Circuit carrier and production thereof

ULTRA-FINE CONTACT ALIGNMENT

Methods relating to forming interconnects and resulting assemblies

Method of manufacturing a semiconductor device and a fabrication apparatus for a semiconductor device

Optical device package with turning mirror and alignment post

Bridge connection type of chip package and fabricating method thereof

Package assembly for electronic device

Integrating chip scale packaging metallization into integrated circuit die structures

Integral heatsink ball grid array

Semiconductor package

Receptacle for a programmable, electronic processing device

Wafer-level packaging of optical receivers

Optical receiver package

Light emitting apparatus

Optoelectronic device packaging with hermetically sealed cavity and integrated optical element

Surface emitting laser package having integrated optical element and alignment post

Method of fabrication of semiconductor integrated circuit device

Wire bonding method and apparatus

Cooling system for a semiconductor device and method of fabricating same

Method for the lateral contacting of a semiconductor chip

Image sensor packages

Dynamic integrated circuit clusters, modules including same and methods of fabricating

Moisture-resistant electronic device package and methods of assembly

Semiconductor device capable of detecting an open bonding wire using weak current

Electrical circuit assembly with improved shock resistance

Dynamic integrated circuit clusters, modules including same and methods of fabricating

Super-thin high speed flip chip package

INTEGRATED ELECTRONIC CHIP AND INTERCONNECT DEVICE AND PROCESS FOR MAKING THE SAME

Method of fabricating integrated electronic chip with an interconnect device

Semiconductor device

High-frequency module and method for manufacturing the same

Semiconductor apparatus with decoupling capacitor

Lead frame

Light-emitting device with enlarged active light-emitting region

Semiconductor device and method of manufacturing thereof

Light-emitting device

Chip scale package structure for an image sensor

Method of locating conductive spheres utilizing screen and hopper of solder balls

Apparatus for locating conductive spheres utilizing screen and hopper of solder balls

Method for manufacturing a piezoelectric oscillator

Wire bonding method, semiconductor chip, and semiconductor package

Using benzocyclobutene based polymers as underfill materials

Integrated circuit, interface circuit used in the integrated circuit, and apparatus using the integrated circuit

Bonding pad design for impedance matching improvement

BGA package having semiconductor chip with edge-bonding metal patterns formed thereon and method of manufacturing the same

Stacked chip package having upper chip provided with trenches and method of manufacturing the same

Semiconductor package having high quantity of I/O connections and method for fabricating the same

Lead frame, manufacturing method of the same, and semiconductor device using the same

LOOK DOWN IMAGE SENSOR PACKAGE

Copper paste and wiring board using the same

Electrical contact and connector and method of manufacture

Ball film for integrated circuit fabrication and testing

Method of making a circuitized substrate

Heat sink structure with embedded electronic components for semiconductor package

Resin-encapsulated package, lead member for the same and method of fabricating the lead member

Semiconductor device with staggered electrodes and increased wiring width

Integrated circuit device with embedded passive component by flip-chip connection and method for manufacturing the same

Buried solder bumps for AC-coupled microelectronic interconnects

Semiconductor device, semiconductor module and method of manufacturing semiconductor device

Tape circuit substrate and semiconductor chip package using the same

Zero capacitance bondpad utilizing active negative capacitance

Pad structures including insulating layers having a tapered surface

Semiconductor device

Leadless semiconductor package

Chip stack package and manufacturing method thereof

High-frequency chip packages

Integrated circuit package having inductance loop formed from a bridge interconnect

Integrated circuit package having inductance loop formed from same-pin-to-same-bonding-pad structure

Integrated circuit package having an inductance loop formed from a multi-loop configuration

Light emitting diode with high heat dissipation

Semiconductor light-emitting device having a semiconductor light-emitting element mounted on a substrate with anisotropically conductive adhesive interposed therebetween

IC card

Stacked microfeature devices and associated methods

Optimization of routing layers and board space requirements for ball grid array package implementations including array corner considerations

Programmed material consolidation processes for protecting intermediate conductive structures

Semiconductor device and method for production thereof

Photo-semiconductor module and method for manufacturing the same

Methods for processing semiconductor devices in a singulated form

Information media using information of defect in an article

Boron nitride agglomerated powder

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Apparatus and method to reduce signal cross-talk

Semiconductor wafer, semiconductor device and method of manufacturing the same, circuit board, and electronic equipment

Coolant cooled type semiconductor device

Circuit device

Interconnect substrate, semiconductor device, methods of fabricating, inspecting, and mounting the semiconductor device, circuit board, and electronic instrument

Semiconductor component having dummy segments with trapped corner air

Substantially hermetic packages for semiconductor devices and substantially hermetically packaged, semiconductor devices

Semiconductor device including a semiconductor chip mounted on a metal base

Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board

Singulation method used in leadless packaging process

Semiconductor package substrate having contact pad protective layer formed thereon and method for fabricating the same

Electrochemical cell and fabrication method of the same

Electronic component and method for manufacturing the same

Electrical package capable of increasing the density of bonding pads and fine circuit lines inside a interconnection

Bump transfer fixture

Stacked chip assembly with encapsulant layer

Method for fabricating semiconductor components using mold cavities having runners configured to minimize venting

Probe card assembly

Process to allow electrical and mechanical connection of an electrical device with a face equipped with contact pads

Methods for wafer-level packaging of microelectronic devices and microelectronic devices formed by such methods

Methods for securing components of semiconductor device assemblies to each other with hybrid adhesive materials

Electronic circuit device

Semiconductor memory module

High frequency circuit module

Method for mounting surface acoustic wave element and surface acoustic wave device having resin-sealed surface acoustic wave element

Semiconductor device and wire bonding apparatus

Solder masks including dams for at least partially surrounding terminals of a carrier substrate and recessed areas positioned adjacent to the dams, and carrier substrates including such solder masks

Multi-chip module

Multi-functional solder and articles made therewith, such as microelectronic components

Integrated circuit package with overlapping bond fingers

Semiconductor device and an electronic device

Solid-state image sensor including a microlens

Module with embedded semiconductor IC and method of fabricating the module

Lead-frame-based semiconductor package and fabrication method thereof

Leadframe and semiconductor package made using the leadframe

Semiconductor package including flip chip

Semiconductor module and DC-DC converter

Molded ball grid array

Semiconductor die packages with recessed interconnecting structures

Semiconductor device and method of manufacturing the same

Multi-functional solder and articles made therewith, such as microelectronic components

Wire bonders and methods of wire-bonding

Multi-functional solder and articles made therewith, such as microelectronic components

Method for producing a semiconductor device in chip format

Integrated underfill process for bumped chip assembly

Methods for consolidating previously unconsolidated conductive material to form conductive structures or contact pads or secure conductive structures to contact pads

Ultrathin leadframe BGA circuit package

Conductive block mounting process for electrical connection

Packaged microelectronic components

Method of manufacturing a semiconductor device

Substrate material for mounting a semiconductor device, substrate for mounting a semiconductor device, semiconductor device, and method of producing the same

Low-inductance circuit arrangement for power semiconductor modules

Voltage protection device

Electronic component protected against electrostatic discharges

High frequency circuit using high output amplifier cell block and low output amplifier cell block

Multi-chip module having bonding wires and method of fabricating the same

Multi-chips module package and manufacturing method thereof

Semiconductor device and its manufacturing method

Semiconductor chip package and stacked module having a functional part and packaging part arranged on a common plane

Packaged microelectronic devices and methods of forming same

Multi media card formed by transfer molding

Standoffs for centralizing internals in packaging process

Printed wiring board and manufacturing method therefor

Intermediate substrate, intermediate substrate with semiconductor element, substrate with intermediate substrate, and structure having semiconductor element, intermediate substrate and substrate

Laminated wiring board and its mounting structure

Apparatus used to package multimedia card by transfer molding

Method for forming bump protective collars on a bumped wafer

Method and apparatus for attaching microelectronic substrates and support members

Method for making electronic devices including silicon and LTCC and devices produced thereby

Multiple substrate microelectronic devices and methods of manufacture

Optoelectronic module with transmitter chip and connecting piece for the module with respect to an optical fiber and with respect to a circuit board, and methods for producing the same

Computer system including at least one stress balanced semiconductor package

Memory package

Signal transmission structure having a non-reference region for matching to a conductive ball attached to the signal transmission structure

Method and apparatus for processing semiconductor devices in a singulated form

Semiconductor component of semiconductor chip size with flip-chip-like external contacts, and method of producing the same

Electronic assembly having a die with rounded corner edge portions and a method of fabricating the same

Semiconductor device with connections for bump electrodes

Structure of multi-tier wire bonding for high frequency integrated circuit

Semiconductor device voltage supply for a system with at least two, especially stacked, semiconductor devices

Method of stacking semiconductor element in a semiconductor device

Semiconductor device and switching element

[MULTI-CHIP PACKAGE]

Method for forming a chip package

Process for fabricating a semiconductor package and semiconductor package with leadframe

Semiconductor device and method for manufacturing the same

Method for optimizing routing layers and board space requirements for a ball grid array land pattern

Substrate holder and plating apparatus

Methods for protecting intermediate conductive elements of semiconductor device assemblies

Manufacturing process of memory module with direct die-attachment

Method for processing semiconductor devices in a singulated form

Electronic component-built-in module

Semiconductor assembly encapsulation mold and method for forming same

Chip package structure

Semiconductor device, semiconductor module, electronic device and electronic equipment, and method for manufacturing semiconductor module

Semiconductor interconnect having compliant conductive contacts

Wiring board, stacked wiring board and method of manufacturing the same, semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Semiconductor unit with cooling system

Power semiconductor device with a control circuit board that includes filled through holes

Multiple die stack apparatus employing T-shaped interposer elements

BGA package with stacked semiconductor chips and method of manufacturing the same

Modular power semiconductor module

Microelectronic component assemblies employing lead frames having reduced-thickness inner lengths

Semiconductor device having a flip-chip construction

Semiconductor device wiring structure

Method of fabricating an electronic device

Method and apparatus for generating a device ID for stacked devices

Method for forming a bonding pad of a semiconductor device including a plasma treatment

Underfill and encapsulation of carrier substrate-mounted flip-chip components

Stereolithographic methods for fabricating hermetic semiconductor device packages and semiconductor devices including stereolithographically fabricated hermetic packages

Process for producing semiconductor device and semiconductor device

Method of manufacturing semiconductor device and semiconductor device manufacturing apparatus used in it

Method of fabrication of stacked semiconductor devices

IC module and IC card

Methods for forming a high performance capacitor

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Semiconductor device and method of manufacturing the same

Substrate-less microelectronic package

Semiconductor device, electronic device, electronic apparatus, and method of manufacturing semiconductor device

Semiconductor device

Method for packaging electronic modules and multiple chip packaging

In-line apparatus and method for manufacturing double-sided stacked multi-chip packages

Semiconductor packages for enhanced number of terminals, speed and power performance

Selective consolidation processes for electrically connecting contacts of semiconductor device components

Die package

Lead frame and semiconductor device using the same

Semiconductor package containing an integrated-circuit chip supported by electrical connection leads

Method of fabricating semiconductor memory device and semiconductor memory device driver

Method for opening the plastic housing of an electronic module

Thin stacked package and manufacturing method thereof

Microelectronic package

Semiconductor device, stacked semiconductor device, methods of manufacturing them, circuit board, and electronic instrument

Integrated circuit carrier

Chip scale package and method of fabricating the same

Semiconductor device, electronic device, electronic equipment, and method of manufacturing semiconductor device

Substrate for semiconductor package and wire bonding method using thereof

Adhesion enhanced semiconductor die for mold compound packaging

Leadless leadframe package substitute and stack package

Metal carrier (leadframe) for receiving and contact-connecting electrical and/or optoelectronic components

Semiconductor device with pixel portion and driving circuit, and electronic device

Method of mounting electronic part and flux-fill