Power amplifier module

System-in-package type semiconductor device

Methods and systems for rise-time improvements in differential signal outputs

Module substrate and disk apparatus

Heat dissipating packages structure and method for fabricating the same

Metal-ceramic substrate for electric circuits or modules, method for producing one such substrate and module comprising one such substrate

Semiconductor packages with asymmetric connection configurations

Apparatus for stacking electrical components using insulated and interconnecting via

Multi-chip semiconductor package

Multi-chip package

Bump formation method and bump forming apparatus for semiconductor wafer

Semiconductor system with fine pitch lead fingers

Component with ultra-high frequency connections in a substrate

Cooling system for a semiconductor device and method of fabricating same

Tolerance bondwire inductors for analog circuitry

Fabricating surface mountable semiconductor components with leadframe strips

High density direct connect loc assembly

Method for wafer level stack die placement

Electronic component module having electronic component with piezoelectric device

Wire positioning and mechanical attachment for a radio-frequency indentification device

Radar-transceiver for microwave and millimetre applications

Semiconductor package device and method for fabricating the same

IC chip package with cover

Semiconductor package with conductive molding compound and manufacturing method thereof

Semiconductor device having flip-chip package and method for fabricating the same

Staggered wirebonding configuration

Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same

Semiconductor module

Flip chip bonding structure using non-conductive adhesive and related fabrication method

Interconnect shunt used for current distribution and reliability redundancy

IC chip package with isolated vias

Resin-sealed semiconductor device, leadframe with die pads, and manufacturing method for leadframe with die pads

Stepped integrated circuit packaging and mounting

Flexible wiring substrate, semiconductor device and electronic device using flexible wiring substrate, and fabricating method of flexible wiring substrate

Semiconductor device having post-mold nickel/palladium/gold plated leads

High-powered light emitting device with improved thermal properties

Pad arrangement of driver IC chip for LCD and related circuit pattern structure of TAB package

Integrated circuit die with logically equivalent bonding pads

Semiconductor light-emitting device, lighting module and lighting apparatus

Method of ultrasonic mounting and ultrasonic mounting apparatus using the same

Packaging and manufacturing of an integrated circuit

Method for fabricating semiconductor components

Thermal enhance package and manufacturing method thereof

Die stacking scheme

Semiconductor package substrate with embedded resistors and method for fabricating the same

Method of manufacturing a wafer assembly

Power supply noise reduction circuit and power supply noise reduction method

Multilayered chip capacitor array

Semiconductor device and method for manufacturing same

Cavity-down Package and Method for Fabricating the same

LED with self aligned bond pad

Semiconductor device and method for fabricating the same

Electronic component comprising external surface contacts and a method for producing the same

Multi-chip stack package

Method of mounting an electronic part to a substrate

Flip chip package including a heat spreader having an edge with a recessed edge portion and method of making the same

Semiconductor package with heat sink and method for fabricating same

Hybrid integrated circuit device, and method for fabricating the same, and electronic device

Multiple die stack apparatus employing t-shaped interposer elements

Multiple die stack apparatus employing T-shaped interposer elements

Semiconductor module having an internal semiconductor chip stack, and method for producing said semiconductor module

Chip-on-board package having flip chip assembly structure and manufacturing method thereof

Flip chip package including a non-planar heat spreader and method of making the same

Film circuit substrate having Sn-In alloy layer

Manufacturing method of solid-state image sensing device

Illuminating apparatus, method for fabricating the using the same and display apparatus using the same

Method of mounting electronic component

Method for fabricating connection terminal of circuit board

Method for fabricating semiconductor package with short-prevented lead frame

Electronic component embedded within a plastic compound and including copper columns within the plastic compound extending between upper and lower rewiring layers, and system carrier and panel for producing an electronic component

Substrate structure with embedded chip of semiconductor package and method for fabricating the same

Molded high density electronic packaging structure for high performance applications

IC (integrated circuit) card

IC substrate and manufacturing method thereof and semiconductor element package thereby

Method and apparatus for placing conductive balls

Circuit carrier and production thereof

Semiconductor device and method of manufacturing the same

Method for making electronic packages

Multilayer core board and manufacturing method thereof

WAFER LEVEL MICROELECTRONIC PACKAGING WITH DOUBLE ISOLATION

Integrated circuit package employing a heat-spreader member

Integrated circuit package having inductance loop formed from same-pin-to-same-bonding-pad structure

Multichip leadframe package

Method of manufacturing of thin based substrate

Structure and method for mounting LSI package onto photoelectric wiring board, information processing apparatus, optical interface, and photoelectric wiring board

Semiconductor device package with concavity-containing encapsulation body to prevent device delamination and increase thermal-transferring efficiency

Semiconductor package using flip-chip mounting technique

Stacked die module

Semiconductor chip mounting wiring board, manufacturing method for same, and semiconductor module

Power transistor including a leadframe and a semiconductor chip arranged on the leadframe

Integrated circuit package employing a flexible substrate

Semiconductor device, mounting structure, electro-optical device, method of manufacturing electro-optical device, and electronic apparatus

Semiconductor device

Method and apparatus for mounting and removing an electronic component

Method of manufacturing a substrate with through electrodes

Method for manufacturing semiconductor light emitting device

Die-attach films for chip-scale packaging, packages made therewith, and methods of assembling same

Underfill of resin and sulfonic acid-releasing thermally cleavable compound

CPU power delivery system

Power management integrated circuit

Face-to-face bonded I/O circuit die and functional logic circuit die system

Semiconductor device

Method of forming a stacked semiconductor package

Surface-mounted microwave package and corresponding mounting with a multilayer circuit

Apparatus of antenna with heat slug and its fabricating process

Module assembly for multiple die back-illuminated diode

Stress-relief layers and stress-compensation collars with low-temperature solders for board-level joints, and processes of making same

Method for manufacturing a GaN based LED of a black hole structure

Low melting-point solders, articles made thereby, and processes of making same

Decoupling capacitor for an integrated circuit and method of manufacturing thereof

Interconnecting a port of a microwave circuit package and a microwave component mounted in the microwave circuit package

Semiconductor package with wire bond arrangement to reduce cross talk for high speed circuits

Semiconductor element including a wet prevention film

Control circuitry in stacked silicon

Chip package

Self-reflowing printed circuit board and application methods

Circuit device and manufacturing method thereof

Bonding apparatus

Circuit-connecting material and circuit terminal connected structure and connecting method

Semiconductor package having a heat slug and manufacturing method thereof

PROCESS OF FABRICATING FLIP-CHIP PACKAGES

Method for producing a packaged integrated circuit

Stacked die module and techniques for forming a stacked die module

Production methods for a leadframe and electronic devices

Radiant energy heating for die attach

Electronic circuit including circuit-connecting material

Assembly for stacked BGA packages

Semiconductor device and semiconductor device unit

Nitride semiconductor light emitting device having electrostatic discharge (ESD) protection capacity

Submount for use in flipchip-structured light-emitting device including transistor

Manufacturing apparatus of semiconductor devices, and method of manufacturing semiconductor devices

Fabricating method of wafer protection layers

Method of forming a wafer backside interconnecting wire

Microelectronic device packages and methods for controlling the disposition of non-conductive materials in such packages

Method of forming a surface mountable IC and its assembly

LED package and method for producing the same

Power module package having excellent heat sink emission capability and method for manufacturing the same

Light-emitting semiconductor device having an overvoltage protector

Semiconductor module

Light emitting device

Semiconductor device and method for manufacturing the same, circuit board, electronic apparatus, and semiconductor device manufacturing apparatus

Semiconductor device and manufacturing method thereof

Method of fabricating a semiconductor die package having improved inductance characteristics

Tape ball grid array package with electromagnetic interference protection and method for fabricating the package

Apparatus for and method of packaging semiconductor devices

Light emitting device and method of producing same

Optical semiconductor device, method for fabricating the same, lead frame and electronic equipment

Methods for forming conductive bumps and wire loops

Physical quantity sensor, lead frame, and manufacturing method therefor

Surface mount saw device manufacturing method

Module assembly and method for stacked BGA packages

Method for fabricating conductive bump of circuit board

Method for bonding flip chip on leadframe

Methods for packaging image sensitive electronic devices

Methods for packaging image sensitive electronic devices

Methods for packaging image sensitive electronic devices

Chip-on-chip type semiconductor device

Integrated antenna type circuit apparatus

Surface acoustic wave device and method for manufacturing the same

Chip module

Semiconductor package having a partial slot cover for encapsulation process

Flip chip metal bonding to plastic leadframe

Semiconductor chip stack structure and method for forming the same

Wire-bonding method for connecting wire-bond pads and chip and the structure formed thereby

Grooved substrates for uniform underfilling solder ball assembled electronic devices

Integrated semiconductor circuit and method for producing an integrated semiconductor circuit

Semiconductor device and method of manufacturing semiconductor device

Semiconductor device and wire bonding chip size package therefor

Module assembly for stacked BGA packages

Method of manufacturing a semiconductor device

Lead frame and semiconductor device having the lead frame

Light-emitting device and glass seal member therefor

Solid-state optical device

Solid state device and light-emitting element

Method for connecting a chip and a substrate

Through-substrate interconnect fabrication methods

Methods for packaging image sensitive electronic devices

Methods for fabrication of thin semiconductor assemblies including redistribution layers and packages and assemblies formed thereby

Methods for packaging microfeature devices and microfeature devices formed by such methods

Magnetic shielding for magnetic random access memory card

Methods and apparatuses for transferring heat from stacked microfeature devices

Semiconductor module

Surface-mounting semiconductor device and method of making the same

Wire sweep resistant semiconductor package and manufacturing method thereof

Reduced-dimension microelectronic component assemblies with wire bonds and methods of making same

Integrated circuit with substantially perpendicular wire bonds

High-reliable semiconductor device using hermetic sealing of electrodes

Through-wafer interconnects for photoimager and memory wafers

Substrate, semiconductor die, multichip module, and system including a via structure comprising a plurality of conductive elements

Apparatus and method for reducing signal cross talk between wire bonds of semiconductor packages

Semiconductor device having a heat-dissipation member

Structures and methods for heat dissipation of semiconductor integrated circuits

Chip module

Low temperature methods of forming back side redistribution layers in association with through wafer interconnects, semiconductor devices including same, and assemblies

Substrate having a functionally gradient coefficient of thermal expansion

Multichip module package and fabrication method

Apparatus for improved power distribution in wirebond semiconductor packages

Method of making a semiconductor device adapted to remove noise from a signal

Semiconductor device and process for manufacturing the same

SMT three phase inverter package and lead frame

Floating lead finger on a lead frame, lead frame strip, and lead frame assembly including same

Electronic component with multilayered rewiring plate and method for producing the same

Method of making camera module in wafer level

Semiconductor integrated circuit device which restricts an increase in the area of a chip, an increase in the number of lead terminals of a package, and can reduce parasitic inductance

Electronic devices at the wafer level having front side and edge protection material and systems including the devices

Dense intermetallic compound layer

Method of manufacturing printed wiring board

Method of forming vias on a wafer stack using laser ablation

Bump inspection apparatus and method for IC component, bump forming method for IC component, and mounting method for IC component

LSI package equipped with interface module, interface module and connection holding mechanism

Submember mounted on a chip of electrical device for electrical connection

Electronic packages with dice landed on wire bonds

Method of producing a semiconductor device having a magnetic layer formed thereon

Method to fill the gap between coupled wafers

Methods for designing spacers for use in stacking semiconductor devices or semiconductor device components

Integrated circuit package including miniature antenna

Flip-chips on flex substrates, flip-chip and wire-bonded chip stacks, and methods of assembling same

Stacked packages

Electronic circuit device

Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice

Memory card with an adaptor

Wire bond with improved shear strength

Electronic circuit device

Programmable radio transceiver

Wafer level package structure of optical-electronic device and method for making the same

Semiconductor device

Manufacturing method of semiconductor device

Methods for securing components of semiconductor device assemblies to each other with adhesive materials that include pressure-sensitive and curable components

Method of creating electrostatic discharge protection in a microelectronic module

Apparatus and methods for constructing antennas using wire bonds as radiating elements

Semiconductor structure

Radio frequency power amplifier module

Semiconductor device with semiconductor components connected to one another

Component arrangement having an evaluation circuit for detecting wear on connections

Stack type semiconductor apparatus package and manufacturing method thereof

Method and apparatus for forming metal contacts on a substrate

Apparatus for attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux

Metal pad of semiconductor device and method for bonding the metal pad

Stacked chip electronic package having laminate carrier and method of making same

Semiconductor module, MOS type solid-state image pickup device, camera and manufacturing method of camera

Semiconductor device with signal line having decreased characteristic impedance

Electrical conducting structure and liquid crystal display device comprising the same

Semiconductor component having a CSP housing

Hermetic chip in wafer form

Microelectronic packages including solder bumps and AC-coupled interconnect elements

Semiconductor multichip module package with improved thermal performance; reduced size and improved moisture resistance

Semiconductor device and manufacturing method thereof

LOC semiconductor assembled with room temperature adhesive

Electrical assembly with internal memory circuitized substrate having electronic components positioned thereon, method of making same, and information handling system utilizing same

Image sensor packaging structure

Electronic component embedded substrate and method for manufacturing the same

Method for manufacturing plastic ball grid array package with integral heatsink

Magnetic shield for integrated circuit packaging

Microelectronic component assemblies with recessed wire bonds and methods of making same

Bump ball device and placing method thereof

BGA package board and method for manufacturing the same

Semiconductor device and its manufacturing method

Electronic module with layer of adhesive and process for producing it

Damascene patterning of barrier layer metal for C4 solder bumps

Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic components

Mounting method and mounting device

Circuit-connecting material and circuit terminal connected structure and connecting method

Method for fabricating a semiconductor component with contacts situated at the underside

Chip handling methods and apparatus

Substrate, semiconductor device, method of manufacturing substrate, and method of manufacturing semiconductor device

Substrate for mounting IC chip

Electronic assemblies and systems comprising interposer with embedded capacitors

Wiring substrate for mounting semiconductors, method of manufacturing the same, and semiconductor package

Method of packaging integrated circuits, and integrated circuit packages produced by the method

Electronic device with semiconductor chip including a radiofrequency power module

Heat dissipation device for integrated circuits

Device mounting board

Semiconductor device and manufacturing method therefor

Wafer-level assembly method for semiconductor devices

IMPROVED DECAL SOLDER TRANSFER METHOD

Formation of a wire bond with enhanced pull

RFID tag and method of manufacturing RFID tag

Semiconductor device

Mounting semiconductor chips

Method for fabricating semiconductor component with adjustment circuitry for electrical characteristics or input/output configuration

BGA package with concave shaped bonding pads

Thermal interposer for cooled electrical packages

Molded package for micromechanical devices and method of fabrication

Semiconductor component having stacked, encapsulated dice and method of fabrication

Multi-chip package having heat dissipating path

Ultrathin module for semiconductor device and method of fabricating the same

Semiconductor device having a through electrode

Switch elements and a DC/DC converter using the same

Light emitting element and method of making same

Semiconductor devices with permanent polymer stencil and method for manufacturing the same

Semiconductor device packages including hermetic packaging elements for at least partially encapsulating conductive elements and other package elements for protecting the portions of semiconductor devices not covered by the hermetic package elements, and packaging methods

Method for fabricating semiconductor components using conductive layer and grooves

Semiconductor test interconnect with variable flexure contacts having polymer material

Technique for protecting photonic devices in optoelectronic packages with clear overmolding

Interconnect shunt used for current distribution and reliability redundancy

Method for manufacturing a semiconductor device

Semiconductor device

Methods and apparatus for integrated circuit ball bonding using stacked ball bumps

Semiconductor device

Silicon die substrate manufacturing process and silicon die substrate with integrated cooling mechanism