212004 ⎘
Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
Semiconductor device having through silicon vias and manufacturing method thereof
#54023D integration microelectronic assembly for integrated circuit devices
#5403Semiconductor device
#5404Semiconductor device structures
#5405Method for producing a protective structure
#5406Methods for surface attachment of flipped active componenets
#5407SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
#5408Flip chip assembly and process with sintering material on metal bumps
#5409Semiconductor device having magnetic alignment marks and underfill resin layers
#5410QFN PACKAGE AND MANUFACTURING PROCESS THEREOF
#5411Semiconductor Package, Stacking Semiconductor Package, And Method Of Fabricating The Same
#5412Power package including multiple semiconductor devices
#5413Method and apparatus for dicing die attach film on a semiconductor wafer
#5414Solder alloys and arrangements
#5415Impedence controlled packages with metal sheet or 2-layer RDL
#5416Wiring substrate, semiconductor device and manufacturing method thereof
#5417Semiconductor device
#5418Chip package structure and manufacturing method thereof
#5419Chip package structure and method of making the same
#54203D integration microelectronic assembly for integrated circuit devices
#5421Semiconductor package
#5422Systems and methods for three dimensional sensors
#5423Semiconductor device and method of forming a power MOSFET with interconnect structure silicide layer and low profile bump
#5424Mounting board and structure of the same
#5425Heterostructure containing IC and LED and method for fabricating the same
#5426LED leadframe or LED substrate, semiconductor device, and method for manufacturing LED leadframe or LED substrate
#5427LED PACKAGE
#5428Gallium-substituted yttrium aluminum garnet phosphor and light emitting devices including the same
#5429SUBSTRATE FOR MOUNTING LIGHT-EMITTING ELEMENTS, AND LIGHT-EMITTING DEVICE
#5430Light emitter device packages, modules and methods
#5431Optoelectronic device and stacking structure
#5432Module including a sintered joint bonding a semiconductor chip to a copper surface
#5433Multilayer pillar for reduced stress interconnect and method of making same
#5434HIGH STRENGTH AND HIGH ELONGATION RATIO OF AU ALLOY BONDING WIRE
#5435Angular speed sensor for detecting angular speed
#5436SUBSTRATE FOR MOUNTING LIGHT-EMITTING ELEMENT AND METHOD FOR PRODUCING SAME
#5437Apparatus for restricting moisture ingress
#5438CONDUCTIVE STRUCTURE FOR A SEMICONDUCTOR INTEGRATED CIRCUIT AND METHOD FOR FORMING THE SAME
#5439Method of fabricating semiconductor device
#5440Implantable microelectronic device and method of manufacture
#5441Semiconductor device and method of manufacturing same
#5442Method of manufacturing a semiconductor device
#5443Semiconductor package for discharging heat and method for fabricating the same
#5444Disabling electrical connections using pass-through 3D interconnects and associated systems and methods
#5445Method for fabricating 3D integrated circuit device using interface wafer as permanent carrier
#5446METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
#5447Delta modulated low power EHF communication link
#5448Semiconductor device
#5449LED lighting apparatus with reflectors
#5450Lamp with Ferrule and Lighting Apparatus Using the Same
#5451Peel resistant multilayer wiring board with thin film capacitor and manufacturing method thereof
#5452Oxygen-Barrier Packaged Surface Mount Device
#5453PRINTED CIRCUIT BOARD (PCB) INCLUDING A WIRE PATTERN, SEMICONDUCTOR PACKAGE INCLUDING THE PCB, ELECTRICAL AND ELECTRONIC APPARATUS INCLUDING THE SEMICONDUCTOR PACKAGE, METHOD OF FABRICATING THE PCB, AND METHOD OF FABRICATING THE SEMICONDUCTOR PACKAGE
#5454Back-illuminated distance measuring sensor and distance measuring device
#5455Back-illuminated distance measuring sensor and distance measuring device
#5456SCALABLE WIDEBAND PROBES, FIXTURES, AND SOCKETS FOR HIGH SPEED IC TESTING AND INTERCONNECTS
#5457Device and system detecting breakage in dummy bumps and method thereof
#5458Semiconductor light-emitting element and flash-light device
#5459Silicone composition for sealing light emitting element, and light emitting device
#5460Coated phosphors and light emitting devices including the same
#5461Semiconductor device and driving apparatus including semiconductor device
#5462Semiconductor module and driving apparatus including semiconductor module
#5463Multi-component power structures and methods for forming the same
#5464Semiconductor device and method of forming interconnect structure with conductive pads having expanded interconnect surface area for enhanced interconnection properties
#5465Stacked electronic component and manufacturing method thereof
#5466Integrated circuit packaging system with package stacking and method of manufacture thereof
#5467Multilayered board semiconductor device with BGA package
#5468Semiconductor device and method of forming WLCSP structure using protruded MLP
#5469SEMICONDUCTOR PACKAGE AND FABRICATION METHOD OF THE SAME
#5470Conductive pads defined by embedded traces
#5471Semiconductor device including excess solder
#5472SEMICONDUCTOR DEVICE AND WIRING SUBSTRATE
#5473Protective layer for protecting TSV tips during thermo-compressive bonding
#54743D IC packaging structures and methods with a metal pillar
#5475Semiconductor device
#5476Exposed interconnect for a package on package system
#5477Semiconductor device
#5478Semiconductor package apparatus
#5479Connector design for packaging integrated circuits
#5480Wafer-level package device
#5481Electrical connection for chip scale packaging
#5482Electronic module
#5483Semiconductor device fabrication method and semiconductor device
#5484Thermally Enhanced Integrated Circuit Package
#5485Electronic device including a packaging substrate having a trench
#5486SEMICONDUCTOR PACKAGE WITH PRE-SOLDERED GROOVES IN LEADS
#5487CHIP PACKAGE
#5488HIGH-FREQUENCY MODULE MANUFACTURING METHOD
#5489Semiconductor device, semiconductor package, and electronic device
#5490Method for improving prompt dose radiation response of mixed-signal integrated circuits
#5491Semiconductor device and method of forming EWLB semiconductor package with vertical interconnect structure and cavity region
#5492Flip-chip photodiode
#5493SEMICONDUCTOR SENSOR DEVICE AND METHOD OF PACKAGING SAME
#5494Semiconductor device including Schottky barrier diode
#5495Light-emitting diode, method for manufacturing the same, and light-emitting diode lamp
#5496Interposer and manufacturing method thereof
#5497Light emitting device package and lighting system including the same
#5498Dissipation module for a light emitting device and light emitting diode device having the same
#5499LIGHT-EMITTING DEVICE AND SURFACE LIGHT SOURCE DEVICE USING THE SAME
#5500Light-emitting device and luminaire
#5501Light emitting device package and lighting system
#5502LED device and method for manufacturing the same
#5503LIGHT-EMITTING DIODE DEVICE AND METHOD FOR MANUFACTURING THE SAME
#5504LED PHOSPHOR PATTERNING
#5505Light emitting device, light emitting system having the same, and fabricating method of the light emitting device and the light emitting system
#5506Mixed light source
#5507Power semiconductor device
#5508Interposer test structures and methods
#5509Light-emitting diode, light-emitting diode lamp and lighting device
#5510Light emitting device with electrode having plurality of adhesive seeds spaced from one another on the light emitting structure
#5511BETA-SIALON FLUORESCENT MATERIAL, USES THEREOF, AND METHOD OF PRODUCING THE BETA-SIALON FLUORESCENT MATERIAL
#5512Injection molded solder process for forming solder bumps on substrates
#5513Injection molded solder process for forming solder bumps on substrates
#5514Metal trace fabrication for optical element
#5515Electronic component module
#5516BUMP WITH NANOLAMINATED STRUCTURE, PACKAGE STRUCTURE OF THE SAME, AND METHOD OF PREPARING THE SAME
#5517ESTIMATION OF PRESENCE OF VOID IN THROUGH SILICON VIA (TSV) BASED ON ULTRASOUND SCANNING
#5518MODULE MANUFACTURING METHOD
#5519Method of producing light-emitting device and light-emitting device
#5520Method of manufacturing semiconductor device
#5521Packaging jig and process for semiconductor packaging
#5522Distributed semiconductor device methods, apparatus, and systems
#5523Connecting and bonding adjacent layers with nanostructures
#5524System and method for capsule camera with on-board storage
#5525Stacked memory module and system
#5526Semiconductor device, power semiconductor module and power conversion device equipped with power semiconductor module
#5527High brightness light emitting diode (LED) packages, systems and methods with improved resin filling and high adhesion
#5528SUBSTRATE FOR MOUNTING LIGHT-EMITTING ELEMENT, AND LIGHT-EMITTING DEVICE
#5529Lighting apparatus
#5530REFLECTORS OPTIMIZED FOR LED LIGHTING FIXTURE
#5531Memory device and fabricating method thereof
#5532Amplifier component comprising a compensation element
#5533Color stable manganese-doped phosphors
#5534LIGHT EMITTING DEVICE AND ILLUMINATION APPARATUS USING SAME
#5535Electrically-cooled power module
#5536Molding device and molding method
#5537Mounting structure of semiconductor package component and manufacturing method therefor
#5538Use of a local constraint to enhance attachment of an IC device to a mounting platform
#55393D integrated circuit device having lower-cost active circuitry layers stacked before higher-cost active circuitry layer
#5540Integrated circuit apparatus, systems, and methods
#5541SEMICONDUCTOR PACKAGES
#5542Integrated circuit packaging system with interlock and method of manufacture thereof
#5543Construction of reliable stacked via in electronic substrates—vertical stiffness control method
#5544Semiconductor chip having via electrodes and stacked semiconductor chips interconnected by the via electrodes
#5545Semiconductor device, semiconductor package, interposer, semiconductor device manufacturing method and interposer manufacturing method
#5546Semiconductor device and method of forming EWLB package containing stacked semiconductor die electrically connected through conductive vias formed in encapsulant around die
#5547Aluminum Bond Pad With Trench Thinning for Fine Pitch Ultra-Thick Aluminum Products
#5548Semiconductor device having a trace comprises a beveled edge
#5549Semiconductor device and stacked-type semiconductor device
#5550Copper bonding wire for semiconductor device and bonding structure thereof
#5551BONDING PAD STRUCTURE AND INTEGRATED CIRCUIT COMPRISING A PLURALITY OF BONDING PAD STRUCTURES
#5552SEMICONDUCTOR COMPONENT AND METHOD OF FABRICATING THE SAME
#5553Semiconductor device and method of forming bump structure with multi-layer UBM around bump formation area
#5554SYSTEMS AND METHODS TO COOL SEMICONDUCTOR
#5555Semiconductor device and method of stacking semiconductor die in mold laser package interconnected by bumps and conductive vias
#5556LEADFRAME-BASED BALL GRID ARRAY PACKAGING
#5557Module and method of manufacturing a module
#5558Integrated circuit packaging system with vertical interconnects and method of manufacture thereof
#5559Conduction path, semiconductor device using the same, and method of manufacturing conduction path, and semiconductor device
#5560Semiconductor device and method of forming shielding layer over semiconductor die mounted to TSV interposer
#5561Conductive via structure
#5562Semiconductor device and method of forming RF balun having reduced capacitive coupling and high CMRR
#5563Stacked power semiconductor device using dual lead frame and manufacturing method
#5564SEMICONDUCTOR LIGHT-EMITTING DEVICE, METHOD FOR MANUFACTURING SEMICONDUCTOR LIGHT-EMITTING DEVICE, AND OPTICAL DEVICE
#5565Light emitting device and light emitting device package having the same
#5566LIGHT EMITTING DEVICE, LIGHT EMITTING DEVICE PACKAGE, AND LIGHT UNIT
#5567Light-emitting semiconductor device and package thereof
#5568Semiconductor light emitting device, method of manufacturing the same, and semiconductor light emitting device package using the same
#5569Semiconductor light emitting device including rear reflective part
#5570THERMALLY ENHANCED LIGHT EMITTING DEVICE PACKAGE
#5571Light emitting device and manufacturing method thereof
#5572Light emitting devices for light emitting diodes (LEDs)
#5573LED PACKAGE MODULE FOR LIGHTING
#5574Systems and methods providing semiconductor light emitters
#5575LIGHT EMITTING DEVICE
#5576Method for dispensing solder on a substrate and method for mounting semiconductor chips
#5577Semiconductor device mounted structure and its manufacturing method, semiconductor device mounting method, and pressing tool
#5578Solar cell assembly I
#5579Cortical interface for motor signal recording and sensory signal stimulation
#5580Semiconductor device with peeling prevention marks and shield film
#5581Solder collapse free bumping process of semiconductor device
#5582Method of manufacturing semiconductor device
#5583Methods for forming assemblies and multi-chip modules including stacked semiconductor dice
#5584METHOD FOR PRODUCING SEMICONDUCTOR CHIP WITH ADHESIVE FILM, ADHESIVE FILM FOR SEMICONDUCTOR USED IN THE METHOD, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE
#5585Light emitting device, package, light emitting device manufacturing method, package manufacturing method and package manufacturing die
#5586MEMS anchor and spacer structure
#5587Multi-die memory device
#5588LED module, backlight unit including the LED module, and method for manufacturing the LED module
#5589Support for mounting light-emitting element, and light-emitting device
#5590POWER ELECTRONIC MODULE WITH NON-LINEAR RESISTIVE FIELD GRADING AND METHOD FOR ITS MANUFACTURING
#5591Semiconductor integrated circuit device
#5592Light emitting device and system providing white light with various color temperatures
#5593Optoelectronic device and stacking structure
#5594Stacked semiconductor package
#5595Integrated void fill for through silicon via
#5596Integrated circuit package with discrete components surface mounted on exposed side
#5597Package structure and manufacturing method thereof
#5598Semiconductor structure having offset passivation to reduce electromigration
#5599Pad layout structure of semiconductor chip
#5600SEMICONDUCTOR DEVICE
#5601Method for producing a metal layer on a substrate and device
#5602Shielded electronic components and method of manufacturing the same
#5603Electromigration immune through-substrate vias
#5604Package structure and manufacturing method thereof
#5605BONDING PAD STRUCTURE AND INTEGRATED CIRCUIT COMPRISING A PLURALITY OF BONDING PAD STRUCTURES
#5606Semiconductor device and method of manufacturing the same
#5607Semiconductor component with a front side and a back side metallization layer and manufacturing method thereof
#5608SEMICONDUCTOR DEVICE WITH HEAT SPREADER
#5609Flank wettable semiconductor device
#5610Common drain exposed conductive clip for high power semiconductor packages
#5611Multi-transistor exposed conductive clip for high power semiconductor packages
#5612Thermally enhanced semiconductor package with exposed parallel conductive clip
#5613Semiconductor device and method of forming holes in substrate to interconnect top shield and ground shield
#5614Integrated circuit package system with internal stacking module
#5615Methods and structures for forming integrated semiconductor structures
#5616Semiconductor devices including stress relief structures
#5617Semiconductor device and method of forming 3D semiconductor package with semiconductor die stacked over semiconductor wafer
#5618Semiconductor device and method of forming an IPD over a high-resistivity encapsulant separated from other IPDS and baseband circuit
#5619Barrier structure
#5620Light-receiving device array, optical receiver module, and optical transceiver
#5621Semiconductor device having a bonding pad and shield structure of different thickness
#5622Package structure having MEMS elements and fabrication method thereof
#5623LED device, method of manufacturing the same, and light-emitting apparatus
#5624SEMICONDUCTOR OPTOELECTRONIC CONVERTING SYSTEM AND THE FABRICATING METHOD THEREOF
#5625Light emitting device package and manufacturing method thereof
#5626Semiconductor light emitting device
#5627Circuit board having bypass pad
#5628Method for soldering surface-mount component and surface-mount component
#5629METHOD OF PRODUCING CIRCUIT BOARD BY ADDITIVE METHOD, AND CIRCUIT BOARD AND MULTILAYER CIRCUIT BOARD OBTAINED BY THE METHOD
#5630ANISOTROPIC CONDUCTIVE FILM
#5631MOUNTING METHOD AND MOUNTING DEVICE
#5632Integrated pressure sensor seal
#5633Scalable high-bandwidth connectivity
#5634Devices and methods for radiation-based dermatological treatments
#5635Liner formation in 3DIC structures
#5636Method for producing a connection region on a side wall of a semiconductor body
#5637Arrangement for solder bump formation on wafers
#5638Method for making solder-top enhanced semiconductor device of low parasitic packaging impedance
#5639Dicing tape-integrated film for semiconductor back surface, and process for producing semiconductor device
#5640Wafer level IC assembly method
#5641Method for fabricating stacked semiconductor system with encapsulated through wire interconnects (TWI)
#5642METHODS AND APPARATUS FOR APPLYING AN ADHESIVE TO A CIRCUIT BOARD
#5643LED phosphor ink composition for ink-jet printing
#5644METHOD FOR PROCESSING CIRCUIT IN PACKAGE
#5645METHOD FOR DECAPSULATING INTEGRATED CIRCUIT PACKAGE
#5646BUMP STRUCTURE AND FABRICATION METHOD THEREOF
#5647Microphone Arrangement
#5648Optical semiconductor element package and optical semiconductor device
#5649Low inductance light source module
#5650Lighting apparatus
#5651EMBEDDED CHIP PACKAGE
#5652Circuit board having a plurality of circuit board layers arranged one over the other having bare die mounting for use as a gearbox controller
#5653SOUND SEPARATING DEVICE AND CAMERA UNIT INCLUDING THE SAME
#5654Solid-state imaging device, manufacturing method of solid-state imaging device and electronic apparatus
#5655Circuit configuration having a prescribed capacitance, and method and device for the production thereof
#5656Electronic circuitry
#5657Apparatus and methods for electronic amplification
#5658ELECTRONIC DEVICE AND METHOD OF MANUFACTURING THE ELECTRONIC DEVICE
#5659Robust FBEOL and UBM structure of C4 interconnects
#5660Integrated circuit packaging system with interconnect and method of manufacture thereof
#5661Semiconductor device and method of singulating thin semiconductor wafer on carrier along modified region within non-active region formed by irradiating energy
#5662FORMATION OF THROUGH-SILICON VIA (TSV) IN SILICON SUBSTRATE
#5663Semiconductor device and a manufacturing method thereof
#5664Package having MEMS element and fabrication method thereof
#5665Die stacking with an annular via having a recessed socket
#5666Doping Minor Elements into Metal Bumps
#5667Chip package and method for forming the same
#5668Semiconductor device and method of forming dummy pillars between semiconductor die and substrate for maintaining standoff distance
#5669Method of producing semiconductor module and semiconductor module
#5670Integrated circuit package and packaging methods
#5671Integrated circuit package and packaging methods
#5672Semiconductor device and method for manufacturing the same
#5673SEMICONDUCTOR DEVICE PACKAGING METHOD AND SEMICONDUCTOR DEVICE PACKAGE
#5674UTILIZING A JUMPER CHIP IN PACKAGES WITH LONG BONDING WIRES
#5675Wafer level package with thermal pad for higher power dissipation
#5676Semiconductor device and method of forming leadframe with conductive bodies for vertical electrical interconnect of semiconductor die
#5677SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
#56783D interconnection structure and method of manufacturing the same
#5679LEADFRAME AND METHOD FOR PACKAGING SEMICONDUCTOR DIE
#5680EMBEDDED CAPACITOR DEVICE AND METHODS OF FABRICATION
#5681SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
#5682Semiconductor package, semiconductor device manufacturing method, and solid-state imaging device
#5683Light emitting device package and ultraviolet lamp having the same
#5684Light emitting diode device including a heat-radiation/light-reflection member
#5685LED PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
#5686Recipient luminophoric mediums having narrow spectrum luminescent materials and related semiconductor light emitting devices and methods
#5687LED PACKAGE STRUCTURE AND MODULE THEREOF
#5688Manufacturing electronic device having contact elements with a specified cross section
#5689Power semiconductor module
#5690Light emitting device and light emitting device package including the same
#5691MATERIAL FOR A MOLDED RESIN FOR USE IN A SEMICONDUCTOR LIGHT-EMITTING DEVICE
#5692Scalable high-bandwidth connectivity
#5693Ultrasonic transducers for wire bonding and methods of forming wire bonds using ultrasonic transducers
#5694Method for manufacturing printed circuit board
#5695Method of producing multilayer circuit board
#5696Universal chip carrier and method
#5697NANOSTRUCTURED COMPOSITE POLYMER THERMAL/ELECTRICAL INTERFACE MATERIAL AND METHOD FOR MAKING THE SAME
#5698Solar cell assembly II
#5699Devices and methods for radiation-based dermatological treatments
#5700Devices and methods for radiation-based dermatological treatments