Details of semiconductor or other solid state devices; Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements; Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks; Cooling facilitated by shape of device Foil-like cooling fins or heat sinks
THERMAL MANAGEMENT SOLUTION FOR POWER STAGE COMPRISING TOP-COOLED POWER SEMICONDUCTOR SWITCHING DEVICES
#2SEMICONDUCTOR DEVICE
#3SEMICONDUCTOR DEVICE WITH INTEGRATED HEAT DISTRIBUTION AND MANUFACTURING METHOD THEREOF
#4PACKAGE LID INCLUDING A MULTI-LAYER STRUCTURE FOR HEAT DISSIPATION AND METHODS OF FORMING THE SAME
#5INTEGRATED HYBRID HEAT SPREADER MANUFACTURING METHOD AND THEREOF
#6INTEGRATION OF SEMICONDUCTOR DEVICE ASSEMBLIES WITH THERMAL DISSIPATION MECHANISMS
#7POWER MODULE
#8PACKAGE CARRIER PLATE WITH EMBEDDED EFFICIENT HEAT DISSIPATION MODULE AND MANUFACTURING METHOD THEREFOR
#9SEMICONDUCTOR MODULE
#10Power Semiconductor Device, Method for Manufacturing Same, and Power Conversion Device
#11THERMAL CONDUCTIVE MEMBER FOR A HEAT SINK
#12HEAT DISSIPATION FOR SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURE
#13SINGLE SWITCH DIRECT COOLING ASSEMBLIES AND RELATED METHODS
#14EMBEDDED AND PACKAGED HEAT DISSIPATION STRUCTURE AND MANUFACTURING METHOD THEREFOR, AND SEMICONDUCTOR
#15SYSTEMS AND METHODS FOR COOLING ULTRASOUND TRANSDUCERS AND ULTRASOUND TRANSDUCER ARRAYS
#16SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#17SEMICONDUCTOR MODULE
#18THERMAL MANAGEMENT OF THREE-DIMENSIONAL INTEGRATED CIRCUITS
#19Asic Package With Photonics And Vertical Power Delivery
#20THERMAL MANAGEMENT OF GPU-HBM PACKAGE BY MICROCHANNEL INTEGRATED SUBSTRATE
#21Printed circuit board
#22MEMORY DEVICE AND METHOD OF ASSEMBLING SAME
#23BACKSIDE POWER DELIVERY NETWORK
#24MOLDED POWER MODULES WITH FLUIDIC-CHANNEL COOLED SUBSTRATES
#25DIRECT-COOLING FOR SEMICONDUCTOR DEVICE MODULES
#26SEMICONDUCTOR PACKAGE
#27BOND WIRE RELIABILITY AND PROCESS WITH HIGH TEHRMAL PERFORMANCE IN SMALL OUTLINE PACKAGE
#28SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES
#29KNOCKDOWN HEAT SINK STRUCTURE
#30INTEGRATED HYBRID HEAT DISSIPATION SYSTEM THAT MAXIMIZES HEAT TRANSFER FROM HETEROGENEOUS INTEGRATION
#31COOLED SYSTEM-ON-WAFER WITH MEANS FOR REDUCING THE EFFECTS OF ELECTROSTATIC DISCHARGE AND/OR ELECTROMAGNETIC INTERFERENCE
#32Liquid cooling device for memory module
#33POWER SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD
#34SEMICONDUCTOR MODULE
#35IC DIE AND HEAT SPREADERS WITH SOLDERABLE THERMAL INTERFACE STRUCTURES FOR MULTI-CHIP ASSEMBLIES INCLUDING SOLDER ARRAY THERMAL INTERCONNECTS
#36SEMICONDUCTOR PACKAGE FOR ENHANCED COOLING
#37POWER AMPLIFIER PACKAGES CONTAINING ELECTRICALLY-ROUTED LIDS AND METHODS FOR THE FABRICATION THEREOF
#38SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE
#39THERMALLY-CONDUCTIVE SHEET AND ELECTRONIC DEVICE
#40INTEGRATED SUBSTRATES AND RELATED METHODS
#41INTRA-BONDING SEMICONDUCTOR INTEGRATED CIRCUIT CHIPS
#42Package having component carrier with cavity and electronic component as well as functional filling medium therein
#43POWER SUPPLY SYSTEM AND POWER SUPPLY MODULE
#44SYSTEMS AND METHODS FOR ACTIVE AND PASSIVE COOLING OF ELECTRICAL COMPONENTS
#45SEMICONDUCTOR DEVICE
#46INTEGRATED CIRCUIT PACKAGE HEAT SINK
#47POWER MODULE APPARATUS, COOLING STRUCTURE, AND ELECTRIC VEHICLE OR HYBRID ELECTRIC VEHICLE
#48Array of heat-sinked power semiconductors
#49SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE, AND POWER CONVERSION DEVICE
#50FILTERING STRUCTURE AND ELECTRONIC DEVICE
#51POWER CHIP PACKAGE AND POWER MODULE
#523D PACKAGING WITH SILICON DIE AS THERMAL SINK FOR HIGH-POWER LOW THERMAL CONDUCTIVITY DIES
#53SEMICONDUCTOR MODULE COMPRISING AT LEAST ONE SEMICONDUCTOR ELEMENT
#54Apparatus and Methods for Processing Exfoliated Graphite Materials
#55NITRIDE SEMICONDUCTOR DEVICE
#56Semiconductor Device and Method of Heat Dissipation Using Graphene
#57Semiconductor structure and manufacturing method thereof
#58TECHNOLOGIES FOR ISOLATED HEAT DISSIPATING DEVICES
#59POWER SEMICONDUCTOR MODULE ARRANGEMENT AND METHOD FOR FORMING THE SAME
#60SEMICONDUCTOR DEVICE AND METHOD FORMING THE SAME
#61POWER MODULE
#62DUAL-SIDE COOLED EMBEDDED DIE PACKAGING FOR POWER SEMICONDUCTOR DEVICES
#63THERMAL MANAGEMENT OF THREE-DIMENSIONAL INTEGRATED CIRCUITS
#64Power Semiconductor Device, Power Conversion Device, and Electric System
#65HEAT REMOVAL IN INTEGRATED CIRCUITS WITH TRANSISTORS AND DOUBLE-SIDED METAL INTERCONNECTS
#66SEMICONDUCTOR PACKAGE INCLUDING LID WITH INTEGRATED HEAT PIPE FOR THERMAL MANAGEMENT AND METHODS FOR FORMING THE SAME
#67PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
#68PACKAGING UNIT FOR DIRECT COOLING OF SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#69NITRIDE-BASED SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING THE SAME
#70HEAT DISSIPATION STRUCTURES
#71COOLING DEVICE
#72SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURING METHOD
#73SEMICONDUCTOR DEVICE
#74BUSBAR WITH DIELECTRIC COATING
#75INTEGRATED CIRCUIT SUBSTRATE DESIGN WITH INTEGRATED POWER CONVERTER MODULE AND METHOD OF MANUFACTURING THEREOF
#76Structured Microchannel Cooling technology by utilizing a novel hard mask pattern transfer fabrication process
#77SEMICONDUCTOR DEVICE
#78WELDING-TYPE POWER SUPPLIES WITH EXPANDABLE THERMAL INTERFACES
#79COMPOUND SEMICONDUCTOR DEVICES COMBINED IN A FACE-TO-FACE ARRANGEMENT
#80VAPOR CHAMBER INTEGRATED HEAT SPREADER (IHS) WITH LIQUID RESERVOIR
#81POWER MODULE FOR VEHICLE AND METHOD OF MANUFACTURING THE SAME
#82PACKAGING ARCHITECTURE WITH ACTIVE COOLING
#83SUBSTRATES FOR POWER STAGE ASSEMBLIES COMPRISING BOTTOM-COOLED SEMICONDUCTOR POWER SWITCHING DEVICES
#84ANTENNA MODULES EMPLOYING THREE-DIMENSIONAL (3D) BUILD-UP ON MOLD PACKAGE TO SUPPORT EFFICIENT INTEGRATION OF RADIO-FREQUENCY (RF) CIRCUITRY, AND RELATED FABRICATION METHODS
#85POWER MODULE PACKAGE AND METHOD OF FORMING THE SAME
#86SEMICONDUCTOR PACKAGE INCLUDING HEAT RADIATION STRUCTURE, COOLING SYSTEM APPLYING THE SEMICONDUCTOR PACKAGE, SUBSTRATE INCLUDING HEAT RADIATION STRUCTURE AND METHOD OF MANUFACTURING THE SUBSTRATE
#87RESIN-SEALED SEMICONDUCTOR DEVICE
#88Methods for establishing thermal joints between heat spreaders or lids and heat sources
#89SEMICONDUCTOR APPARATUS AND VEHICLE
#90THERMAL INTERFACE MATERIALS FOR THE INTERIOR, CENTER, AND EXTERIOR OF AN ELECTRONIC COMPONENT
#91Power supply system
#92SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE
#93POWER SEMICONDUCTOR MODULE COMPRISING A SUBSTRATE, POWER SEMICONDUCTOR COMPONENTS AND COMPRISING A PRESSURE BODY
#94THERMOELECTRIC COOLING FOR DIE PACKAGES
#95SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#96Self-cleaning heatsink for electronic components
#97ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
#98Flexible transistors with near-junction heat dissipation
#99A Heat Exchanger and Uses Thereof
#100DOUBLE PATTERNED MICROCOOLER HAVING ALTERNATING FIN WIDTHS
#101MEMORY UNIT, SEMICONDUCTOR MODULE, DIMM MODULE, AND MANUFACTURING METHOD FOR SAME
#102HEAT SINK WITH TURBULENT STRUCTURES
#103POWER SEMICONDUCTOR DEVICE AND POWER CONVERSION DEVICE
#104SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#105INTEGRATED DEVICE PACKAGE WITH AN INTEGRATED HEAT SINK
#106FACE-TO-FACE THROUGH-SILICON VIA MULTI-CHIP SEMICONDUCTOR APPARATUS WITH REDISTRIBUTION LAYER PACKAGING AND METHODS OF ASSEMBLING SAME
#107Method for manufacturing a power module unit
#108Semiconductor package thermal spreader having integrated EF/EMI shielding and antenna elements
#109POWER MODULE, POWER SEMICONDUCTOR DEVICE, AND MANUFACTURING METHODS THEREFOR
#110POWER CONVERTER, MOTOR DRIVE CONTROLLER, BLOWER, COMPRESSOR, AND AIR CONDITIONER
#111INTEGRATED CIRCUIT PACKAGES WITH ON PACKAGE MEMORY ARCHITECTURES
#112SEMICONDUCTOR DEVCIE AND MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
#113PACKAGE FOR SEVERAL INTEGRATED CIRCUITS
#114CHIP PACKAGE STRUCTURE, CHIP PACKAGE SYSTEM, AND METHOD OF FORMING A CHIP PACKAGE STRUCTURE
#115INTEGRATED CIRCUIT PACKAGE
#1163D stacked compute and memory with copper-to-copper hybrid bond
#117SEMICONDUCTOR MODULE
#118Semiconductor package including lid with integrated heat pipe for thermal management and methods for forming the same
#119POWER SEMICONDUCTOR COOLING ASSEMBLY
#120Thermal management of three-dimensional integrated circuits
#121Thermal management of three-dimensional integrated circuits
#122SEMICONDUCTOR DEVICE AND POWER CONVERTER
#123Layered bonding material, semiconductor package, and power module
#124METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO CONTROL LOAD DISTRIBUTION OF INTEGRATED CIRCUIT PACKAGES
#125heat dissipation and electrical robustness in a three-dimensional package of stacked integrated circuits
#126CHIP PACKAGE ASSEMBLY, ELECTRONIC DEVICE, AND PREPARATION METHOD OF CHIP PACKAGE ASSEMBLY
#127SEMICONDUCTOR DEVICE AND INVERTER DEVICE
#128IMAGING DEVICE
#129PHOTONIC INTEGRATED CIRCUIT COOLING WITH A THERMAL DIE
#130SUBSTRATE CAVITY WITH STEPPED WALLS
#131THERMALLY CONDUCTIVE AND ELECTRICALLY INSULATING SUBSTRATE
#132HEAT DISSIPATION SHEET, HEAT DISSIPATION SHEET LAYERED BODY, STRUCTURE, AND METHOD FOR DISSIPATING HEAT FROM HEAT-GENERATING ELEMENT
#133Topside heatsinking antenna launcher for an integrated circuit package
#134POWER SEMICONDUCTOR MODULE
#135THERMALLY CONDUCTIVE SHEET AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
#136Semiconductor package thermal spreader having integrated RF/EMI shielding and antenna elements
#137SEMICONDUCTOR PACKAGE
#138SOLID METAL FOAM THERMAL INTERFACE MATERIAL
#139INTEGRATED CIRCUIT PACKAGE INTERPOSERS WITH PHOTONIC & ELECTRICAL ROUTING
#140NITRIDE-BASED SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING THE SAME
#141Heat dissipation for semiconductor devices and methods of manufacture
#142Integrated circuit package with heatsink
#143Power semiconductor module arrangement
#144Power semiconductor apparatus and method for manufacturing the same
#145SEMICONDUCTOR DEVICE PACKAGE HAVING THERMAL DISSIPATION FEATURE AND METHOD THEREFOR
#146Bonding Passive Devices on Active Dies to Form 3D Packages
#147SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
#148POWER MODULE
#149Heat transfer system and electric or optical component
#150Heat dissipation apparatus, remote radio unit, baseband processing unit and base station
#151Package structure and method of fabricating the same
#152INTEGRATED CIRCUIT PACKAGE SYSTEM
#153Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure
#154COOLING APPARATUS AND SEMICONDUCTOR MODULE
#155Thermal peak suppression device
#156SEMICONDUCTOR PACKAGE
#157Semiconductor package having a stiffener ring
#158Arrangement of a power semiconductor module and a cooler
#159WATER-COOLING DEVICE WITH COMPOSITE HEAT-DISSIPATING STRUCTURE
#160Semiconductor device and manufacturing method thereof
#161THERMAL INTERFACE MATERIAL CONTAINMENT
#162Heat dissipation device
#163HEAT DISSIPATING SUBSTRATE, MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR INTEGRATED DEVICE INCLUDING THE SAME
#164DIRECT-COOLING FOR SEMICONDUCTOR DEVICE MODULES
#165Semiconductor apparatus and manufacturing method of semiconductor apparatus
#166STACKED SEMICONDUCTOR DIE ASSEMBLIES WITH HIGH EFFICIENCY THERMAL PATHS AND MOLDED UNDERFILL
#167SEMICONDUCTOR DEVICE INCLUDING AN ANTENNA
#168Linear spacer for spacing a carrier of a package
#169ASIC package with photonics and vertical power delivery
#170Method of Forming a Chip Package, Method of Forming a Semiconductor Arrangement, Chip Package, and Semiconductor Arrangement
#171Semiconductor module, power semiconductor module, and power electronic equipment using the semiconductor module or the power semiconductor module
#172Electronic component and semiconductor device
#173Welding-type power supplies with expandable thermal interfaces
#174Grid array connector system
#175Semiconductor package having improved thermal interface between semiconductor die and heat spreading structure
#176POWER MODULE
#177Wafer-level integrated micro-structured heat spreaders
#178Power semiconductor cooling system
#179SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR APPARATUS MANUFACTURING METHOD
#180Tubular heat spreaders for memory modules and memory modules incorporating the same
#181Power overlay module and method of assembling
#182Stiffener for die crack prevention in semiconductor packages
#183Direct write, high conductivity MMIC attach
#184METHOD FOR PRODUCING A POWER MODULE UNIT, POWER MODULE UNIT, NETWORK PART AND FREQUENCY CONVERTER
#185SEMICONDUCTOR PACKAGE WITH STIFFENER
#186Semiconductor device
#187SEMICONDUCTOR DEVICE ASSEMBLIES AND SYSTEMS WITH INTERNAL THERMAL BARRIERS AND METHODS FOR MAKING THE SAME
#188SEMICONDUCTOR DEVICES WITH THERMAL BUFFER STRUCTURES
#189Chip on film package and display apparatus including the same
#190Semiconductor device
#191Heat transfer device
#192SEMICONDUCTOR DEVICE
#193Heater elements for processor devices
#194Heat sink assembly for an electrical component
#195Power semiconductor device
#196Arrangement for conducting heat away from an electronic component
#197Thermal management of GPU-HBM package by microchannel integrated substrate
#198HEAT DISSIPATING STRUCTURES AND ELECTRONIC CONTROL UNITS HAVING THE HEAT DISSIPATING STRUCTURES
#199FACE-TO-FACE THROUGH-SILICON VIA MULTI-CHIP SEMICONDUCTOR APPARATUS WITH REDISTRIBUTION LAYER PACKAGING AND METHODS OF ASSEMBLING SAME
#200Advanced integrated passive device (IPD) with thin-film heat spreader (TF-HS) layer for high power handling filters in transmit (TX) path
#201Module with connection lugs for supply lines
#202RADIATOR
#203Heat dissipation structures
#204TECHNOLOGIES FOR RECONFIGURABLE HEAT SINKS
#205Flexible transistors with near-junction heat dissipation
#206Welding-type power supplies with expandable thermal interfaces
#207Electronic control device having a heat radiation structure
#208Heat sink with turbulent structures
#209Integration of power and optics through cold plate for delivery to electronic and photonic integrated circuits
#210Package with clip and connector above electronic components
#211IC die and heat spreaders with solderable thermal interface structures for multi-chip assemblies including solder array thermal interconnects
#212IC die with solderable thermal interface structures for assemblies including solder array thermal interconnects
#213Silicon Carbide Module Integrated with Heat Sink and the Method Thereof
#214CHIP HEAT DISSIPATING STRUCTURE, CHIP STRUCTURE, CIRCUIT BOARD AND SUPERCOMPUTING DEVICE
#215Integrated radiator having temperature gradient
#216Apparatus and method for dissipating heat in multiple semiconductor device modules
#217HEAT SPREADER FOR A MEMORY MODULE
#218Semiconductor device with integrated heat distribution and manufacturing method thereof
#219CUSTOMIZED INTEGRATED HEAT SPREADER DESIGN WITH TARGETED DOPING FOR MULTI-CHIP PACKAGES
#220Self-cleaning heatsink for electronic components
#221Integration of semiconductor device assemblies with thermal dissipation mechanisms
#222Stacked silicon package assembly having thermal management
#223FLUID-BASED COOLING DEVICE FOR COOLING AT LEAST TWO DISTINCT FIRST HEAT-GENERATING ELEMENTS OF A HEAT SOURCE ASSEMBLY
#224Integrated circuit (IC) packages employing a thermal conductive package substrate with die region split, and related fabrication methods
#225Silicon heat-dissipation package for compact electronic devices
#226Die heat dissipation structure
#227THERMAL MANAGEMENT FOR ELECTRONICS USING NONCONDUCTIVE MAGNETIC PARTICLES
#228Power supply system
#229HEAT SPREADING PLATE HAVING ATLEAST ONE COOLING FIN METHOD FOR PRODUCING A HEAT SPREADING PLATE HAVING ATLEAST ONE COOLING FIN ELECTRONIC MODULE
#230High heat flux power electronics cooling design
#231METHOD FOR PRODUCING A HEAT-SPREADING PLATE, HEAT-SPREADING PLATE, METHOD FOR PRODUCING A SEMICONDUCTOR MODULE AND SEMICONDUCTOR MODULE
#232Methods for establishing thermal joints between heat spreaders or lids and heat sources
#233METHODS AND APPARATUS FOR WAFER-LEVEL PACKAGING USING DIRECT WRITING
#234SEMICONDUCTOR DEVICE
#235Full package vapor chamber with IHS
#236Semiconductor device having circuit board interposed between two conductor layers
#237Package wrap-around heat spreader
#238Bottom-side heatsinking waveguide for an integrated circuit package
#239IGBT module with heat dissipation structure having ceramic layers corresponding in position and in area to chips
#240Topside heatsinking antenna launcher for an integrated circuit package
#241RF shielding can with integral spring fingers
#242Fluid channel, power semiconductor module and method for fabricating a power semiconductor module
#243THERMALLY CONDUCTIVE ELECTRONIC PACKAGING
#244RF devices with enhanced performance and methods of forming the same
#245Method for forming hermetic package for a power semiconductor
#246COOLING ARRANGEMENT FOR ELECTRICAL COMPONENTS, CONVERTER WITH A COOLING ARRANGEMENT, AND AIRCRAFT HAVING A CONVERTER
#247Power module having a power electronics device on a substrate board, and power electronics circuit having such a power module
#248Low parasitic inductance power module and double-faced heat-dissipation low parasitic inductance power module
#249Semiconductor package and PoP type package
#250Cooling device
#251Ultrasonic additively manufactured coldplates on heat spreaders
#252Heat sink and assembly method for heat sink
#253Integrated circuit chip device with thermal control
#254Power module apparatus, cooling structure, and electric vehicle or hybrid electric vehicle
#255Fixture facilitating heat sink fabrication
#256Systems and methods for cooling ultrasound transducers and ultrasound transducer arrays
#257Heat sink with coiled metal-wire material
#258Centrifugal fan
#259Heat exchange assembly for a communication system
#260Heat dissipation system
#261Heat-sinking improved structure for evaporators
#262ASIC package with photonics and vertical power delivery
#263Semiconductor module and method for producing the same
#264HEAT SINK HAVING PRESS-RIVETING STRUCTURE
#265POWER MODULE SUBSTRATE, POWER MODULE SUBSTRATE WITH HEAT SINK, POWER MODULE, METHOD OF PRODUCING POWER MODULE SUBSTRATE, PASTE FOR COPPER SHEET BONDING, AND METHOD OF PRODUCING BONDED BODY
#266Bonding passive devices on active device dies to form 3D packages
#267Semiconductor assembly and method of producing the semiconductor assembly
#268Manufacturing method of insulated metal substrate
#269Insulated metal substrate
#270Thermal management in integrated circuit packages
#271Tubular heat spreaders for memory modules and memory modules incorporating the same
#272PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
#273Semiconductor device
#274Semiconductor module structure
#275Selectively-pliable chemical vapor deposition (CVD) diamond or other heat spreader
#276Semiconductor device with lead frame that accommodates various die sizes
#277Stacked semiconductor package having heat dissipation structure
#278Semiconductor device
#279Integrated circuit package lids with polymer features
#280Charging plug for a charging station for transferring electric energy and a charging system therefor
#281Thermally conductive insulator
#282Semiconductor package structure
#283Semiconductor device
#284SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR DEVICE INCLUDING THE SAME
#285Integrated circuit chip design for symmetric power delivery
#286Heat dissipation structure
#287Method for manufacturing semiconductor device with metallization structure
#288Semiconductor package
#289Semiconductor device package and method for manufacturing the same
#290ELECTRONIC MODULE FOR POWER CONTROL
#291Integrated circuit packages with patterned protective material
#292Spacer structure for double-sided-cooled power module and method of manufacturing the same
#293Electronic assembly with phase-change material for thermal performance
#294Semiconductor package with floating heat spreader and process for making the same
#295Power semiconductor module
#296Manufacturing method of integrated circuit packaging structure
#297Semiconductor module
#298Semiconductor device
#299Condensation resistant power semiconductor module
#300Method of making flexible semiconductor device with graphene tape