Electronic device configured as a multichip module, leadframe and panel with leadframe positions

High density lead arrangement package structure

Methods and apparatus for wire bonding with wire length adjustment in an integrated circuit

Methods of encapsulating selected locations of a semiconductor die assembly using a thick solder mask

Microelectronic packages and methods therefor

SEMICONDUCTOR PACKAGE MODULE AND MANUFACTURING METHOD THEREOF

Wafer level semiconductor component having thinned, encapsulated dice and polymer dam

Semiconductor device and method of manufacturing same

Optoelectronic hybrid integrated module and light input/output apparatus having the same as component

Method of producing a digital fingerprint sensor and the corresponding sensor

Method for fabricating a structure for making contact with a device

Semiconductor component having stiffener, stacked dice and circuit decals

Flip-chip attach structure

Semiconductor device with capacitor

Method for fabricating semiconductor component with stiffener and circuit decal

Electronic part mounting substrate, electronic part, and semiconductor device

Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same

Methods and apparatus for integrated circuit ball bonding with substantially perpendicular wire bond profiles

Method for manufacturing semiconductor device

Method of manufacturing hybrid integrated circuit device

Chip-on-board module, and method of manufacturing the same

Connector assembly

Wire-bonding method and semiconductor package using the same

Protective structures for bond wires

Semiconductor package with wire bonded stacked dice and multi-layer metal bumps

Trench-gate semiconductor devices

System and method for automated wire bonding

Semiconductor device, method for manufacturing the same, circuit substrate, electro-optical apparatus, and electronic equipment

Fabrication method of semiconductor package with photosensitive chip

Module with a built-in component, and electronic device with the same

Resin-encapsulation semiconductor device and method for fabricating the same

Semiconductor part for component mounting, mounting structure and mounting method

Flip-chip adaptor package for bare die

Semiconductor module having heat sink serving as wiring line

Semiconductor device including semiconductor element mounted on another semiconductor element

Bumped IC, display device and electronic device using the same

Pre-solder structure on semiconductor package substrate and method for fabricating the same

High performance RF inductors and transformers using bonding technique

Solder alloy and semiconductor device

Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods

Semiconductor device having radiation structure

Method of making microelectronic packages including electrically and/or thermally conductive element

Adaptable electronic storage apparatus

Semiconductor device and manufacturing method thereof

Film substrate, fabrication method thereof, and image display substrate

Semiconductor device and method of manufacturing same

Surface mountable hermetically sealed package

Wafer collective reliability evaluation device and wafer collective reliability evaluation method

METHOD FOR PRODUCING WEDGE-WEDGE WIRE CONNECTION

Bonding method, bonding apparatus and bonding program

Bonding pattern discrimination method, bonding pattern discrimination device and bonding pattern discrimination program

Interconnection device and system

Circuit substrate for packaging semiconductor device, method for producing the same, and method for producing semiconductor device package structure using the same

Semiconductor device

Method for interconnecting an integrated circuit multiple die assembly

Methods for stacking wire-bonded integrated circuit dice on flip-chip bonded integrated circuit dice

Semiconductor device, method for manufacturing the semiconductor device and semiconductor substrate

Junction member comprising junction pads arranged in matrix and multichip package using same

Semiconductor device

HYBRID INTEGRATED CIRCUIT DEVICE AND MANUFACTURING METHOD OF THE SAME

HYBRID INTEGRATED CIRCUIT DEVICE AND MANUFACTURING METHOD THEREOF

Flip chip assemblies and lamps of high power GaN LEDs, wafer level flip chip package process, and method of fabricating the same

Wafer level hermetic sealing method

ULTRA-FINE CONTACT ALIGNMENT

Method of manufacturing mounting boards

Method and apparatus for forming metal contacts on a substrate

Microparticle loaded solder preform allowing bond site control of device spacing at micron, submicron, and nanostructure scale

Hybrid integrated circuit device and method of manufacturing the same

Hermetic passivation structure with low capacitance

Masking layer in substrate cavity

Method of manufacturing a thermal conductive circuit board with grounding pattern connected to a heat sink

Semiconductor device and method of fabricating the same

Driver chip and display apparatus including the same

Integrated circuit device with multiple chips in one package

Semiconductor devices having stereolithographically fabricated protective layers thereon through which contact pads are exposed and assemblies including the same

Semiconductor device structures including protective layers formed from healable materials

Electronic component package

Semiconductor integrated circuit device

Microelectronic component assemblies and microelectronic component lead frame structures

Semiconductor device including semiconductor elements mounted on base plate

Quad flat flip chip package and leadframe thereof

Routing element for use in semiconductor device assemblies

Microelectronic component assemblies and microelectronic component lead frame structures

Routing element for use in multi-chip modules, multi-chip modules including the routing element and methods

Flipchip QFN package

Semiconductor device having passive component and support substrate with electrodes and through electrodes passing through support substrate

Semiconductor device

Fuse structure for semiconductor integrated circuit with improved insulation film thickness uniformity and moisture resistance

Semiconductor device using LED chip

Methods of making microelectronic assemblies

Method for compensating for CTE mismatch using phase change lead-free super plastic solders

Carrier, method of manufacturing a carrier and an electronic device

Semiconductor integrated circuit device

Stacked IC device having functions for selecting and counting IC chips

Surface acoustic wave device

UBM for fine pitch solder ball and flip-chip packaging method using the same

Semiconductor device and manufacturing method for the same

Semiconductor device having capacitors for reducing power source noise

Multilayer circuit carrier, panel, electronic device, and method for producing a multilayer circuit carrier

Low profile package having multiple die

Electronic device having wiring substrate and lead frame

Bumping electronic components using transfer substrates

Encapsulated semiconductor components and methods of fabrication

Alignment and orientation features for a semiconductor package

Method of manufacturing an electronic device, and electronic device

High frequency module

Method for fabricating a semiconductor interconnect having conductive spring contacts

Semiconductor element having protruded bump electrodes

Package circuit board with a reduced number of pins and package including a package circuit board with a reduced number of pins and methods of manufacturing the same

Stackable ceramic FBGA for high thermal applications

Multi-chip module and methods

Semiconductor device

Semiconductor device and manufacturing method thereof

Multi-part lead frame with dissimilar materials

Integrated circuit package for semiconductor devices having a reduced leadframe pad and an increased bonding area

Strobe light control circuit and IGBT device

Apparatus and methods for an underfilled integrated circuit package

Method for fabricating a warpage-preventive circuit board

Mounting structure of semiconductor chip, semiconductor device and method of making the semiconductor device

Electromagnetic wave absorber, method of manufacturing the same and appliance using the same

Semiconductor device, manufacturing method thereof and electronic equipment

Method of manufacturing a semiconductor device

Electronic circuit unit and method of fabricating the same

Semiconductor package

Method of manufacturing a semiconductor device

Leadless semiconductor package

Methods of providing solder structures for out plane connections

Integrated circuit package substrate having a thin film capacitor structure

Ceramic embedded wireless antenna

Chip packaging compositions, packages and systems made therewith, and methods of making same

Wire bonding package

Integrated circuit package substrate having a thin film capacitor structure

Dual semiconductor die package with reverse lead form

Microelectronic assemblies with composite conductive elements

Opto-electronic assembly having an encapsulant with at least two different functional zones

P and N contact pad layout designs of GaN based LEDs for flip chip packaging

Method and apparatus for trace shielding and routing on a substrate

Photocurable adhesive compositions, reaction products of which have low halide ion content

Electronic assembly including a die having an integrated circuit and a layer of diamond to transfer heat

Shielding arrangement to protect a circuit from stray magnetic fields

Power module with heat exchange

Inverted J-lead for power devices

Method for ball grid array chip packages having improved testing and stacking characteristics

Semiconductor device

Copper-based chip attach for chip-scale semiconductor packages

Arrangement with a semiconductor chip and support therefore and method for a bonded wire connection

Semiconductor packages for enhanced number of terminals, speed and power performance

Multi-die processor

Microelectronic device signal transmission by way of a lid

Light-emitting diode package structure

Bonding apparatus and bonding external appearance inspection device

Semiconductor packaging

Circuit board and method for manufacturing the same, semiconductor package, component built-in module and board for electronic equipment

Semiconductor device and method of manufacturing thereof

Method for reducing or eliminating semiconductor device wire sweep in a multi-tier bonding device and a device produced by the method

Semiconductor device package utilizing proud interconnect material

Semiconductor device and manufacturing method thereof

Lead-free integrated circuit package structure

Semiconductor package with a chip on a support plate

Low-power semiconductor chip with separated power ring, method for manufacturing the same, and method for controlling the same

Chip package and electrical connection structure between chip and substrate

Protective device

Wiring layout of auxiliary wiring package and printed circuit wiring board

Method for electrical interconnection of angularly disposed conductive patterns

Anisotropically electroconductive adhesive film, method for the production thereof, and semiconductor devices

Methods of reducing bleed-out of underfill and adhesive materials

Resonator device, electronic equipment provided with resonator device and method of manufacturing resonator device

Packages for image sensitive electronic devices

Substrate for mounting semiconductor chip, mounting structure of semiconductor chip, and mounting method of semiconductor chip

Stacked semiconductor device

Semiconductor interconnect having conductive spring contacts

Semiconductor device having curved leads offset from the center of bonding pads

Method of making multichip wafer level packages and computing systems incorporating same

Circuit module

Illumination assembly

Method and structure for controlled impedance wire bonds using co-dispensing of dielectric spacers

Semiconductor device including primary and secondary side circuits on first and second substrates with capacitive insulation

Semiconductor device and its manufacturing method, and semiconductor device manufacturing system

Wiring base with wiring extending inside and outside of a mounting region

Semiconductor device, electronic device, electronic apparatus, method of manufacturing semiconductor device, and method of manufacturing electronic device

Semiconductor chip, semiconductor device, circuit board, and electronic instrument

Multi-concentric pad arrangements for integrated circuit pads

Module assembly and method for stacked BGA packages

Highly reliable stack type semiconductor package

Lead frame, resin-encapsulated semiconductor device, and method of producing the same

Low loop height ball bonding method and apparatus

Methods and apparatus for integrated circuit device power distribution via internal wire bonds

Semiconductor/printed circuit board assembly, and computer system

Techniques for packaging multiple device components

Frame for semiconductor package

Microtransformer for system-on-chip power supply

Conductive bumps with insulating sidewalls and method for fabricating

Use of palladium in IC manufacturing with conductive polymer bump

Circuit device and manufacturing method thereof

Semiconductor package

Chip package structure and manufacturing method thereof

Semiconductor chip package and method

Multi-chip module

Integrated circuit carrier apparatus method and system

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Semiconductor integrated circuit

Etching method and method of manufacturing circuit device using the same

Transfer mold semiconductor packaging processes

Lead frame, method of manufacturing the same, and method of manufacturing a semiconductor device using the same

Quad flat flip chip packaging process and leadframe therefor

Hyperbga buildup laminate

Method for producing an adhesive bond and adhesive bond between a chip and a planar surface

Method of fabricating an interconnection for chip sandwich arrangements

FBGA arrangement

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Lead frame and semiconductor device having the same as well as method of resin-molding the same

Lead frame and semiconductor package with the same

Semiconductor device

Surface emitting laser package having integrated optical element and alignment post

Apparatus and method for mounting electronic components

Fabrication method of semiconductor package with heat sink

Process for strengthening semiconductor substrates following thinning

Stacked semiconductor device including improved lead frame arrangement

Radio frequency power amplifier module

Package structure with a retarding structure and method of making same

Semiconductor chip and semiconductor device including lamination of semiconductor chips

Semiconductor device

Multi-surface contact IC packaging structures and assemblies

Semiconductor circuit with multiple contact sizes

Multi-chip module

Semiconductor package for memory chips

Antenna-incorporated semiconductor device

Semiconductor device, process of producing semiconductor device, and ink jet recording head

Semiconductor device, electronic card and pad rearrangement substrate

Semiconductor device, electronic card and pad rearrangement substrate

Modular power semiconductor module

Plastic package and method of fabricating the same

Tape circuit substrate and semiconductor apparatus employing the same

Semiconductor package capable of absorbing electromagnetic wave

Semiconductor device and method of fabricating the same

Thin film light emitting diode

Semiconductor device and wire bonding method

Apparatus and method for depositing and reflowing solder paste on a microelectronic workpiece

Circuit device

Solderless electronics packaging and methods of manufacture

Use of a down-bond as a controlled inductor in integrated circuit applications

Method of forming multi-piled bump

Manufacturing method of ball grid array package

Circuit device

Use of an internal on-chip inductor for electrostatic discharge protection of circuits which use bond wire inductance as their load

Resin molded type semiconductor device and a method of manufacturing the same

Electronic component and panel and method for producing the same

Method for reduced input output area

RF circuit electrostatic discharge protection

Flip-chip light emitting diode package structure

Circuit device

Electromagnetic noise shielding in semiconductor packages using caged interconnect structures

Microelectronic component and assembly having leads with offset portions

Power module flip chip package

Wiring substrate for mounting semiconductor components

Chip scale package and method of fabricating the same

Method for fabricating a semiconductor package with multi layered leadframe

Radio frequency unit analog level detector and feedback control system

System and method for reducing or eliminating semiconductor device wire sweep

Method of manufacturing a semiconductor device

Thinned, strengthened semiconductor substrates and packages including same

RF amplifier

Resin-sealed semiconductor device

High-speed signaling interface and method for communicating across across an interface

Prevention of contamination on bonding pads of wafer during SMT

Semiconductor component and production method suitable therefor

Integrated circuit with copper interconnect and top level bonding/interconnect layer

Semiconductor device

Compact semiconductor device capable of mounting a plurality of semiconductor chips with high density and method of manufacturing the same

Tape circuit substrate and semicondutor chip package using the same

Chip package and electrical connection structure between chip and substrate

STRUCTURE OF WAFER LEVEL PACKAGE WITH AREA BUMP

Optimization of routing layers and board space requirements for a ball grid array package

Optimization of routing layers and board space requirements for a ball grid array land pattern

Semiconductor radiation emitter package

Vertically stacked pre-packaged integrated circuit chips

Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same

Ball grid array package with patterned stiffener surface and method of assembling the same

Integrally packaged imaging module

Printed circuit board unit with detachment mechanism for electronic component

Integrated optical filter

Integrated circuit package bond pad having plurality of conductive members

Quad flat no-lead package structure and manufacturing method thereof

Conductive trace structure and semiconductor package having the conductive trace structure

Semiconductor component and system having stiffener and circuit decal

Multichip wafer level packages and computing systems incorporating same

Transistor having multiple gate pads

Light emitting device assembly

Method of forming low wire loops and wire loops formed using the method

Method of mounting wafer on printed wiring substrate

Method of producing an electronic component and a panel with a plurality of electronic components

Semiconductor device and method for producing the same

Semiconductor device and electronic apparatus equipped with the semiconductor device

Spacerless die stacking

Package having integral lens and wafer-scale fabrication method therefor

Methods and apparatus for determining pad height for a wire-bonding operation in an integrated circuit

Fine pitch electronic flame-off wand electrode

Hybrid integrated circuit device and method of manufacturing the same

Method of manufacturing a module