically charged filler elements, and methods of underfilling micoelectronic devices
#4752Semiconductor device integrated with opto-electric component and method for fabricating the same
#4753Semiconductor module
#4754Mounting Spring Elements on Semiconductor Devices, and Wafer-Level Testing Methodology
#4755Microelectronic devices having intermediate contacts for connection to interposer substrates, and associated methods of packaging microelectronic devices with intermediate contacts
#4756Pad open structure
#4757Board having electronic parts mounted by using under-fill material and method for producing the same
#4758Semiconductor device including a plurality of semiconductor chips stacked three-dimensionally, and method of manufacturing the same
#4759Semiconductor device, semiconductor package for use therein, and manufacturing method thereof
#4760Lead-containing solder bumps
#4761Lead-containing solder paste
#4762Lead-containing anodes
#4763Chip package structure
#4764Backside ground type flip chip semiconductor package
#4765Microfeature workpiece substrates having through-substrate vias, and associated methods of formation
#4766Wiring board construction including embedded ceramic capacitors(s)
#4767Wiring board and ceramic chip to be embedded
#4768Printed circuit board assembly with strain-alleviating structures
#4769Quad flat pack (QFP) package and flexible power distribution method therefor
#4770Test carrier for semiconductor components having conductors defined by grooves
#4771Microelectronic devices and methods for manufacturing microelectronic devices
#4772Microelectronic device packages, stacked microelectronic device packages, and methods for manufacturing microelectronic devices
#4773Microelectronic devices and microelectronic support devices, and associated assemblies and methods
#4774Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices
#4775Power semiconductor device having lines within a housing
#4776Bonding program
#4777Method for producing an electronic component or module and a corresponding component or module
#4778Semiconductor device and method of producing the same
#4779Multi-chip package for reducing parasitic load of pin
#4780Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods
#4781Semiconductor component comprising an interposer substrate
#4782Semiconductor power component with a vertical current path through a semiconductor power chip
#4783Bi-directional switch, and use of said switch
#4784Semiconductor connection component
#4785Semiconductor device and capacitance regulation circuit
#4786Semiconductor device and capacitance regulation circuit
#4787METHODS OF FABRICATING A SEMICONDUCTOR DEVICE USING A PHOTOSENSITIVE POLYIMIDE LAYER AND SEMICONDUCTOR DEVICES FABRICATED THEREBY
#4788Multichip packages with exposed dice
#4789Semiconductor package with contact support layer and method to produce the package
#4790Method And Device For Enhancing Solderability
#4791Bonding apparatus
#4792Bonding pattern discrimination device
#4793Bonding pattern discrimination program
#4794Semiconductor component and method of manufacture
#4795Mount for a programmable electronic processing device
#4796Stack structure with semiconductor chip embedded in carrier
#4797Semiconductor module
#4798Semiconductor device and a manufacturing method of the same
#4799Optical semiconductor device and method of manufacturing the same
#4800Semiconductor device