Quad flat non-leaded package

Taped lead frames and methods of making and using the same in semiconductor packaging

Apparatus and method of wafer level package

Circular wire-bond pad, package made therewith, and method of assembling same

Slave device, master device and stacked device

Leadless semiconductor package and method for manufacturing the same

Universal energy conditioning interposer with circuit architecture

Apparatus of antenna with heat slug and its fabricating process

Electrostatic discharge (ESD) protection for integrated circuit packages

Method and structure for manufacturing improved yield semiconductor packaged devices

Semiconductor device with wire bond inductor and method

Multi-chip semiconductor connector assemblies

Quad flat no-lead (QFN) grid array package, method of making and memory module and computer system including same

Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device

Circuit apparatus provided with asperities on substrate surface

In-situ alloyed solders, articles made thereby, and processes of making same

Flange-mounted transducer

Adhesive composition, adhesive composition for circuit connection, connected body semiconductor device

Stud bump socket

Method of forming a thin wafer stack for a wafer level package

Methods for modifying semiconductor devices to stabilize the same and semiconductor device assembly

Method for encapsulating multiple integrated circuits

Prefabricated semiconductor chip carrier

Apparatus for molding a semiconductor die package with enhanced thermal conductivity

Multipiece apparatus for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages and method of making the same

Multiple device package

Memory card with a cap having indented portions

Printed wiring board

Semiconductor device and manufacturing method therefor

Apparatus and method for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages

High brightness light-emitting device and manufacturing process of the light-emitting device

Field weldable connections

Flexible scrub ring contact

Fabrication method of wafer level chip scale packages

Microfeature devices and methods for manufacturing microfeature devices

Compound semiconductor device and manufacturing method thereof

Underfill and encapsulation of semiconductor assemblies with materials having differing properties

Semiconductor apparatus and method of manufacturing semiconductor apparatus

Encapsulation of pin solder for maintaining accuracy in pin position

Package and method for packaging an integrated circuit die

Contact pin assembly and contactor card

Compliant contact pin assembly and card system

Embedded chip semiconductor having dual electronic connection faces

Multi-chip module package structure

Method and system for improved wire bonding

Semiconductor device having inductor

Compound semiconductor device and manufacturing method thereof

Spread spectrum isolator

Method for forming interconnects on thin wafers

Methods of making microelectronic packages

RF isolator with differential input/output

Method of making photolithographically-patterned out-of-plane coil structures

Optimized driver layout for integrated circuits with staggered bond pads

Semiconductor device components with structures for stabilizing the semiconductor device components upon flip-chip arrangement with high-level substrates

Semiconductor component and system having thinned, encapsulated dice

Ball grid array solder joint reliability

Semiconductor package including redistribution pattern and method of manufacturing the same

Supporting frame for surface-mount diode package

On chip transformer isolator

Semiconductor device

Integrated circuit packages with reduced stress on die and associated methods

Manufacturing methods for semiconductor structures having stacked semiconductor devices

Encapsulated chip and method of fabrication thereof

Semiconductor integrated circuit device and method for fabricating the same

Circuit device and manufacturing method thereof

Material for forming insulating film with low dielectric constant, low dielectric insulating film, method for forming low dielectric insulating film and semiconductor device

Electronic system including a semiconductor device with at least one semiconductor die, a carrier, and an encapsulant that fills a space between the die and the carrier and covers intermediate conductive elements that connect the die and the carrier

Circuit device and manufacturing method thereof

Semiconductor device and method of manufacturing the same

Semiconductor device including amplifier and frequency converter

Circuit device and manufacturing method thereof

Semiconductor package, method of production of same, and semiconductor device

Method of fabricating a semiconductor device used in a stacked-type semiconductor device

Intermediate substrate

IC chip package

Integrated circuit leadframe and fabrication method therefor

Semiconductor device and method for manufacturing the same

Layout structure for providing stable power source to a main bridge chip substrate and a motherboard

Selective packaging of tested semiconductor devices

Method for identifying semiconductor integrated circuit device, method for manufacturing semiconductor integrated circuit device, semiconductor integrated circuit device and semiconductor chip

Circuit device and manufacturing method thereof

Moisture-resistant electronic device package and methods of assembly

Multi-band tunable resonant circuit

Circuit device, manufacturing method thereof, and sheet-like board member

Method for fabricating leadless packages with mold locking characteristics

Integrated ball and via package and formation process

Fine-pitch packaging substrate and a method of forming the same

Semiconductor device

Bump structure

Double density method for wirebond interconnect

Chip heat sink device and method

Adhesive/spacer island structure for multiple die package

Semiconductor device, method for mounting the same, and method for repairing the same

Leadless leadframe with an improved die pad for mold locking

Chip package, image sensor module including chip package, and manufacturing method thereof

Submount for diode with single bottom electrode

Structure for mounting electronic component on wiring board

Method of attaching a leadframe to singulated semiconductor dice

High heat release semiconductor and method for manufacturing the same

Flip chip package and process of forming the same

Integrated circuit packaging method and structure for redistributing configuration thereof

High electrical performance semiconductor package

Package design and method for electrically connecting die to package

Semiconductor device structure with adhesion-enhanced semiconductor die

Semiconductor device assemblies including an encapsulant located over intermediate conductive elements and filling a space between a semiconductor die and a carrier of the assembly

Semiconductor device capable of being connected to external terminals by wire bonding in stacked assembly

Power module and electric transportation apparatus incorporating the same

Large die package structures and fabrication method therefor

Resin-molded package with cavity structure

Die package

Method for bonding IC chips to substrates incorporating dummy bumps and non-conductive adhesive

Method of manufacturing a semiconductor device and a fabrication apparatus for a semiconductor device

Method for internal electrical insulation of a substrate for a power semiconductor module

Electronic device including chip parts and a method for manufacturing the same

Chip scale package with heat spreader

Embedded chip semiconductor without wire bondings

Electronic circuit package

Chip-packaging with bonding options having a plurality of package substrates

Array capacitors in interposers, and methods of using same

Assemblies with bond pads of two or more semiconductor devices electrically connected to the same surface of a plurality of leads

Flip chip semiconductor package for testing bump and method of fabricating the same

Leads under chip IC package

Fill for large volume vias

Semiconductor device

Semiconductor light emitting device with flexible substrate

Methods of forming conductive through-wafer vias

Selectable decoupling capacitors for integrated circuits and associated methods

Linear split axis wire bonder

Method of manufacturing a semiconductor device

Method and apparatus for synthesizing high-frequency signals for wireless communications

Semiconductor chip having pads with plural junctions for different assembly methods

Semiconductor package having a first conductive bump and a second conductive bump and methods for manufacturing the same

Semiconductor component having multiple stacked dice

Mold assembly for a package stack via bottom-leaded plastic (BLP) packaging

Downsized package for electric wave device

Semiconductor chip package and method for manufacturing the same

Card-type LED illumination source

Test circuit under pad

Method for low loop wire bonding

Method of fabricating a rat's nest RFID antenna

Card-type LED illumination source

Semiconductor chip having pads with plural junctions for different assembly methods

System in-package test inspection apparatus and test inspection method

Semiconductor device and hybrid integrated circuit device

Wire bonding system and method of use

Process for fabricating chip package structure

Leadframe, plastic-encapsulated semiconductor device, and method for fabricating the same

Semiconductor device in which semiconductor chip is mounted on lead frame

High-frequency amplification device

Multilayer printed wiring board

Method of making contact pin card system

Methods and apparatus for transferring conductive pieces during semiconductor device fabrication

Semiconductor device

High power Doherty amplifier

Led chip mounting structure and image reader having same

Semiconductor chip package

Microelectronic assembly having a redistribution conductor over a microelectronic die

Flip-chip type semiconductor devices and conductive elements thereof

Apparatus and methods of testing and assembling bumped devices using an anisotropically conductive layer

Compliant contact pin assembly and card system

Compliant contact pin assembly and card system

Compliant contact pin assembly and card system

In-process semiconductor packages with leadframe grid arrays

Conductive elements with adjacent, mutually adhered regions and semiconductor device assemblies including such conductive elements

Semiconductor device, method for producing the same, circuit board, and electronic apparatus

CHIP PACKAGING STRUCTURE

Methods of forming a contact pin assembly

Automatic wiring method and apparatus for semiconductor package and automatic identifying method and apparatus for semiconductor package

Programmable radio transceiver

Method for fabricating encapsulated semiconductor components

Flexible multi-chip module and method of making the same

Method for manufacturing semiconductor device

Adhesive of folded package

Chip package structure and process for fabricating the same

Microelectronic assembly with underchip optical window, and method for forming same

Manufacturing method for semiconductor integrated circuit, semiconductor integrated circuit, and semiconductor integrated circuit apparatus

Jet-dispensed stress relief layer in contact arrays, and processes of making same

Semiconductor device and method of fabricating the same

Stackable optoelectronics chip-to-chip interconnects and method of manufacturing

Dual-interface IC card by laminating a plurality of foils and method of same

Method for maintaining solder thickness in flipchip attach packaging processes

Exposed pad module integrating a passive device therein

System for reducing or eliminating semiconductor device wire sweep

Multi-part lead frame

Mounting substrate and mounting method of electronic part

Component mounting substrate and structure

Embossing processes for substrate imprinting, structures made thereby, and polymers used therefor

Stress-relief layer and stress-compensation collar in contact arrays, and processes of making same

Stress-compensation layers in contact arrays, and processes of making same

Carrier substrates and conductive elements thereof

Capillary underfill channel

Die down semiconductor package

Use of palladium in IC manufacturing with conductive polymer bump

Circuit board and method for manufacturing the same and semiconductor device and method for manufacturing the same

Microelectronic assembly having encapsulated wire bonding leads

Semiconductor device, a method of manufacturing the same and an electronic device

Interposer including adhesive tape

Circuit component module and method of manufacturing the same

Method for manufacturing semiconductor device

Power semiconductor module

Fabrication method and structure of PCB assembly, and tool for assembly thereof

Low fabrication cost, high performance, high reliability chip scale package

Programmable radio transceiver

Multichip semiconductor package

Semiconductor device and manufacturing metthod thereof

Semiconductor package structure with reduced parasite capacitance and method of fabricating the same

Semiconductor device and method of manufacturing the same

Semiconductor device with plate-shaped component

Circuit device and manufacturing method thereof

Lead on chip semiconductor package

Surface-mountable semiconductor component and method for producing it

Solid state imaging device having electromagnetic wave absorber attached to a mounting board

Solder bump structure and method for forming a solder bump

Methods for forming electrical connections and resulting devices

Microelectronic device interconnects

LED illumination apparatus and card-type LED illumination source

Intermediate substrate

Structure of semiconductor chip and display device using the same

Stress and force management techniques for a semiconductor die

Multi-flip chip on lead frame on over molded IC package and method of assembly

Device with through-hole interconnection and method for manufacturing the same

Semiconductor apparatus

Wire bonding method and semiconductor device

Integrated circuit carrier with conductive rings and semiconductor device integrated with the carrier

Die package with higher useable die contact pad area

Package structure with a retarding structure and method of making same

Semiconductor memory device and multi-chip module comprising the semiconductor memory device

Stacked electronic part

Thin semiconductor package including stacked dies

Semiconductor package having step type die and method for manufacturing the same

Board-on-chip packages

Semiconductor device and manufacturing method thereof

Wiring board and process for producing the same

Connector

Method of fabricating a wire bond with multiple stitch bonds

Thin-film semiconductor device and method of manufacturing the same

Radio frequency arrangement, method for producing a radio frequency arrangement and use of the radio frequency arrangement

Apparatus and method for attaching a heat sink to an integrated circuit module

Semiconductor component having thinned die, polymer layers, contacts on opposing sides, and conductive vias connecting the contacts

Contact structure for nanometer characteristic dimensions

Semiconductor device and manufacturing method thereof

Method and apparatus for bonding a wire

Semiconductor component assemblies having interconnects

Semiconductor package

Semiconductor device

Semiconductor device, manufacturing method thereof, circuit board, and electronic appliance

Semiconductor package having heat spreader and package stack using the same

Semiconductor stack package and memory module with improved heat dissipation

Multi-chip package structure

Semiconductor device and manufacturing method thereof

Semiconductor device and electronic device

Method of semiconductor device assembly including fatigue-resistant ternary solder alloy

Wire bonding apparatus having actuated flame-off wand

Underfill system for die-over-die arrangements

Resin coating method and apparatus

Resin coating method and apparatus

Resin coating method and apparatus

High frequency module board device

Circuitized substrate with signal wire shielding, electrical assembly utilizing same and method of making

Anisotropic conductive sheet and manufacture thereof

Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same

Circuit component with bump formed over chip

Method for mounting semiconductor chips and corresponding semiconductor chip system

Resin-encapsulated semiconductor device and lead frame, and method for manufacturing the same

Bonding pad arrangement method for semiconductor devices

Flip-chip light emitting diode device without sub-mount

Bump bonding apparatus and bump bonding method

Compliant contact pin assembly, card system and methods thereof

Electrical contact

Multiple-ball wire bonds

Methods of fabrication of package assemblies for optically interactive electronic devices

Via structure of packages for high frequency semiconductor devices

Electronic component, method of manufacturing the electronic component, and electronic apparatus

Low fabrication cost, high performance, high reliability chip scale package

LSI package, LSI element testing method, and semiconductor device manufacturing method

Packaged die on PCB with heat sink encapsulant and methods

Low coefficient of thermal expansion build-up layer packaging and method thereof

Apparatus for encapsulating a multi-chip substrate array

Semiconductor package

Interconnect system without through-holes

Semiconductor device and manufacturing method thereof

Chip package structure

Lead-frame for electonic devices with extruded pads

Multiple die package

Wire loop, semiconductor device having same, wire bonding method and wire bonding apparatus

Semiconductor relay apparatus and wiring board fabrication method

Chip package structure

Method of manufacturing multi-layer printed circuit board

Manufacturing method for semiconductor device and semiconductor device

Semiconductor dice having back side redistribution layer accessed using through-silicon vias, methods

Substrate for mounting IC chip, multilayered printed circuit board, and device for optical communication

High-density illumination system

Substrate for carrying a semiconductor chip and a manufacturing method thereof

Semiconductor integrated circuit device

Packaged systems with MRAM

Optimized power delivery to high speed, high pin-count devices

Semiconductor device and a memory system including a plurality of IC chips in a common package

Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device

Semiconductor device package of stacked semiconductor chips with spacers provided therein

System in package