212004 ā
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Projectors of structured light
#4802Aligned multiple emitter package
#4803Atomic layer deposition encapsulation for power amplifiers in RF circuits
#4804PROBE STRUCTURE, PROBE APPARATUS, PROBE STRUCTURE MANUFACTURING METHOD, AND TEST APPARATUS
#4805Semiconductor package substrate
#4806SEMICONDUCTOR DEVICE DIE BONDING
#4807Three-dimensional integrated circuit, processor, semiconductor chip, and manufacturing method of three-dimensional integrated circuit
#4808Conductive routings in integrated circuits using under bump metallization
#4809CMOS image sensor and method for forming the same
#4810FLUX COMPOSITION, PROCESS FOR PRODUCING ELECTRICALLY CONNECTED STRUCTURES, ELECTRICALLY CONNECTED STRUCTURE, AND SEMICONDUCTOR DEVICE
#4811Substrate for semiconductor device, semiconductor device having the substrate, and manufacturing method thereof
#4812Semiconductor package structure with common gold plated metal conductor on die and substrate
#4813Semiconductor assemblies with multi-level substrates and associated methods of manufacturing
#4814Semiconductor device having a through-substrate via
#4815Semiconductor device and method of manufacturing the same
#4816SEMICONDUCTOR CHIP INCLUDING BUMP HAVING BARRIER LAYER, AND MANUFACTURING METHOD THEREOF
#4817Semiconductor device
#4818Chip Stack Packages Having Aligned Through Silicon Vias of Different Areas
#4819Semiconductor device, semiconductor package, method for manufacturing semiconductor device, and method for manufacturing semiconductor package
#4820Semiconductor device reducing risks of a wire short-circuit and a wire flow
#4821Method for inhibiting growth of intermetallic compounds
#4822Semiconductor package and stack-type semiconductor package having the same
#4823Bump pad structure
#4824Semiconductor device and method of forming a stackable semiconductor package with vertically-oriented discrete electrical devices as interconnect structures
#4825Wafer level package structure and the fabrication method thereof
#4826Semiconductor package with under bump metallization routing
#4827SEMICONDUCTOR PACKAGE WITH A HEAT SPREADER AND METHOD OF MAKING
#4828STACKABLE WAFER LEVEL PACKAGES AND RELATED METHODS
#4829Semiconductor package and system
#4830Lead carrier with multi-material print formed package components
#4831Lead assembly for a flip-chip power switch
#4832Area array quad flat no-lead (QFN) package
#4833Wafer level chip scale package with thick bottom metal exposed and preparation method thereof
#4834Method of manufacturing decoupling MIM capacitor designs for interposers
#4835Galvanic isolation fuse and method of forming the fuse
#4836Method of fabricating a semiconductor device having recessed bonding site
#4837Layered substrate, light-emitting diode including the layered substrate and lighting device using the light-emitting diode
#4838RED LIGHT EMITTING PHOSPHOR, METHOD FOR MANUFACTURING THE SAME AND LIGHT EMITTING APPARATUS EMPLOYING RED LIGHT EMITTING PHOSPHOR
#4839LEAD FRAME, AND LIGHT EMITTING DIODE MODULE HAVING THE SAME
#4840Light emitting device and method for manufacturing light emitting device
#4841Epoxy resin composition for optical semiconductor device and optical semiconductor device using the same
#4842Miniature leadless surface mount lamp with dome and reflector cup
#4843LIGHT EMITTING ELEMENT MODULE SUBSTRATE, LIGHT EMITTING ELEMENT MODULE, AND ILLUMINATING DEVICE
#4844Optical device and method for manufacturing same
#4845Opto-electronic module and method for manufacturing the same
#4846LIGHT EMITTING DIODE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
#4847Light emitting device
#4848LIGHT EMITTING DIODE CHIP
#4849SEMICONDUCTOR DEVICE MEMBER, PRODUCTION METHOD OF SEMICONDUCTOR-DEVICE-MEMBER FORMATION LIQUID AND SEMICONDUCTOR DEVICE MEMBER, AND SEMICONDUCTOR-DEVICE-MEMBER FORMATION LIQUID, PHOSPHOR COMPOSITION, SEMICONDUCTOR LIGHT-EMITTING DEVICE, LIGHTING SYSTEM AND IMAGE DISPLAY SYSTEM USING THE SAME
#4850Photointerrupter, method of manufacturing the same, and mounting structure of the same
#4851Terminal-integrated metal base package module and terminal-integrated metal base packaging method
#4852Memory device that specifies a size of a segment of write data
#4853Cleaning residual molding compound on solder bumps
#4854Method of forming a semiconductor device with a contact pad on a sloped silicon dioxide surface
#4855Exposed die package for direct surface mounting
#4856Structure and method for power field effect transistor
#4857DICING DIE-BONDING FILM
#4858WAFER LEVEL PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
#4859Method of manufacturing RFID based thermal bubble type accelerometer
#4860Manufacturing method of LED package structure
#4861Light emitting unit, backlight assembly including the same, and method of manufacturing the same
#4862Light emitting module and head lamp including the same
#4863Method for assembling at least one chip using a fabric, and fabric including a chip device
#4864LED package structure
#4865LED LIGHT BAR
#4866Transfer method for manufacturing conductor structures by means of nano-inks
#4867Substrate, electronic device, and electronic apparatus
#4868Failsafe galvanic isolation barrier
#4869Tape substrate for chip on film structure of liquid crystal panel
#4870Semiconductor device having at least a transistor cell with a second conductive type region surrounding a wall region and being insulated from both gate electrode and source electrode and solid state relay using same
#4871DISGUISING TEST PADS IN A SEMICONDUCTOR PACKAGE
#4872Light-emitting device
#4873Phosphor composition and white light emitting device using the same
#4874Stackable integrated circuit package system
#4875Semiconductor device and method of forming POP with stacked semiconductor die and bumps formed directly on the lower die
#4876SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
#4877Microelectronic package with stacked microelectronic elements and method for manufacture thereof
#4878Semiconductor device
#4879Semiconductor device
#4880Routing layer for mitigating stress in a semiconductor die
#4881CHIP PACKAGE STRUCTURE
#4882Chip package structure using flexible substrate
#4883Three dimensional semiconductor assembly board with bump/flange supporting board, coreless build-up circuitry and built-in electronic device
#4884Package for a MEMS sensor and manufacturing process thereof
#4885Epoxy resin composition for optical semiconductor device, lead frame for optical semiconductor device and substrate for optical semiconductor device obtained using the same, and optical semiconductor device
#4886Bonded wire semiconductor device
#4887Semiconductor device comprising through-electrode interconnect
#4888Integrated inductor
#4889Pad structure including glue layer and non-low-k dielectric layer in BSI image sensor chips
#4890Semiconductor package configured to electrically couple to a printed circuit board and method of providing same
#4891Semiconductor arrangement
#4892Light emitting devices
#4893Optoelectronic device and method for manufacturing the same
#4894Non-reactive barrier metal for eutectic bonding process
#4895High temperature gold-free wafer bonding for light emitting diodes
#4896Light emitting package
#4897Light emitting diode package and manufacturing method thereof
#4898Semiconductor light emitting device
#4899N-type gallium-nitride layer having multiple conductive intervening layers
#4900LED having a low defect N-type layer that has grown on a silicon substrate
#4901LED module and LED lamp having the LED module
#4902LED LIGHT STRIP MODULE STRUCTURE
#4903Power amplifier
#4904LED ON SILICON SUBSTRATE USING ZINC-SULFIDE AS BUFFER LAYER
#4905Semiconductor device having a test pad connected to an exposed pad
#4906Infrared detecting element and electronic device
#4907Inputting module and submount thereof and manufacturing method of the submount
#4908Packaging substrate having embedded interposer and fabrication method thereof
#4909Microelectronic package with terminals on dielectric mass
#4910THERMAL COMPRESSION BONDING WITH SEPARATE BOND HEADS
#4911Solar cell module on molded lead-frame and method of manufacture
#4912Devices and Methods for Radiation-Based Dermatological Treatments
#4913Method of making a die with recessed aluminum die pads
#4914Method and system for forming conductive bumping with copper interconnection
#4915Method of manufacturing semiconductor device
#4916TCE compensation for package substrates for reduced die warpage assembly
#4917Method for manufacturing wafer-bonded semiconductor device
#4918Method of making thin-wafer current sensors
#4919Molding die set and resin molding apparatus having the same
#4920LID, FABRICATING METHOD THEREOF, AND MEMS PACKAGE MADE THEREBY
#4921LAMP AND ILLUMINATING DEVICE WITH LIGHT SOURCE OF SOLID STATE LIGHT EMITTING ELEMENT
#4922Power module production method, and power module produced thereby
#4923Light-emitting device manufacturing method, light-emitting device, lighting device, backlight, liquid-crystal panel, display device, display device manufacturing method, display device drive method and liquid-crystal display device
#4924Saw device, saw oscillator, and electronic apparatus
#4925Power semiconductor chip having two metal layers on one face
#4926Integrated circuit comprising at least an integrated antenna
#4927LED LUMINESCENCE APPARATUS
#4928LED luminescence apparatus and method of driving the same
#4929Solid state lighting apparatus and methods using integrated driver circuitry
#4930LED driving circuit package
#4931PHOSPHOR AND MANUFACTURING METHOD THEREFORE, AND LIGHT EMISSION DEVICE USING THE PHOSPHOR
#4932Liquid epoxy resin composition for semiconductor encapsulation
#4933WAFER LEVEL CHIP SCALE PACKAGE FOR WIRE-BONDING CONNECTION
#4934SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
#4935Semiconductor packages and electronic systems including the same
#4936CHIP PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
#4937Semiconductor device and method of forming vertical interconnect in FO-WLCSP using leadframe disposed between semiconductor die
#4938Semiconductor device
#4939SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE STRUCTURE CONFIGURED BY VERTICALLY STACKING SEMICONDUCTOR DEVICES, AND MANUFACTURING METHOD THEREOF
#4940Semiconductor device and manufacturing method therefor
#4941FILM FOR FORMING SEMICONDUCTOR PROTECTION FILM, AND SEMICONDUCTOR DEVICE
#4942Semiconductor die assemblies, semiconductor devices including same, and methods of fabrication
#4943Integrated circuit package including a direct connect pad, a blind via, and a bond pad electrically coupled to the direct connect pad
#4944Manufacturing method for semiconductor device
#4945Wafer-level chip scale package
#4946Hybrid interconnect technology
#4947Semiconductor element-embedded wiring substrate
#4948FLIP CHIPS HAVING MULTIPLE SOLDER BUMP GEOMETRIES
#4949SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE UNIT, AND SEMICONDUCTOR DEVICE PRODUCTION METHOD
#4950Flip chip interconnection having narrow interconnection sites on the substrate
#4951METHOD FOR FORMING BUMPS AND SUBSTRATE INCLUDING THE BUMPS
#4952Flip-chip semiconductor device having anisotropic electrical interconnection and substrate utilized for the package
#4953Coaxial solder bump support structure
#4954Semiconductor devices, packaging methods and structures
#4955Bump structures in semiconductor device and packaging assembly
#4956Metal bump structure
#4957Self-aligning conductive bump structure and method of making the same
#4958Bump structures
#4959Method and device for circuit routing by way of under-bump metallization
#4960Structure and method for bump to landing trace ratio
#4961PACKAGE ASSEMBLY INCLUDING A SEMICONDUCTOR SUBSTRATE WITH STRESS RELIEF STRUCTURE
#4962TSV pillar as an interconnecting structure
#4963Vibrating device and electronic apparatus
#4964Light emitting device module
#4965Light emitting chip package
#4966LIGHT-EMITTING DIODE HOUSING COMPRISING FLUOROPOLYMER
#4967SURFACE-MOUNT LIGHT EMITTING DEVICE
#4968LIGHT-EMITTING DIODE (LED) PACKAGE STRUCTURE AND PACKAGING METHOD THEREOF
#4969LIGHT EMITTING DEVICE
#4970Light emitting diode device
#4971Three-dimensional LED substrate and LED lighting device
#4972Light emitting device package and light emitting system
#4973Light emitting device package and lighting system using the same
#4974Glass/ceramics replacement of epoxy for high temperature hermetically sealed non-axial electronic packages
#4975Direct conversion X-ray detector with radiation protection for electronics
#4976HYBRID CONTACT-CONTACTLESS SMART CARD WITH REINFORCED ELECTRONIC MODULE
#4977SOLDER DEPOSITION SYSTEM AND METHOD FOR METAL BUMPS
#4978Bonding tool, electronic component mounting apparatus, and manufacturing method of bonding tool
#4979Foil plating for semiconductor packaging
#4980BONDING ENTITIES TO CONJOINED STRIPS OF CONDUCTIVE MATERIAL
#4981Copper column
#4982Integrated circuit with electromagnetic intrachip communication and methods for use therewith
#4983Fused buss for plating features on a semiconductor die
#4984LESS EXPENSIVE HIGH POWER PLASTIC SURFACE MOUNT PACKAGE
#4985Substrate for integrated modules
#4986SOFT DILUTE COPPER ALLOY WIRE, SOFT DILUTE COPPER ALLOY PLATE AND SOFT DILUTE COPPER ALLOY STRANDED WIRE
#4987Bumping process and structure thereof
#4988High power surface mount technology package for side emitting laser diode
#4989Laser package having multiple emitters configured on a substrate member
#4990Semiconductor devices compatible with mono-rank and multi-ranks
#4991Package structure with electronic component and method for manufacturing same
#4992Double-sided printed circuit board
#4993Electronic component
#4994Composition of a solder, and method of manufacturing a solder connection
#4995Power inverter
#4996Light source unit, illuminator, and display
#4997Semiconductor device and structure
#4998Lighting system
#4999Semiconductor device
#5000Manufacturing method of semiconductor device, adhesive sheet used therein, and semiconductor device obtained thereby
#5001Composite layered chip package
#5002SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#5003System and method to process horizontally aligned graphite nanofibers in a thermal interface material used in 3D chip stacks
#5004Semiconductor device
#5005Contact pad
#5006Wafer level package and a method of forming a wafer level package
#5007Interconnect pillars with directed compliance geometry
#5008Method of manufacturing semiconductor package device
#5009SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
#5010Semiconductor system and device
#5011Bonding surfaces for direct bonding of semiconductor structures
#5012DOUBLE-SIDED FLIP CHIP PACKAGE
#5013Semiconductor device and a method of manufacturing the same
#5014PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
#5015Pillar design for conductive bump
#5016Techniques and structures for testing integrated circuits in flip-chip assemblies
#5017āLā shaped lead integrated circuit package
#5018Power module packaging with double sided planar interconnection and heat exchangers
#5019Semiconductor device and method of manufacturing the same
#5020Method of manufacturing a semiconductor device
#5021Stacked die semiconductor package
#5022SEMICONDUCTOR DEVICE AND METHOD OF PACKAGING SAME
#5023Package structure and package process
#5024Substrate for semiconductor package and semiconductor package having the same
#5025System and method for packaging of high-voltage semiconductor devices
#5026LED MODULE AND METHOD FOR MANUFACTURING THE SAME
#5027Circuit board with thermo-conductive pillar
#5028LED module
#5029Slim LED package
#5030Light emitting device
#5031Transparent light emitting diodes
#5032Light emitting device
#5033Light emitting device package and fabrication method thereof
#5034Luminous devices, packages and systems containing the same, and fabricating methods thereof
#5035LED module and LED module mounting structure
#5036Light emitting devices and components having improved chemical resistance and related methods
#5037Optical device with through-hole cavity
#5038RAPID FABRICATION METHODS FOR FORMING NITRIDE BASED SEMICONDUCTORS BASED ON FREESTANDING NITRIDE GROWTH SUBSTRATES
#5039Cap chip and reroute layer for stacked microelectronic module
#5040Circuit module
#5041Thin foil semiconductor package
#5042SUPPORT SYSTEM FOR A SEMICONDUCTOR DEVICE
#5043Solder bump cleaning before reflow
#5044METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE PACKAGE WITH A HEATSINK
#5045PACKAGING FOR CLIP-ASSEMBLED ELECTRONIC COMPONENTS
#5046METHOD FOR MANUFACTURING LIGHT EMITTING DIODE
#5047Method of manufacturing light-emitting device
#5048ADHESIVE FILM FOR SEMICONDUCTOR DEVICE, FILM FOR BACKSIDE OF FLIP-CHIP SEMICONDUCTOR, AND DICING TAPE-INTEGRATED FILM FOR BACKSIDE OF SEMICONDUCTOR
#5049Frame feeding system and frame feeding method
#5050Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive
#5051Wireless apparatus
#5052Apparatus and methods for packaging antennas with integrated circuit chips for millimeter wave applications
#5053RF transistor packages with high frequency stabilization features and methods of forming RF transistor packages with high frequency stabilization features
#5054Integrated current sensor
#5055Power converter
#5056Glass composition, light source device and illumination device
#5057Compact production apparatus and method for producing compact
#5058Bond pad configurations for semiconductor dies
#5059Memory module in a package
#5060Memory module in a package
#5061CHIP-ON-PACKAGE STRUCTURE FOR MULTIPLE DIE STACKS
#5062De-skewed multi-die packages
#5063Solder ball contact susceptible to lower stress
#5064Interconnection and assembly of three-dimensional chip packages
#5065Semiconductor device and method of forming base substrate with cavities formed through etch-resistant conductive layer for bump locking
#5066Solder bump with inner core pillar in semiconductor package
#5067Semiconductor device with solder bump formed on high topography plated Cu pads
#5068Bump I/O contact for semiconductor device
#5069Ball grid array with improved single-ended and differential signal performance
#5070Semiconductor package comprising an interposer and method of manufacturing the same
#5071Semiconductor Device and Method of Forming Substrate With Seated Plane for Mating With Bumped Semiconductor Die
#5072SEMICONDUCTOR DEVICE AND PRODUCTION METHOD FOR SAME
#5073Apparatus and methods for quad flat no lead packaging
#5074Semiconductor device having antenna element and method of manufacturing same
#5075Mechanisms for marking the orientation of a sawed die
#5076SEMICONDUCTOR PACKAGE INCLUDING AN EXTERNAL CIRCUIT ELEMENT
#5077Method of forming an inductor on a semiconductor wafer
#5078Semiconductor device and method for forming passive circuit elements with through silicon vias to backside interconnect structures
#5079Semiconductor device package with integrated antenna for wireless applications
#5080Composite semiconductor device with a SOI substrate having an integrated diode
#5081Composite semiconductor device with integrated diode
#5082Power device having a specific range of distances between collector and emitter electrodes
#5083LED and method for manufacturing the same
#5084LIGHT EMITTING DIODE PACKAGE AND METHOD FOR FABRICATING THE SAME
#5085Light emitting device package and a lighting unit with base having via hole
#5086Polarized white light emitting diode
#5087Light emitting module and head lamp including the same
#5088SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#5089System and method for wafer level packaging
#5090Light-emitting Device Capable of Producing White Light And Light Mixing Method For Producing White Light With Same
#5091IC card and booking-account system using the IC card
#5092Method of forming a package substrate
#5093PLATING APPARATUS AND PLATING METHOD
#5094Nonvolatile memory cell with authentication key storage
#5095Memory controller, method thereof, and electronic devices having the memory controller
#5096LIGHT-EMITTING DEVICE, DISPLAY APPARATUS, AND METHOD FOR DESIGNING REFLECTIVE MEMBER
#5097Thermosetting resin composition, B-stage heat conductive sheet, and power module
#5098Optical electronic package having a blind cavity for covering an optical sensor
#5099RADIO MODULE AND MANUFACTURING METHOD THEREFOR
#5100Semiconductor device for improving electrical and mechanical connectivity of conductive pillers and method therefor