Semiconductor device

Use of an internal on-chip inductor for electrostatic discharge protection of circuits which use bond wire inductance as their load

Method and apparatus for removing encapsulating material from a packaged microelectronic device

Packaged integrated circuit having a heat spreader and method therefor

Capacitor for incorporation in wiring board, wiring board, method of manufacturing wiring board, and ceramic chip for embedment

Method for fabricating semiconductor package with heat sink

Reduced-dimension microelectronic component assemblies with wire bonds and methods of making same

Multilayered circuit substrate and semiconductor package structure using the same

Polysilicon film with increased roughness

SEMICONDUCTOR DEVICE

Multilayer printed wiring board

Electrical interconnect structures for integrated circuits and methods of manufacturing the same

Embedded actives and discrete passives in a cavity within build-up layers

Radio frequency power amplifier module

Output match transistor

Semiconductor power device and RF signal amplifier

Flip chip package with reduced thermal stress

Technique for forming a copper-based contact layer without a terminal metal

On-chip test circuit for assessing chip integrity

ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING THE ELECTRONIC DEVICE

Integrated circuit chip and integrated device

Semiconductor device for radio frequencies of more than 10 GHz and method for producing the device

Semiconductor device having capacitors for reducing power source noise

METHOD FOR PRODUCING A CHIP ARRANGEMENT, A CHIP ARRANGEMENT AND A MULTICHIP DEVICE

Semiconductor package based on lead-on-chip architecture, the fabrication thereof and a leadframe for implementing in a semiconductor package

Semiconductor device

Biocompatible bonding method and electronics package suitable for implantation

Electrical connections in substrates

Semiconductor element and a producing method for the same, and a semiconductor device and a producing method for the same

Multilayer structure having a warpage-compensating layer

Methods of underfilling and encapsulating semiconductor assemblies with materials having selected properties using stereolithography

Method and apparatus for attaching microelectronic substrates and support members

Packaging method for segregating die paddles of a leadframe

Device, system and electric element

Micro camera module and method of manufacturing the same

Piezoelectric device

Relay board with bonding pads connected by wirings

Method and apparatus for attaching microelectronic substrates and support members

Stress and force management techniques for a semiconductor die

Wiring substrate and semiconductor package implementing the same

Electronic component and electronic configuration

Packaging for high speed integrated circuits

Optimized multi-apparation assembly

Packaging for high speed integrated circuits

Packaging for high speed integrated circuits

Packaging for high speed integrated circuits

Large die package structures and fabrication method therefor

Packaging for high speed integrated circuits

Packaging for high speed integrated circuits

Method and apparatus for providing a solder area on a leadframe

Electrically connecting substrate with electrical device

Substrate applicable to both wire bonding and flip chip bonding, smart card modules having the substrate and methods for fabricating the same

Adhesive/spacer island structure for multiple die package

Method for forming bump protective collars on a bumped wafer

Semiconductor device and method of manufacturing thereof

Display driver integrated circuit device, film, and module

Bumped die and wire bonded board-on-chip package

Semiconductor device and a manufacturing method of the same

Method and structure for reduction of soft error rates in integrated circuits

Semiconductor power module with SiC power diodes and method for its production

Tape wiring substrate and chip-on-film package using the same

MEMS packaging method for enhanced EMI immunity using flexible substrates

Interlayer insulating layer for printed wiring board, printed wiring board and method for manufacturing same

Packaging of a microchip device

Package substrate and semiconductor package using the same

MEMS package using flexible substrates, and method thereof

High brightness light-emitting device and manufacturing process of the light-emitting device

Electronic component package including joint material having higher heat conductivity

Package structure for a semiconductor device incorporating enhanced solder bump structure

Wire-bonding method and semiconductor package using the same

Microelectronic assembly with underchip optical window, and method for forming same

Method for manufacturing semiconductor chip package

Lead frame, resin-encapsulated semiconductor device, and method of producing the same

Method of manufacturing a passive integrated matching network for power amplifiers

Semiconductor sensor and manufacturing method therefor

Light-emitting device

Cavity ball grid array apparatus having improved inductance characteristics

Method for self-assembling microstructures

Semiconductor storage device

Biocompatible bonding method and electronics package suitable for implantation

METHOD OF FABRICATING A HIGH-DENSITY LEAD ARRANGEMENT PACKAGE STRUCTURE

Semiconductor device manufacturing method

Semiconductor devices at least partially covered by a composite coating including particles dispersed through photopolymer material

Bonding apparatus and method

Semiconductor device with semiconductor device components embedded in a plastics composition

Semiconductor device with improved signal transmission characteristics

Method of interconnecting terminals and method of mounting semiconductor devices

Semiconductor device

Stacked semiconductor package

Semiconductor assemblies including redistribution layers and packages and assemblies formed therefrom

Package for electronic device and method for manufacturing electronic device

System and method for venting pressure from an integrated circuit package sealed with a lid

Semiconductor memory device and manufacturing method thereof

Semiconductor device and package, and method of manufacturer therefor

Multi-part lead frame with dissimilar materials

Semiconductor device and manufacturing method thereof

Solders with intermetallic phases, solder bumps made thereof, packages containing same, and methods of assembling packages therewith

Methods of operating electronic devices, and methods of providing electronic devices

Semiconductor substrates including vias of nonuniform cross section, methods of forming and associated structures

Circuitry component and method for forming the same

Standoffs for centralizing internals in packaging process

Method of fabricating a stacked die in die BGA package

Method of fabricating a stacked die in die BGA package

Stacked die in die BGA package

Grid array connection device and method

Mechanical integrity evaluation of low-k devices with bump shear

Post passivation structure for a semiconductor device and packaging process for same

Wire bonding structure to electrically connect a printhead chip to a flexible printed circuit of an ink cartridge and method thereof

Radio frequency receiver chip with improved electrostatic discharge level

Packaging logic and memory integrated circuits

Alignment using fiducial features

Reliable integrated circuit and package

Lead frame for semiconductor package

Semiconductor device and system having semiconductor device mounted thereon

Signal isolation in a package substrate

Substrate structure and the fabrication method thereof

Electronic board, method of manufacturing the same, and electronic device

Electronic board, method of manufacturing the same, and electronic device

Chip-on-board assemblies

Low stress chip attachment with shape memory materials

Chip stack package having same length bonding leads

Manufacturing method for a semiconductor device

Method of manufacturing a carrier member for electronic components

Semiconductor device and method for manufacturing the same

Integrated thin-film capacitor with etch-stop layer, process of making same, and packages containing same

Technique for manufacturing an overmolded electronic assembly

Lead-frame type semiconductor package and lead frame thereof

Wafer level bumpless method of making a flip chip mounted semiconductor device package

Packaging method and package using the same

Semiconductor device packaging substrate and semiconductor device packaging structure

Wiring substrate and bonding pad composition

Decoupling capacitor for an integrated circuit and method of manufacturing thereof

Probe card assembly and kit

Method of testing a semiconductor device and suctioning a semiconductor device in the wafer state

Semiconductor device and manufacturing method therefor

Pre-solder structure on semiconductor package substrate and method for fabricating the same

Integrated electronic chip and interconnect device and process for making the same

Soldered assemblies and methods of making the same

Method for forming wafer-level heat spreader structure and package structure thereof

Method and apparatus for applying external coating to grid array packages for increased reliability and performance

Semiconductor device, stacked semiconductor device, and manufacturing method for semiconductor device

Methods for reducing stress in microelectronic devices and microelectronic devices formed using such methods

Leadless semiconductor package

Wafer-level chip scale packaging for LED comprising carrier substrate with thermally conductive through holes and fill channels

Physical quantity sensor, lead frame, and manufacturing method therefor

Capping copper bumps

Method for making electronic devices

Semiconductor components and methods of fabrication with circuit side contacts, conductive vias and backside conductors

ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE SAME

Substrate structure of semiconductor package

Method of wafer-level packaging using low-aspect ratio through-wafer holes

Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat

Integrated circuit package substrate having a thin film capacitor structure

Method and circuit structure employing a photo-imaged solder mask

Method for producing a protective assembly for protecting an electronic component from electrostatic discharge, and correspondingly configured electronic component

Methods for packaging an image sensor and a packaged image sensor

Semiconductor element and manufacturing method thereof

Wiring board and semiconductor device

Method for mounting an electronic part on a substrate using a liquid containing metal particles

Semiconductor device including a plurality of semiconductor chips and a plurality of through-line groups

Integrated circuit device

Taped semiconductor device and method of manufacture

Semiconductor device having capacitive insulation means and communication terminal using the device

Semiconductor device, laminated semiconductor device, and method for producing semiconductor device

Circuit device and method of manufacturing the same

Varied-thickness heat sink for integrated circuit (IC) package

Electrical component and production thereof

Semiconductor device modules, semiconductor devices, and microelectronic devices

Image sensitive electronic device packages

Semiconductor device

Method for efficiently producing removable peripheral cards

Tab package connecting host device element

Capacitor device, semiconductor devioce, and setting method of terminal capacitance of pad electrode thereof

Chip package and wire bonding process thereof

Integrated circuit with substantially perpendicular wire bonds

Semiconductor device

Composite material, electrical circuit or electric module

Substrate for mounting IC chip, substrate for motherboard, device for optical communication, manufacturing method of substrate for mounting IC chip, and manufacturing method of substrate for motherboard

Semiconductor device and manufacturing method thereof

Wafer level pre-packaged flip chip systems

Multi-chip module and methods

Wafer level pre-packaged flip chip

Low cost power semiconductor module without substrate

Semiconductor package substrate with embedded resistors and method for fabricating same

Micromodule, particularly for chip card

LED package structure and method making of the same

Leadframeless package structure and method

Mask and method for electrokinetic deposition and patterning process on substrates

Ball film for integrated circuit fabrication and testing

Wafer level pre-packaged flip chip

Method and system for solder die attach

Offset integrated circuit package-on-package stacking system

Integrated circuit package including miniature antenna

Probe card and testing method of semiconductor chip, capacitor and manufacturing method thereof

Probe card and testing method of semiconductor chip, capacitor and manufacturing method thereof

Wafer level pre-packaged flip chip system

Flip chip package having protective cap and method of fabricating the same

Stacked semiconductor memory device

Semiconductor module provided with contacts extending through the package

System and method for vertically stacking computer memory components

Lead frame and resin-encapsulated semiconductor device

Semiconductor device with sealed semiconductor chip

Semiconductor component in a housing with mechanically inforcing flat conductor webs

Wire loop, semiconductor device having same and wire bonding method

Bond pad structure comprising multiple bond pads with metal overlap

Microelectronic packages and methods therefor

Semiconductor device and fabrication method thereof

Semiconductor device with substrate having penetrating hole having a protrusion

Stack type surface acoustic wave package, and method for manufacturing the same

Solid-state imaging device and manufacturing method thereof

Multi-chip module and method of manufacture

Alignment key structure in a semiconductor device and method of forming the same

Semiconductor device, method for manufacturing the same, circuit substrate, electro-optical apparatus, and electronic equipment

Technique for enhancing thermal and mechanical characteristics of an underfill material of a substrate/die assembly

Methods for applying front side and edge protection material to electronic devices at the wafer level, devices made by the methods, and systems including the devices

Semiconductor device

Semiconductor power module package

Package substrate with built-in capacitor and manufacturing method thereof

Power switching control device for electric systems

Compliant contact pin test assembly and methods thereof

Wire bonded semiconductor device having low inductance and noise

Memory packages having stair step interconnection layers

Electronic component and electronic configuration

Conductive bump structure of circuit board and method for forming the same

Microelectronic component and assembly having leads with offset portions

Multilayer printed wiring board

Semiconductor device having a flexible board for connection to a semiconductor chip mounted on an insulating substrate

Multilayer printed wiring board

Thermoelectric generators for solar conversion and related systems and methods

Method of making a circuitized substrate

Chip level biostable interconnect for implantable medical devices

Semiconductor device and method of manufacturing the same

Semiconductor device with terminals, and method of manufacturing the same

Method of making a multi-chip electronic package having laminate carrier

Semiconductor device and method for producing the same

System having semiconductor component with multiple stacked dice

Standoffs for centralizing internals in packaging process

Semiconductor device and electronic device

Lead frame for semiconductor package and method of manufacturing the same

Shielding arrangement to protect a circuit from stray magnetic fields

Semiconductor substrate

Substrate for mounting electronic part and electronic part

Multilayer printed wiring board

Electronic component and method for its production

Coolant cooled type semiconductor device

Light emitting device

Semiconductor device and manufacturing method thereof

Structure for mounting semiconductor part in which bump and land portion are hardly detached from each other and method of manufacturing mounting substrate used therein

Semiconductor package accomplishing fan-out structure through wire bonding

Semiconductor module and method of forming a semiconductor module

Pillar grid array package

High density direct connect LOC assembly

Multilevel semiconductor module and method for fabricating the same

Semiconductor device having resin-sealed area on circuit board thereof

Lead frame for semiconductor package

Method for fabricating semiconductor components with through wire interconnects

Micro electric power converter

Semiconductor package substrate having contact pad protective layer formed thereon

Ball grid array package stack

Power semiconductor module

Semiconductor device, method for manufacturing the semiconductor device and semiconductor substrate

Strobe light control circuit and IGBT device

Electronic device substrate and its fabrication method, and electronic device and its fabrication method

Method of fabricating semiconductor chip assemblies

Manufacturing managing method of semiconductor devices and a semiconductor substrate

Semiconductor wafer coat layers and methods therefor

SEMICONDUCTOR PACKAGE SUBSTRATE HAVING CONTACT PAD PROTECTIVE LAYER FORMED THEREON AND METHOD FOR FABRICATING THE SAME

Ball grid array package and process for manufacturing same

Organic substrates with integral thin-film capacitors, methods of making same, and systems containing same

Mounting structure and mounting method of a semiconductor device, and liquid crystal display device

Semiconductor device to be applied to various types of semiconductor package

Stacked die package

Semiconductor device having stress relaxation sections

Method for mounting semiconductor chips on a substrate and corresponding assembly

Flip chip package and the fabrication thereof

ELECTRONIC DEVICE PACKAGE

Packaged semiconductor device and method of manufacture using shaped die

Semiconductor device having bonding pad of the first chip thicker than bonding pad of the second chip

High density integrated circuit having multiple chips and employing a ball grid array (BGA) and method for making same

Stacked package for electronic elements

Memory card with connecting portions for connection to an adapter

Memory card with connecting portions for connection to an adapter

Semiconductor integrated circuit (IC) packaging with carbon nanotubes (CNT) to reduce IC/package stress

Lead frame and semiconductor device

Semiconductor module and method of manufacturing the same

Package structure having mixed circuit and composite substrate

Semiconductor device

Organic substrates with embedded thin-film capacitors, methods of making same, and systems containing same

Wafer level package including a device wafer integrated with a passive component

Stacked die-in-die BGA package with die having a recess

Flip chip interconnection having narrow interconnection sites on the substrate

Package structure of semiconductor and wafer-level formation thereof

Wafer-level package for integrated circuits

Integrated circuit for communications modules

Integrated circuit carrier

Secure system for tracking elements using tags

Method for fabricating flip-attached and underfilled semiconductor devices

Flip-chip semiconductor package and method for fabricating the same

Semiconductor chip and method manufacturing the same

Wafer level chip scale package having a gap and method for manufacturing the same