Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of - , e.g. forming hybrid circuits the devices being mounted on two or more different substrates
DISPLAY DEVICE
#2Pluggable CPU Modules with Vertical Power
#3SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
#4SEMICONDUCTOR DEVICE
#5DISCRETE DEVICE INTERCONNECTIONS BETWEEN STACKED SUBSTRATES
#6INTEGRATED DEVICE COMPRISING PLATE INTERCONNECTS AND A MAGNETIC MATERIAL
#7INVERTER POWER MODULE
#8INTELLIGENT POWER MODULE, ELECTRIC VEHICLE OR HYBRID VEHICLE, AND METHOD OF ASSEMBLING INTELLIGENT POWER MODULE
#9AIR COOLED COMPACT POWER SYSTEMS
#10LIGHT-EMITTING DEVICE
#11PIXEL DEVICE AND DISPLAY APPARATUS HAVING THE SAME
#12ELECTRONIC DEVICE
#13ELECTRICAL CONNECTION STRUCTURE AND ELECTRONIC DEVICE COMPRISING THE SAME
#14CIRCUIT MODULE
#15Semiconductor Device and Method of Making a Semiconductor Package with Graphene-Coated Interconnects
#16ELECTRONIC PACKAGE WITH INTEGRATED INTERCONNECT STRUCTURE
#17ELECTRONIC PACKAGE
#18Tiling Display Device
#19Asic Package With Photonics And Vertical Power Delivery
#20METHOD FOR BONDING AND INTERCONNECTING MICRO-ELECTRONIC COMPONENTS
#21SEMICONDUCTOR PACKAGE
#22SEMICONDUCTOR PACKAGE
#23Semiconductor Device and Method of Die Attach with Adhesive Layer Containing Graphene-Coated Core
#24SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
#25SEMICONDUCTOR DEVICE AND CIRCUIT BOARD
#26DOUBLE-SIDED MULTICHIP PACKAGES
#27SEMICONDUCTOR DEVICE PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
#28CHIP PACKAGE WITH CORE EMBEDDED INTEGRATED PASSIVE DEVICE
#29SPLICING DISPLAY PANEL
#30SEMICONDUCTOR DEVICE AND IGNITION DEVICE
#31ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
#32Package-On-Package Assembly Containing A Decoupling Capacitor
#33Chip-On-Wafer Assembly Containing A Decoupling Capacitor
#34PACKAGE EDGE PASSIVE COMPONENT ARRAY FOR IMPROVED POWER INTEGRITY
#35CIRCUIT MODULE
#36ELECTRONIC PACKAGE WITH INTEGRATED INTERCONNECT STRUCTURE
#37ELECTRONIC PACKAGE
#38ELECTRONIC PACKAGE
#39ELECTRONIC MODULE AND ELECTRONIC APPARATUS
#40METHOD FOR FORMING A SHIELDING LAYER ON A SEMICONDUCTOR DEVICE
#41Semiconductor Device and Method of Stacking Hybrid Substrates with Embedded Electric Components
#42DIE PACKAGE WITH SEALED DIE ENCLOSURES
#43POWER MODULE PACKAGE WITH STACKED DIRECT BONDED METAL SUBSTRATES
#44ELECTRONIC CIRCUIT PACKAGES
#45SEMICONDUCTOR PACKAGE ASSEMBLY
#46MODULAR SYSTEMS IN PACKAGES, AND ASSOCIATED DEVICES, SYSTEMS, AND METHODS
#47INTERPOSER SUBSTRATE, PACKAGE STRUCTURE AND MANUFACTURING METHOD OF PACKAGE STRUCTURE
#48SEMICONDUCTOR DEVICE
#49Assembled light emitting diode display device
#50PACKAGE COMPRISING A FIRST SUBSTRATE, A SECOND SUBSTRATE AND AN ELECTRICAL DEVICE COUPLED TO A BOTTOM SURFACE OF THE SECOND SUBSTRATE
#51Semiconductor Device and Method of Forming Module-in-Package Structure Using Redistribution Layer
#52Semiconductor Device and Method for Partial EMI Shielding
#53SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
#54SEMICONDUCTOR PACKAGE STRUCTURE
#55PACKAGE STRUCTURE
#56ELECTRONIC SUBSTRATE AND ELECTRONIC DEVICE
#57SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
#58DISPLAY PANEL AND DISPLAY DEVICE
#59SMALLER MODULE BY STACKING
#60ELECTRONIC DEVICE
#61SEMICONDUCTOR DEVICE PACKAGE AND METHODS OF FORMATION
#62SEMICONDUCTOR DEVICE
#63Power Envelope Analysis for the Thermal Optimization of Multi-Chip Modules
#64ELECTRONIC DEVICE
#65RADIO FREQUENCY MODULE AND COMMUNICATION DEVICE
#66SEMICONDUCTOR APPARATUS
#67Semiconductor Device and Method of Forming Thin Heat Sink Using E-Bar Substrate
#68SEMICONDUCTOR PACKAGE
#69SEMICONDUCTOR PACKAGE
#70SEMICONDUCTOR DEVICE COMPRISING A CAPACITOR
#71CHIP-ON-WAFER-ON-BOARD STRUCTURE USING SPACER DIE AND METHODS OF FORMING THE SAME
#72DOUBLE SIDE INTEGRATION SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
#73SEMICONDUCTOR DEVICE
#74Package and Method for Forming the Same
#75ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
#76PACKAGED STRUCTURE, ELECTRIC POWER CONTROL SYSTEM, AND MANUFACTURING METHOD
#77SEMICONDUCTOR PACKAGE
#78REDISTRIBUTION LAYER STRUCTURE WITH SUPPORT FEATURES AND METHODS
#79SEMICONDUCTOR PACKAGE
#80DISPLAY DEVICE
#81CHIP PACKAGE STRUCTURE
#82PIXEL DEVICE AND DISPLAY APPARATUS HAVING THE SAME
#83DISPLAY DEVICE AND METHOD FOR MANUFACTURING DISPLAY DEVICE
#84ON CHIP INDUCTORS
#85Semiconductor Device Package with Coupled Substrates
#86PACKAGE AND METHOD OF FABRICATING THE SAME
#87LIGHT EMITTING DEVICE MODULE AND DISPLAY APPARATUS HAVING THE SAME
#88INTEGRATED INTERPOSER FOR RF APPLICATION
#89INTERCONNECT DEVICE AND SEMICONDUCTOR ASSEMBLY INCORPORATING THE SAME
#90Pluggable CPU modules with vertical power
#91MICRO-LED DISPLAY
#92PACKAGE FOR POWER SEMICONDUCTOR DEVICES
#93BUSBAR WITH DIELECTRIC COATING
#94CYTOTOXIC AND ANTI-MITOTIC COMPOUNDS, AND METHODS OF USING THE SAME
#95DIE SUBSTRATE TO OPTIMIZE SIGNAL ROUTING
#96ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
#97ELECTRONIC DEVICE
#98ELECTRONIC COMPONENT MODULE, SUB-MODULE, AND METHOD FOR MANUFACTURING SAME
#99PACKAGING SUBSTRATE INCLUDING AN UNDERFILL INJECTION OPENING AND METHODS OF FORMING THE SAME
#100RECONSTRUCTED SUBSTRATES FOR HIGH I/O COUNTS APPLICATION AND METHODS FOR FORMING THE SAME
#101SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
#102Light-emitting device and tiled display comprising the same
#103SEMICONDUCTOR PACKAGE HAVING A THICK LOGIC DIE
#104SEMICONDUCTOR ASSEMBLIES WITH SYSTEMS AND METHODS FOR USING AN INTERCHANGEABLE INTERPOSER TO CONNECT DIE TO COMMON SUBSTRATE
#105SEMICONDUCTOR PACKAGES
#106DISPLAY PANEL, TILED DISPLAY DEVICE INCLUDING THE SAME, AND MANUFACTURING METHOD THEREOF
#107UNDER-BUMP-METALLIZATION STRUCTURE AND REDISTRIBUTION LAYER DESIGN FOR INTEGRATED FAN-OUT PACKAGE WITH INTEGRATED PASSIVE DEVICE
#108TECHNIQUES FOR JOINING DISSIMILAR MATERIALS IN MICROELECTRONICS
#109IINTEGRATED VOLTAGE REGULATOR (IVR) PACKAGE INCLUDING INDUCTOR AND CAPACITOR AND IVR SYSTEM PACKAGE INCLUDING THE IVR PACKAGE
#110ELECTRONIC COMPONENT MODULE, AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT MODULE
#111SYSTEM PACKAGING FOR CELLULAR MODEM AND TRANSCEIVER SYSTEM OF HETEROGENEOUS STACKING
#112ESD PROTECTION DEVICE
#113PACKAGE-ON-PACKAGE (POP) TYPE SEMICONDUCTOR PACKAGES
#114Micro-LED display
#115LIGHT-EMITTING SUBSTRATE AND PREPARATION METHOD THEREOF, AND ARRAY SUBSTRATE
#116MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
#117BACKSIDE RECESS IN MOTHERBOARD WITH THERMALLY CONDUCTIVE MOLD
#118INTEGRATED CIRCUIT LAYOUT AND INTEGRATED CIRCUIT LAYOUT METHOD FOR FILTER
#119FAN-OUT SEMICONDUCTOR PACKAGE
#120PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF
#121POWER MODULE AND METHOD FOR MANUFACTURING SAME
#122THREE-DIMENSIONAL FAN-OUT INTEGRATED PACKAGE STRUCTURE, PACKAGING METHOD THEREOF, AND WIRELESS HEADSET
#123Plurality of semiconductor devices between stacked substrates
#124SEMICONDUCTOR APPARATUS
#125SEMICONDUCTOR CHIPLET DEVICE
#126HYBRID ORGANIC AND NON-ORGANIC INTERPOSER WITH EMBEDDED COMPONENT IN MOLDING STRUCTURE AND METHODS FOR FORMING THE SAME
#127PACKAGE SUBSTRATE AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
#128Semiconductor package aligning interposer and substrate
#129SEMICONDUCTOR PACKAGE WITH TSV DIE
#130Free Configurable Power Semiconductor Module
#131FAN-OUT PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
#132CIRCUIT ASSEMBLY AND ELECTRICAL JUNCTION BOX
#133INTEGRATED CIRCUIT PACKAGE, ELECTRONIC DEVICE INCLUDING THE SAME, AND MANUFACTURING METHOD THEREOF
#134SEMICONDUCTOR PACKAGE
#135Chip on film package and display device including the same
#136Electronic device
#137PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
#138HYBRID ELEMENT SUBSTRATE AND METHOD OF FABRICATING THE SAME
#139Package structures and method for forming the same
#140DISPLAY DEVICE AND METHOD OF MANUFACTURING THE SAME
#141Sidewall Connections and Button Interconnects for Molded SiPs
#142Semiconductor package
#143Power Semiconductor Module with Accessible Metal Clips
#144SEMICONDUCTOR PACKAGE
#145ELECTRONIC DEVICE
#146High power laminate RF package
#147SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
#148LED-MOUNTED SUBSTRATE, AND SURFACE LIGHT-EMITTING BODY AND VIDEO DISPLAY DEVICE USING SAME
#149Electronic package and manufacturing method thereof
#150SEMICONDUCTOR DEVICE
#151CIRCUIT BOARD MODULE
#152SEMICONDUCTOR PACKAGE STRUCTURE
#153ATMOSPHERIC WATER GENERATION SYSTEMS AND METHODS UTILIZING MEMBRANE-BASED WATER EXTRACTION
#154SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING THE SAME
#155DISPLAY DEVICE
#156LIGHT EMITTING DEVICE, AND LIGHT EMITTING MODULE
#157Display device
#158DISPLAY APPARATUS
#159Display devices with different light sources in pixel structures
#160DISPLAY MODULE AND DISPLAY APPARATUS HAVING THE SAME
#161INTRA-CARDIAC ECHOCARDIOGRAPHY INTEPOSER
#162SEMICONDUCTOR APPARATUS
#163Semiconductor package structure and method for manufacturing the same
#164Semiconductor device comprising a capacitor
#165SEMICONDUCTOR STRUCTURE, PACKAGE STRUCTURE, AND MANUFACTURING METHOD THEREOF
#166Power electronic module with enhanced thermal and electrical performance
#167SEMICONDUCTOR PACKAGE STRUCTURE
#168Integrated fan-out package
#169SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING SAME
#170Semiconductor package with layer structures, antenna layer and electronic component
#171Electronic module and electronic apparatus
#172DISPLAY DEVICE AND TILED DISPLAY DEVICE INCLUDING THE SAME
#173DISPLAY DEVICE AND TILED DISPLAY DEVICE INCLUDING THE SAME
#174Light-emitting device and light-emitting module with frame and covering member
#175DISPLAY DEVICE
#176SEMICONDUCTOR DEVICE
#177POWER STRUCTURE, PREPARATION METHOD, AND DEVICE
#178SEMICONDUCTOR DEVICE
#179Semiconductor package
#180DISPLAY DEVICE AND TILED DISPLAY DEVICE
#181DISPLAY MODULE, DISPLAY APPARATUS, AND METHOD OF MANUFACTURING THE SAME
#182DISPLAY APPARATUS
#183LIGHT EMITTING DEVICE PACKAGE
#184Package for power semiconductor devices
#185INTEGRATED CIRCUIT PACKAGE HAVING A REDISTRIBUTION LAYER ABOVE A POWER MANAGEMENT INTEGRATED CIRCUIT
#186Display panel having a plurality of display regions overlap
#187Display device and tiled display device including the same
#188Semiconductor module and method for manufacturing semiconductor module
#189STRETCHABLE DISPLAY DEVICE
#190Intelligent power module, electric vehicle or hybrid vehicle, and method of assembling intelligent power module
#191TILED DISPLAY DEVICE
#192Assembly structure and package structure
#193Tiled display device
#194ASIC package with photonics and vertical power delivery
#195Semiconductor device and electronic device
#196Light-emitting device
#197Light emitting array structure and display
#198Fan-out packaging structure and method
#199DISPLAY DEVICE AND TILED DISPLAY DEVICE INCLUDING THE SAME
#200Tiled display device
#201Package comprising an integrated device coupled to a substrate through a cavity
#202DISPLAY DEVICE AND TILED DISPLAY DEVICE INCLUDING THE SAME
#203Display device and tiled display device including the same
#204Display panel, preparation method thereof, and display device
#205SEMICONDUCTOR PACKAGE
#206TILED DISPLAY
#207Electronic substrate and electronic device
#208Optical device and electronic device
#209MICRO LED DEVICE AND METHOD FOR MANUFACTURING SAME
#210MICRO LED DEVICE AND METHOD FOR MANUFACTURING SAME
#211Display device including a plurality of lines to apply driving voltage to pixels
#212Display device and tiled display device including the same
#213SPLICED DISPLAY SCREEN, MANUFACTURING METHOD THEREOF, AND DISPLAY DEVICE
#214Solid state switching device including nested control electronics
#215Three-dimensional (3D) integrated circuit with passive elements formed by hybrid bonding
#216Light emitting diode package and display apparatus including the same
#217Tiled light emitting diode display panel having different resistance per unit length signal lines
#218Display device
#219Light emitting device module and display apparatus having the same
#220Semiconductor device and overcurrent protection method
#221ROTATING MICRO LED DISPLAYS BASED ON EYE MOVEMENTS
#222DISPLAY PANEL AND TILED DISPLAY DEVICE
#223Component-embedded substrate
#224Image display device
#225Color tunable hybrid LED-OLED illumination devices
#226Semiconductor package
#227Radio-frequency module having RF and front-end integrated circuits
#228Electrical outlet mounts and illumination for conductive panel assemblies
#229Assembly structure and package structure
#230Electrical connection structure and electronic device comprising the same
#231Manufacturing method of semiconductor device
#232Stretchable display device
#233DISPLAY APPARATUS HAVING DISPLAY MODULE AND METHOD OF MANUFACTURING THE SAME
#234ELECTRONIC DEVICE
#235Stretchable display device
#236Stretchable display device
#237Power semiconductor device including press-fit connection terminal
#238Stretchable display device having a plurality of connection lines
#239Micro light emitting diode display substrate, device and fabrication method thereof
#240Method for forming chip package structure
#241Semiconductor device and system
#242Method of manufacturing light-emitting device and method of manufacturing light-emitting module
#243DISPLAY ELEMENT, DISPLAY DEVICE AND METHOD FOR PRODUCING A CONTACT STRUCTURE IN A PLURALITY OF DISPLAY ELEMENTS
#244Under-bump-metallization structure and redistribution layer design for integrated fan-out package with integrated passive device
#245Package-on-package (POP) type semiconductor packages
#246ASIC package with photonics and vertical power delivery
#247Power chip
#248Stretchable display device
#249Method for fabricating a semiconductor package
#250Electronic device including first substrate having first and second surfaces opposite from each other, second substrate facing first surface, and drive circuit facing second surface
#251Stretchable display device
#252Semiconductor structure, package structure, and manufacturing method thereof
#253Optical device and method of manufacturing the same
#254Solid-state imaging apparatus, method for manufacturing solid-state imaging apparatus, and electronic equipment equipped with solid-state imaging apparatus
#255Power module including a power transistor and two sense transistors
#256Antenna in package device having substrate stack
#257Semiconductor module and method for manufacturing same
#258Semiconductor package with layer structures, antenna layer and electronic component
#259Sensing device
#260Semiconductor package structure and method for manufacturing the same
#261High voltage power module
#262Manufacturing method of semiconductor device
#263Display panel and display device having repair layers
#264Packaging of radiation detectors in an image sensor
#265Light-emitting device packages
#266Semiconductor package
#267Semiconductor module including multiple power management semiconductor packages
#268DISPLAY APPARATUS AND METHOD OF MANUFACTURING DISPLAY APPARATUS THEREOF
#269Electronic circuit device
#270Three-dimensional package structure
#271Display devices with different light sources in pixel structures
#272Structure, method for manufacturing structure, laminate, and semiconductor package
#273Semiconductor device and electronic device
#274Semiconductor module and semiconductor device using the same
#275Parallel electrode combination, power module and power module group
#276Semiconductor package
#277Method of manufacturing semiconductor module and semiconductor module
#278Circuit system having compact decoupling structure
#279Semiconductor structure, package structure, and manufacturing method thereof
#280Three-dimensional integrated stretchable electronics
#281Wafer-level packaging method and package structure
#282Resin encapsulated power semiconductor module with exposed terminal areas
#283High voltage power module
#284Stretchable display device
#285Method for forming chip package structure
#286Sensor element
#287Techniques for joining dissimilar materials in microelectronics
#288Integrated circuit system and packaging method therefor
#289Three-dimensional decoupling integration within hole in motherboard
#290Low power heartbeat for low power mode
#291Multi-chip packages with stabilized die pads
#292Intra-cardiac echocardiography interposer
#293Service module for SIP devices
#294Power semiconductor module
#295ACTIVE MATRIX LED DISPLAY
#296POWER SEMICONDUCTOR MODULE, SNUBBER CIRCUIT, AND INDUCTION HEATING POWER SUPPLY APPARATUS
#297CIRCUIT SYSTEM HAVING COMPACT DECOUPLING STRUCTURE
#298Integrated interposer solutions for 2D and 3D IC packaging
#299Optically aligned hybrid semiconductor device and method
#300Method for dicing integrated fan-out packages without seal rings