212004 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Solid state imaging device, portable information terminal device and method for manufacturing solid state imaging device
#4502Formation of connectors without UBM
#4503Method for assembling a chip in a flexible substrate
#4504MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
#4505Electronic assembly apparatus and associated methods
#4506Manufacturing method of semiconductor integrated circuit device
#4507Information processing apparatus, communication method and storage medium
#4508Semiconductor memory device
#4509LIGHTING APPARATUS
#4510Lead frame, wiring board, light emitting unit, and illuminating apparatus
#4511Integrated circuit packaging system with interposer and method of manufacture thereof
#4512Systems and methods for high aspect ratio flip-chip interconnects
#4513Method of sealing and contacting substrates using laser light and electronics module
#4514Laser source module and scanning image display device equipped with such module
#4515Systems and methods for lowering interconnect capacitance
#4516Multi-element LED lamp package
#4517Light-emitting device, lighting device including the light-emitting device, and method of manufacturing the light-emitting device
#4518Light-emitting device
#4519Die substrate with reinforcement structure
#4520Semiconductor device
#4521Bonding method for three-dimensional integrated circuit and three-dimensional integrated circuit thereof
#4522Semiconductor package and method for manufacturing the semiconductor package embedded with semiconductor chip
#4523Semiconductor device and method of forming semiconductor package using panel form carrier
#4524Semiconductor device and method of forming stacked semiconductor die and conductive interconnect structure through an encapsulant
#4525Solder cap bump in semiconductor package and method of manufacturing the same
#4526ELECTRONIC ASSEMBLY APPARATUS AND ASSOCIATED METHODS
#4527Package substrate and semiconductor package including the same
#4528Semiconductor device and method of forming protection and support structure for conductive interconnect structure
#4529Semiconductor device and method of forming protection and support structure for conductive interconnect structure
#4530FLASH MEMORY CARD WITHOUT A SUBSTRATE AND ITS FABRICATION METHOD
#4531Semiconductor device and method of forming conductive protrusion over conductive pillars or bond pads as fixed offset vertical interconnect structure
#4532Semiconductor package and method for manufacturing the semiconductor package
#4533SEMICONDUCTOR DEVICE AND ELECTRODE TERMINAL
#4534Base plate and semiconductor device
#4535Semiconductor device
#4536Lead frame, semiconductor device, method of manufacturing lead frame, and method of manufacturing semiconductor device
#4537Power module package
#4538Device including a semiconductor chip and metal foils
#4539Power module package
#4540Semiconductor device and method of forming RF FEM with LC filter and IPD filter over substrate
#4541Encapsulation structure for silicon pressure sensor
#4542Integrated circuit with sensor and method of manufacturing such an integrated circuit
#4543Multi-die semiconductor package
#4544pH sensor and manufacturing method
#4545METHOD FOR MANUFACTURING LED AND LED OBTAINED THEREBY
#4546CHIP-ON-BOARD LED STRUCTURE
#4547OPTOELECTRONIC DEVICE HAVING CONDUCTIVE SUBSTRATE
#4548LIGHT-EMITTING DIODE AND METHOD MANUFACTURING THE SAME
#4549PROGRESSIVE-REFRACTIVITY ANTIREFLECTION LAYER AND METHOD FOR FABRICATING THE SAME
#4550Integrated circuit system with test pads and method of manufacture thereof
#4551HIGH IO SUBSTRATES AND INTERPOSERS WITHOUT VIAS
#4552Fabricating method of MPS-C2 package utilized form a flip-chip carrier
#4553METHOD AND APPARATUS FOR CONNECTING INLAID CHIP INTO PRINTED CIRCUIT BOARD
#4554PASTE AND METHOD FOR CONNECTING ELECTRONIC COMPONENT TO SUBSTRATE
#4555SEALING MATERIAL, SOLAR CELL MODULE, AND LIGHT-EMITTING DIODE
#4556Method of manufacturing an electronic device package
#4557Chips having rear contacts connected by through vias to front contacts
#4558Substrate structure with compliant bump and manufacturing method thereof
#4559Manufacturing method of semiconductor device
#4560Method for manufacturing a chip packaging structure
#4561Chip package structure and method for manufacturing the same
#4562Method for producing chip stacks, and a carrier for carrying out the method
#4563METHOD FOR MANUFACTURING LED WITH AN ENCAPSULANT HAVING A FLAT TOP FACE
#4564Semiconductor integrated circuit device and method of manufacturing same
#4565LIGHTING APPARATUS
#4566Semiconductor device
#4567Snubber circuit and method of using bipolar junction transistor in snubber circuit
#4568Snubber circuit and method of using bipolar junction transistor in snubber circuit
#4569Scheme to achieve robustness to electromagnetic interference in inertial sensors
#4570Scheme to achieve robustness to electromagnetic interference in inertial sensors
#4571Illumination device
#4572MANUFACTURING A FILLING OF A GAP REGION
#4573Semiconductor apparatus
#4574Solder mask with anchor structures
#4575TRANSISTOR STRUCTURE AND RELATED TRANSISTOR PACKAGING METHOD THEREOF
#4576Multi-chip packages providing reduced signal skew and related methods of operation
#4577Chip packaging structure and manufacturing method for the same
#4578Stacked semiconductor devices and fabrication method/equipment for the same
#4579Chip arrangement and method for producing a chip arrangement
#4580Wiring substrate and semiconductor package
#4581Semiconductor integrated circuit device
#4582Strain-compensating fill patterns for controlling semiconductor chip package interactions
#4583System and method for 3D integrated circuit stacking
#4584Low loop wire bonding
#4585Semiconductor package with improved pillar bump process and structure
#4586Packaging methods and structures for semiconductor devices
#4587Packaging methods and structures using a die attach film
#4588SEMICONDUCTOR DEVICE
#4589No flow underfill or wafer level underfill and solder columns
#4590Substrate structure with compliant bump and manufacturing method thereof
#4591Elongated bump structure in semiconductor device
#4592Wiring substrate and semiconductor package
#4593Ring structure for chip packaging
#4594Power module and power module manufacturing method
#4595Semiconductor device including cladded base plate
#4596Epoxy resin composition for semiconductor encapsulant and semiconductor device using the same
#4597Semiconductor device and manufacturing method of the same
#4598Semiconductor device, semiconductor device manufacturing method, semiconductor device mounting structure and power semiconductor device
#4599POWER MODULE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
#4600Spot plated leadframe and IC bond pad via array design for copper wire
#4601Semiconductor devices and methods of manufacturing and packaging thereof
#4602Electronic semiconductor device with integrated inductor, and manufacturing method
#4603Power module and power converter containing power module
#4604Schottky diode
#4605Hot-melt sealing glass compositions and devices using the same
#4606Microelectromechanical system having movable element integrated into substrate-based package
#4607High thermal conductivity and low degradation die attach with dual adhesive
#4608METHODS FOR PACKAGING LIGHT EMITTING DEVICES AND RELATED MICROELECTRONIC DEVICES
#4609LED devices having lenses and methods of making same
#4610LED package and mold of manufacturing the same
#4611Light-emitting device
#4612LIGHT-EMITTING DEVICE AND LIGHT-EMITTING DEVICE MANUFACTURING METHOD
#4613SEMICONDUCTOR LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING SAME
#4614LIGHT EMITTING DEVICE
#4615LED PACKAGE DEVICE
#4616LED device having two LED dies separated by a dam
#4617III-N device structures having a non-insulating substrate
#4618Edge termination structure employing recesses for edge termination elements
#4619Semiconductor chip
#4620Case including semiconductor nanocrystals, and optoelectronic device including the same
#4621RFID antenna modules and methods of making
#4622METHOD FOR PRODUCING A CAPPING WAFER FOR A SENSOR
#4623MANUFACTURING METHOD OF PACKAGE CARRIER
#4624Moveable access control list (ACL) mechanisms for hypervisors and virtual machines and virtual port firewalls
#4625Hybrid Content-Distribution System and Method
#4626Method of manufacturing esterified substance
#4627Reduction of etch microloading for through silicon vias
#4628Methods of forming semiconductor device packages including a semiconductor device and a redistribution element, methods of forming redistribution elements and methods for packaging semiconductor devices
#4629Method for manufacturing a package-on-package type semiconductor device
#4630Flip-chip BGA assembly process
#4631Method and system for real time control of an active antenna over a distributed antenna system
#4632Three-dimensional offset-printed memory
#4633LED light bulb and LED light-emitting strip being capable of emitting 4TT light
#4634METHOD FOR MANUFACTURING BASE MATERIAL HAVING GOLD-PLATED METAL FINE PATTERN, BASE MATERIAL HAVING GOLD-PLATED METAL FINE PATTERN, PRINTED WIRING BOARD, INTERPOSER, AND SEMICONDUCTOR DEVICE
#4635Electronic component and method for producing same
#4636Package systems including passive electrical components
#4637Semiconductor module and cooler
#4638Transmission line for high performance radio frequency applications
#4639LIGHT EMITTING DIODE (LED) SYSTEM HAVING APPLICATION SPECIFIC INTEGRATED CIRCUIT (ASIC) AND WIRELESS SYSTEM
#4640Light emitting diode (LED) system having lighting device and wireless control system
#4641Encapsulated semiconductor device and method for manufacturing the same
#4642Semiconductor device and method of forming repassivation layer with reduced opening to contact pad of semiconductor die
#4643Pillar structure having a non-planar surface for semiconductor devices
#4644ROUTING UNDER BOND PAD FOR THE REPLACEMENT OF AN INTERCONNECT LAYER
#4645Semiconductor device and method of forming Fo-WLCSP with recessed interconnect area in peripheral region of semiconductor die
#4646Integrated circuit packaging system with embedded thermal heat shield and method of manufacture thereof
#4647Integrated circuit packaging system with stiffener and method of manufacture thereof
#4648Semiconductor device and method of forming a low profile dual-purpose shield and heat-dissipation structure
#4649Semiconductor devices and methods of assembling same
#4650Stepped package for image sensor and method of making same
#4651Package for semiconductor light-emitting device and light-emitting device
#4652Optical semiconductor device
#4653Light emitting device
#4654Optoelectronic semiconductor part containing alkali-free and halogen-free metal phosphate
#4655Light emitting device
#4656Light-emitting diode devices
#4657Plate
#4658LED PACKAGE AND METHOD OF THE SAME
#4659Light-transmissive member, optical device, and manufacturing methods thereof
#4660Power semiconductor module
#4661Electronic circuit device
#4662Nitride based semiconductor package and method of manufacturing the same and bonding substrate
#4663BROAD-AREA LIGHTING SYSTEMS
#4664Light emitting device and light emitting device package
#4665Semiconductor device
#4666Buffer layer for GaN-on-Si LED
#4667Semiconductor chip comprising a directional coupler having a specific main line and sub-line arrangement
#4668Method for making a sensor device using a graphene layer
#4669CURABLE RESIN COMPOSITION, ADHESIVE EPOXY RESIN PASTE, DIE-BONDING AGENT, NON-CONDUCTIVE PASTE, ADHESIVE EPOXY RESIN FILM, NON-CONDUCTIVE EPOXY RESIN FILM, ANISOTROPIC CONDUCTIVE PASTE, AND ANISOTROPIC CONDUCTIVE FILM
#4670WIRE BONDING SYSTEM FOR SEMICONDUCTOR PACKAGE
#4671Wiring substrate, method for manufacturing wiring substrate, and semiconductor package including wiring substrate
#4672Elastic mounting of power modules
#4673Semiconductor integrated circuit and drive apparatus including the same
#4674METHOD FOR THE FABRICATION OF BONDING SOLDER LAYERS ON METAL BUMPS WITH IMPROVED COPLANARITY
#4675Method for packaging light emitting diode
#4676Method and device for resin coating
#4677Light emitting module and backlight unit having the same
#4678Light emitting module with heatsink plate having coupling protrusions
#4679Bulb type semiconductor light-emitting device lamp
#4680Method and apparatus for a light source
#4681Luminescent material
#4682Camera module housing having built-in conductive traces to accommodate stacked dies using flip chip connections
#4683GLASS AS A SUBSTRATE MATERIAL AND A FINAL PACKAGE FOR MEMS AND IC DEVICES
#4684GLASS AS A SUBSTRATE MATERIAL AND A FINAL PACKAGE FOR MEMS AND IC DEVICES
#4685Semiconductor structure with galvanically-isolated signal and power paths
#4686SYSTEM AND METHOD FOR PROVIDING IMPROVED IMPEDANCE MATCHING TO RF POWER TRANSISTOR USING SHUNT INDUCTANCE
#4687Die having wire bond alignment sensing structures
#4688LED lamp
#4689Light emitting device package
#4690Light emitting device package and light unit
#4691Light emitting device package, light source module, and lighting system including the same
#4692Chip package and method for making same
#4693Component assembly using a temporary attach material
#4694Semiconductor chip with bonding wire and method for making the same
#4695Semiconductor chip device with solder diffusion protection
#4696Semiconductor package having supporting plate and method of forming the same
#4697PACKAGE STACKS AND METHOD OF MANUFACTURING THE SAME
#4698STACKED INTEGRATED CIRCUIT PACKAGES THAT INCLUDE MONOLITHIC CONDUCTIVE VIAS
#4699Packaging DRAM and SOC in an IC package
#4700Die-to-die gap control for semiconductor structure and method
#4701Semiconductor wafer and laminate structure including the same
#4702Bond pad configurations for controlling semiconductor chip package interactions
#4703Semiconductor device including diffusion soldered layer on sintered silver layer
#4704Through interposer wire bond using low CTE interposer with coarse slot apertures
#4705Three-dimensional integrated circuit (3DIC) formation process
#4706Self-aligned protection layer for copper post structure
#4707Formation of through-silicon via (TSV) in silicon substrate
#4708STACKED CHIP PACKAGE AND FABRICATION METHOD THEREOF
#4709Methods of fabricating semiconductor chip solder structures
#4710Semiconductor flip-chip system having three-dimensional solder joints
#4711Power device and method of packaging same
#4712Lead frame having a flag with in-plane and out-of-plane mold locking features
#4713QFN DEVICE AND LEAD FRAME THEREFOR
#4714Low cost hybrid high density package
#4715Semiconductor device
#4716Method of making a low-Rdson vertical power MOSFET device
#4717Small-Outline Package for a Power Transistor
#4718High performance power transistor having ultra-thin package
#4719Light-emitting device and method of manufacturing the same
#4720LED MODULE
#4721Light emitting device package and light unit having the same
#4722Light emitting device and light unit
#4723Compound semiconductor light-emitting element
#4724Light-reflective anisotropic conductive adhesive agent, and light emitting device
#4725Semiconductor light emitting device including metal reflecting layer
#4726Light emitting device package
#4727Light emitting device package
#4728Light emitting device package and lighting system having the same
#4729Thermal conductivity and phase transition heat transfer mechanism including optical element to be cooled by heat transfer of the mechanism
#4730Light emitting diode package array and method for fabricating light emitting diode package
#4731Light emitting device and light emitting device package
#4732LED package device
#4733LIGHT EMITTING DEVICE PACKAGE AND LIGHTING SYSTEM
#4734OPTOELECTRONIC DEVICE WITH UPCONVERTING LUMINOPHORIC MEDIUM
#4735High density gallium nitride devices using island topology
#4736Devices having removed aluminum nitride sections
#4737Bond pad monitoring structure and related method of detecting significant alterations
#4738Light emitting device
#4739LIGHTING MODULE HAVING A COMMON TERMINAL
#4740Electromagnetic interference noise reduction package board
#4741ELECTRONIC PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING SAME
#4742Wiring board having an engineered metallization layer
#4743Method for manufacturing electronic apparatus
#4744White-light emitting device and preparation method and application of the same
#4745Chip on leads
#4746Method and apparatus for fabricating integrated circuit device using self-organizing function
#4747PACKAGE SUBSTRATE FOR OPTICAL ELEMENT AND METHOD OF MANUFACTURING THE SAME
#4748Manufacturing method thereof and a semiconductor device
#4749Light emitting module
#4750LIGHT-EMITTING DEVICE FOR BACKLIGHT SOURCE
#4751Sensor having damping
#4752Semiconductor laser mounting with intact diffusion barrier layer
#4753Back-to-back stacked dies
#4754SYSTEM WITH A DEFECT TOLERANT CONFIGURABLE IC
#4755Unlit LED circuit bypass element with system and method therefor
#4756LIGHT EMITTING DEVICE
#4757UNIVERSAL PRINTED CIRCUIT BOARD AND MEMORY CARD INCLUDING THE SAME
#4758Bond pad structure to reduce bond pad corrosion
#4759Semiconductor arrangement
#4760Semiconductor dice including at least one blind hole, wafers including such semiconductor dice, and intermediate products made while forming at least one blind hole in a substrate
#4761Package-on-package structures
#4762Semiconductor apparatus, method of manufacturing semiconductor apparatus, and electronic apparatus
#4763Semiconductor devices, package substrates, semiconductor packages, package stack structures, and electronic systems having functionally asymmetric conductive elements
#4764Dummy flip chip bumps for reducing stress
#4765Multiple die in a face down package
#4766MANUFACTURING METHOD THEREOF AND A SEMICONDUCTOR DEVICE
#4767Semiconductor device
#4768Chip-packaging module for a chip and a method for forming a chip-packaging module
#4769Multi-die semiconductor package with one or more embedded die pads
#4770Solder Bump Bonding In Semiconductor Package Using Solder Balls Having High-Temperature Cores
#4771Integrated circuit die with low thermal resistance
#4772Power overlay structure with leadframe connections
#4773Semiconductor packaging for a memory device and a fabricating method thereof
#4774Semiconductor device including a recess formed above a semiconductor chip
#4775MEMS device having chip scale packaging
#4776Shielded gate trench MOSFET package
#4777LIGHT EMITTING DEVICE AND METHOD FOR MANUFACTURING THE SAME
#4778Semiconductor light-emitting device
#4779Light emitting diode package
#4780LIGHT EMITTING DEVICE
#4781STRUCTURE AND PROCESS OF HEAT DISSIPATION SUBSTRATE
#4782Manufacturing process and heat dissipating device for forming interface for electronic component
#4783Ultrasonic bonding systems and methods of using the same
#4784METHOD OF MANUFACTURING SOFT-DILUTE-COPPER-ALLOY-MATERIAL
#4785Adhesive composition for semiconductors, adhesive film prepared using the same, and semiconductor device including the film
#4786Through silicon via layout
#4787Method for permanent connection of two metal surfaces
#4788Through substrate via with embedded decoupling capacitor
#4789Manufacturing method using multi-step adhesive curing for sealed semiconductor device
#4790SPIRAL STAIRCASE SHAPED STACKED SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
#4791Fixing semiconductor die in dry and pressure supported assembly processes
#4792Method of Multi-Chip Wafer Level Packaging
#4793Optoelectronic component and method for producing an optoelectronic component
#4794Semiconductor laser light source
#4795Light emitting device array and light system
#4796LIGHTING APPARATUS
#4797Light emitting device and LCD backlight using the same
#4798Semiconductor device
#4799HEAT DISSIPATION DEVICE
#4800Method of manufacturing capacitor