Semiconductor device and method of depositing underfill material with uniform flow rate

Bump structure for stacked dies

CHIP CONNECTION STRUCTURE AND METHOD OF FORMING

Methods for forming semiconductor device packages with photoimageable dielectric adhesive material, and related semiconductor device packages

Process for fabricating gallium arsenide devices with copper contact layer

Protected solder ball joints in wafer level chip-scale packaging

Ramp-stack chip package with variable chip spacing

Semiconductor die connection system and method

WSP DIE HAVING REDISTRIBUTION LAYER CAPTURE PAD WITH AT LEAST ONE VOID

WSP DIE WITH OFFSET REDISTRIBUTION LAYER CAPTURE PAD

Semiconductor assemblies and structures

Semiconductor package with stacked semiconductor chips

Thermally enhanced semiconductor packages and related methods

FILM BASED IC PACKAGING METHOD AND A PACKAGED IC DEVICE

PASSIVATED TEST STRUCTURES TO ENABLE SAW SINGULATION OF WAFER

Inductor

Semiconductor packages and methods of formation thereof

GaN-Based Optocoupler

LIGHT-EMITTING DIODE DEVICE AND A METHOD OF MANUFACTURING THE SAME

Methods for manufacturing a chip package

Method for testing through-silicon-via (TSV) structures

Tj temperature calibration, measurement and control of semiconductor devices

Microelectronic wireless transmission device

Gaussian surface lens quantum photon converter and methods of controlling LED colour and intensity

CHIP EMBEDDED PACKAGES AND METHODS FOR FORMING A CHIP EMBEDDED PACKAGE

Semiconductor device and method of forming TSV semiconductor wafer with embedded semiconductor die

SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF

Chip package and method for forming the same

SEMICONDUCTOR CHIP, SEMICONDUCTOR PACKAGE HAVING THE SAME, AND STACKED SEMICONDUCTOR PACKAGE USING THE SEMICONDUCTOR PACKAGE

Structure for monitoring stress induced failures in interlevel dielectric layers of solder bump integrated circuits

Leadframe having selective planishing

Thin film light emitting diode

Semiconductor package and methods of formation thereof

Interlocking type solder connections for alignment and bonding of wafers and/or substrates

Package with integrated pre-match circuit and harmonic suppression

Composite wafer including a molded wafer and a second wafer

Sensor array package

METHOD AND SYSTEM FOR WAFER AND STRIP LEVEL BATCH DIE ATTACH ASSEMBLY

3D interconnect structure comprising through-silicon vias combined with fine pitch backside metal redistribution lines fabricated using a dual damascene type approach

Package carrier

Through silicon via with embedded barrier pad

Easily assembled chip assembly and chip assembling method

Chip assembly and chip assembling method

Stud bump structure for semiconductor package assemblies

Low profile interposer with stud structure

Semiconductor device and method of forming a thin wafer without a carrier

Semiconductor device with specific lead frame for a power semiconductor module

Vertically packaged integrated circuit

Memory and logic device and method for manufacturing the same

Semiconductor Devices and Methods of Manufacturing and Using Thereof

Semiconductor device and method of manufacturing the same, and electronic apparatus

Semiconductor module with a semiconductor chip and a passive component and method for producing the same

LIGHT EMITTING DIODE DEVICE

Light-emitting device

Semiconductor device

Sensor device and related fabrication methods

Adhesive composition for semiconductor and adhesive film comprising the same

Semiconductor device fabrication method capable of scribing chips with high yield

Methods for forming semiconductor device packages

Semiconductor memory device and writing method of ID codes and upper addresses

Metal-insulator-metal capacitors on glass substrates

Power transistor partial current sensing for high precision applications

Power management integrated circuit for driving inductive loads

Method for producing a component and device comprising a component

Chip pad resistant to antenna effect and method

ELECTRICAL INTERCONNECTION STRUCTURE AND ELECTRICAL INTERCONNECTION METHOD

HIGH DENSITY 3D PACKAGE

Method for creating a 3D stacked multichip module

Chip package and method for assembling chip package

Circuit arrangement for a thermally conductive chip assembly and a manufacturing method

Flip chip mounted monolithic microwave integrated circuit (MMIC) structure

Rigid interconnect structures in package-on-package assemblies

CHIP PACKAGE AND METHOD FOR ASSEMBLING SAME

Methods and apparatus for solder connections

Controlled solder-on-die integrations on packages and methods of assembling same

Bump-on-trace interconnect

Methods and Apparatus for bump-on-trace Chip Packaging

Semiconductor Device and Method of Forming Composite Bump-on-Lead Interconnection

SEMICONDUCTOR DEVICE AND METHOD OF FORMING BUMP-ON-LEAD INTERCONNECTION

Semiconductor device including a polymer disposed on a carrier

Method for fixing semiconductor chip on circuit board

Chip package and method of forming the same

Method for fabricating a coil by way of a rounded trench

Methods of adjusting ultrasonic bonding energy on wire bonding machines

Cleaning methods and compositions

Integrated thermal solutions for packaging integrated circuits

Method for thin die-to-wafer bonding

LED Backlight Source

Offset interposers for large-bottom packages and large-die package-on-package structures

Light emitting device and system providing white light with various color temperatures

Apparatus and method for integration of through substrate vias

Semiconductor device packages and methods

SYSTEM AND METHODS FOR WIRE BONDING

Package on package structures and methods for forming the same

Conical-shaped or tier-shaped pillar connections

Strain reduced structure for IC packaging

Substrates having bumps with holes, semiconductor chips having bumps with holes, semiconductor packages formed using the same, and methods of fabricating the same

Method for designing a package and substrate layout

SEMICONDUCTOR PACKAGE, SEMICONDUCTOR MODULE, AND MOUNTING STRUCTURE THEREOF

Power module

Double side cooling power semiconductor module and multi-stacked power semiconductor module package using the same

Methods and apparatus for heat spreader on silicon

Semiconductor packages with heat dissipation structures and related methods

Methods and apparatus for package on package devices with reversed stud bump through via interconnections

On-chip capacitors and methods of assembling same

System and methods for warm white LED light source

Multi-chip light emitter packages and related methods

3D packaging with low-force thermocompression bonding of oxidizable materials

Thermal compression bonding of semiconductor chips

Package carrier and manufacturing method thereof

Semiconductor structures and methods of manufacture

Dispensing Tool

Semiconductor device and method of manufacturing the semiconductor device

Electronic components assembly

Electronic devices with multiple amplifier stages and methods of their manufacture

LIGHT EMITTING DIODE (LED) COMPONENTS AND METHODS FOR IMPROVED LIGHT EXTRACTION

Electronic Module

SEMICONDUCTOR DEVICE AND METHOD OF ASSEMBLING SAME

Wirebonded semiconductor package

Semiconductor device with heat dissipation

Lead frame with grooved lead finger

Integrated circuit package and method of forming the same

METHOD AND APPARATUS PROVIDING INTEGRATED CIRCUIT SYSTEM WITH INTERCONNECTED STACKED DEVICE WAFERS

Methods and apparatus of wafer level package for heterogeneous integration technology

Semiconductor package with through silicon via interconnect and method for fabricating the same

Wafer level packaging of light emitting diodes (LEDs)

Bottom-up plating of through-substrate vias

Semiconductor device and method of forming the same

Stress reduction means for warp control of substrates through clamping

3-D Integrated Circuits and Methods of Forming Thereof

Ceramic-based light emitting diode (LED) devices, components and methods

Light device and its light emitting diode module

Printed wiring board (PWB) for high amperage circuits

LED image projection apparatus

Providing voltage isolation on a single semiconductor die

Monolithic power converter package

Tree based adaptive die enumeration

Electronic apparatus, a method for deciding a failure, and a method for estimating a fatigue life

Package on package structures and methods for forming the same

DIE STACKING WITH COUPLED ELECTRICAL INTERCONNECTS TO ALIGN PROXIMITY INTERCONNECTS

Chip arrangement and a method for forming a chip arrangement

3D interconnect structure comprising fine pitch single damascene backside metal redistribution lines combined with through-silicon vias

Bonded processed semiconductor structures and carriers

Monolithic Power Converter Package with Through Substrate vias

STACKED SEMICONDUCTOR COMPONENTS WITH UNIVERSAL INTERCONNECT FOOTPRINT

Porous Metallic Film as Die Attach and Interconnect

Bonding pad structure with dense via array

Shallow via formation by oxidation

GRID FAN-OUT WAFER LEVEL PACKAGE AND METHODS OF MANUFACTURING A GRID FAN-OUT WAFER LEVEL PACKAGE

Semiconductor package

Elongated bumps in integrated circuit devices

SEMICONDUCTOR CHIP DEVICE WITH FRAGMENTED SOLDER STRUCTURE PADS

Packaging device and method of making the same

PCB based RF-power package window frame

Semiconductor packages and methods of formation thereof

Multichip power semiconductor device

Chip arrangement, a method for forming a chip arrangement, a chip package, a method for forming a chip package

Process of making a stacked semiconductor package having a clip

Electronic package for millimeter wave semiconductor dies

Metallic frame structure and LED device having the same

LED light with electrostatic protection and backlight module using the LED light

Multi-chip light emitter packages and related methods

LED, Backlight Module, and LCD Device

Junction material, manufacturing method thereof, and manufacturing method of junction structure

Plating bath and method

Micro-link high-bandwidth chip-to-chip bus

Method of manufacturing a semiconductor integrated circuit device

System, method, and computer program product for affixing a post to a substrate pad

Direct bonding process using a compressible porous layer

Fabrication method of wafer level semiconductor package and fabrication method of wafer level packaging substrate

Method of manufacturing a semiconductor device

High-frequency transmission module and optical connector having stacked chips connected via wire bonding

WIRING BOARD DEVICE, LUMINAIRE, AND MANUFACTURING METHOD OF THE WIRING BOARD DEVICE

Methods of bonding components for fabricating electronic assemblies and electronic assemblies including bonded components

FOLDABLE SUBSTRATE

Probing chips during package formation

LIGHT-EMITTING DIODES, PACKAGES, AND METHODS OF MAKING

Semiconductor integrated circuit device

Integrated circuit packaging system with a grid array with a leadframe and method of manufacture thereof

Integrated circuit packaging system with ultra-thin chip and method of manufacture thereof

Microelectronic package

Semiconductor method and device of forming a fan-out PoP device with PWB vertical interconnect units

Semiconductor device and method of forming micro-vias partially through insulating material over bump interconnect conductive layer for stress relief

Semiconductor device and method of forming conductive layer over metal substrate for electrical interconnect of semiconductor die

Semiconductor Method of Device of Forming a Fan-Out PoP Device with PWB Vertical Interconnect Units

GALLIUM ARSENIDE DEVICES WITH COPPER BACKSIDE FOR DIRECT DIE SOLDER ATTACH

Conductive bump structure on substrate and fabrication method thereof

Method for manufacturing fine-pitch bumps and structure thereof

Semiconductor device and method for forming openings and trenches in insulating layer by first LDA and second LDA for RDL formation

Semiconductor device and method of singulating semiconductor wafer along modified region within non-active region formed by irradiating energy through mounting tape

Integrated circuit packaging system with support structure and method of manufacture thereof

Semiconductor Device and Method of Forming Duplex Plated Bump-On-Lead Pad Over Substrate for Finer Pitch Between Adjacent Traces

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH SUPPORT STRUCTURE AND METHOD OF MANUFACTURE THEREOF

Circuit package, an electronic circuit package, and methods for encapsulating an electronic circuit

Clip frame semiconductor packages and methods of formation thereof

ELECTROMIGRATION-RESISTANT LEAD-FREE SOLDER INTERCONNECT STRUCTURES

Integrated circuit packaging system with encapsulation and leadframe etching and method of manufacture thereof

Solid-state device including a conductive bump connected to a metal pattern and method of manufacturing the same

LIGHT EMITTING DIODE PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

LED PACKAGE AND METHOD OF MANUFACTURING THE SAME

LED light sheet

LED package structure

High performance power module

Integrated power transistor circuit having a current-measuring cell

Semiconductor device and method of simultaneous testing of multiple interconnects for electro-migration

Method of manufacturing a semiconductor component

Adhesive composition, an adhesive sheet and a production method of a semiconductor device

Adhesive composition, an adhesive sheet and a production method of a semiconductor device

LUMINAIRE

LED packages and related methods

Chip assembly and chip assembling method

White light emitting device with red and green-yellow phosphor

LUMINAIRE AND MANUFACTURING METHOD OF THE SAME

Semiconductor device

Joint structure for substrates and methods of forming

Combination for composite layered chip package

Semiconductor package and methods of formation thereof

Semiconductor device and method of forming compliant conductive interconnect structure in flipchip package

Through-silicon via with a non-continuous dielectric layer

Wire Bonding Structures for Integrated Circuits

Methods and Apparatus for Direct Connections to Through Vias

Methods and apparatus for solder on slot connections in package on package structures

Methods and apparatus of guard rings for wafer-level-packaging

Packaged integrated device die between an external and internal housing

SEMICONDUCTOR PACKAGE HAVING PROTECTIVE LAYER AND METHOD OF FORMING THE SAME

Semiconductor packages with lead extensions and related methods

Semiconductor device and method of manufacturing the same

Semiconductor device and method of forming base substrate with recesses for capturing bumped semiconductor die

Electronic system having increased coupling by using horizontal and vertical communication channels

Semiconductor device

Contact test structure and method

Wire bonder including a transducer, a bond head, and a mounting apparatus

Device and method for chip pressing

Adhesive for electronic components, and manufacturing method for semiconductor chip mount

PRESSURE-SENSITIVE ADHESIVE TAPE FOR RESIN ENCAPSULATION AND METHOD FOR PRODUCING RESIN ENCAPSULATION TYPE SEMICONDUCTOR DEVICE

LED array for replacing flourescent tubes

FLIP-CHIP PACKAGING TECHNIQUES AND CONFIGURATIONS

Thin 3D fan-out embedded wafer level package (EWLB) for application processor and memory integration

Semiconductor constructions

Semiconductor device and method of forming non-linear interconnect layer with extended length for joint reliability

Packaging Methods and Packaged Semiconductor Devices

Self-aligned polymer passivation/aluminum pad

Structures and methods for detecting solder wetting of pedestal sidewalls

Grown carbon nanotube die attach structures, articles, devices, and processes for making them

Semiconductor component that includes a protective structure

FLIP CHIP PACKAGE AND METHOD OF MANUFACTURING THE SAME

Lead frame for assembling semiconductor device

Semiconductor device including a stress buffer material formed above a low-k metallization system

Etched trenches in bond materials for die singulation, and associated systems and methods

LED MODULE

SEMICONDUCTOR LIGHT-EMITTING DEVICE

LIGHT EMITTING DIODE PACKAGING STRUCTURE

Silicon carbide semiconductor device and manufacturing method thereof

SURFACE TREATMENT STRUCTURE OF CIRCUIT PATTERN

Surface metal wiring structure for an IC substrate

Three-dimensional system-in-package architecture

Systems and methods for passive alignment of opto-electronic components

Package on package structure

Protection layers for conductive pads and methods of formation thereof

Copper interconnects having a titanium-platinum-titanium assembly between copper and compound semiconductor

SUBSTRATE STRUCTURE AND FABRICATION METHOD THEREOF

TWO-SOLDER METHOD FOR SELF-ALIGNING SOLDER BUMPS IN SEMICONDUCTOR ASSEMBLY

Electrical connections for chip scale packaging

High voltage semiconductor devices including electric arc suppression material and methods of forming the same

Wireless device, and information processing apparatus and storage device including the wireless device

Method for package-on-package assembly with wire bonds to encapsulation surface

Method for chip package

MEMS structure with adjustable ventilation openings

Mechanisms for controlling bump height variation

SEMICONDUCTOR PACKAGE, AND INFORMATION PROCESSING APPARATUS AND STORAGE DEVICE INCLUDING THE SEMICONDUCTOR PACKAGES

Semiconductor power modules and devices

Integrated circuit packaging system with interconnects

Functional spacer for SIP and methods for forming the same

Enhanced flip chip structure using copper column interconnect

Devices and methods related to a sputtered titanium tungsten layer formed over a copper interconnect stack structure

Semiconductor package with integrated selectively conductive film interposer

Mechanisms for forming connectors with a molding compound for package on package

Semiconductor device and method of manufacturing semiconductor device

Aluminum alloy lead-frame and its use in fabrication of power semiconductor package

System-in-package with integrated socket

Multi-chip package for imaging systems

Transistor with minimized resistance

Embedded electronic component

Catheter die and method of fabricating the same

Heavy-wire bond arrangement and method for producing same

Method for manufacturing phosphor film and method for making LED package having the phosphor film

LED packaging structure having improved thermal dissipation and mechanical strength

Embedded electrical component surface interconnect

Lighting Apparatus

Fine-pitch package-on-package structures and methods for forming the same

SEMICONDUCTOR PACKAGING METHOD AND STRUCTURE THEREOF

Semiconductor packaging method and structure thereof

Semiconductor device and method of forming base leads from base substrate as standoff for stacking semiconductor die

Semiconductor packages

Package-in-package using through-hole via die on saw streets

Pressure sensor

LED device with structure for precisely locating LEDs thereon and method for manufacturing the same

Light emitting diode package and method of fabricating the same

Semiconductor package having light-emitting-diode solder-bonded on first and second conductive pads separated by at least 75 UM

Heat spreading substrate with embedded interconnects