Patents-Review.com
ClassID:

212004 ⎘

H01L2924/00014 - page 21 - CPC Classification

Classification description:

Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by; Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Recent Application in this class:
#6001
20120248595
2012-10-04

3D semiconductor device and structure with back-bias

 #6002
20120248593
2012-10-04

Package structure for DC-DC converter

 #6003
20120248592
2012-10-04

Lead component and method for manufacturing the same, and semiconductor package

 #6004
20120248591
2012-10-04

Lead frame and semiconductor device

 #6005
20120248590
2012-10-04

Semiconductor package and lead frame therefor

 #6006
20120248589
2012-10-04

LEAD FRAME WITH COINED INNER LEADS

 #6007
20120248587
2012-10-04

Miniature Microwave Component for Surface-Mounting

 #6008
20120248582
2012-10-04

Voltage switchable dielectric for die-level electrostatic discharge (ESD) protection

 #6009
20120248581
2012-10-04

Semiconductor device and manufacturing method thereof

 #6010
20120248579
2012-10-04

Semiconductor device and manufacturing method thereof

 #6011
20120248569
2012-10-04

Interposer having an inductor

 #6012
20120248553
2012-10-04

Sensor device and manufacturing method thereof

 #6013
20120248539
2012-10-04

Flip chip semiconductor device

 #6014
20120248521
2012-10-04

Power converter having integrated capacitor

 #6015
20120248495
2012-10-04

Light-reflective anisotropic conductive paste and light-emitting device

 #6016
20120248492
2012-10-04

Optoelectronic component

 #6017
20120248491
2012-10-04

Manufacturing method for semiconductor light-emitting element

 #6018
20120248488
2012-10-04

Light-emitting diode package and manufacturing method thereof

 #6019
20120248477
2012-10-04

High efficiency LEDS and LED lamps

 #6020
20120248473
2012-10-04

Light emitting semiconductor structure

 #6021
20120248469
2012-10-04

Light emitting apparatus

 #6022
20120248459
2012-10-04

Substrate, template substrate, semiconductor light emitting element, semiconductor light emitting element producing method, illumination device using semiconductor light emitting element and electronic device

 #6023
20120248439
2012-10-04

Semiconductor packages

 #6024
20120248294
2012-10-04

Imaging device with an imaging element and an electronic component

 #6025
20120248094
2012-10-04

Soldering method

 #6026
20120247813
2012-10-04

Printed wiring board and method for manufacturing printed wiring board

 #6027
20120244697
2012-09-27

METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE

 #6028
20120244665
2012-09-27

Method of manufacturing semiconductor device

 #6029
20120244663
2012-09-27

SEMICONDUCTOR DEVICE CHIP MOUNTING METHOD

 #6030
20120244661
2012-09-27

Method of fabricating semiconductor die with through-hole via on saw streets and through-hole via in active area of die

 #6031
20120244652
2012-09-27

Methods of fabricating light emitting diode devices

 #6032
20120244651
2012-09-27

Method for manufacturing light emitting diode

 #6033
20120244351
2012-09-27

MULTILAYER RESIN SHEET AND METHOD FOR PRODUCING THE SAME, METHOD FOR PRODUCING CURED MULTILAYER RESIN SHEET, AND HIGHLY THERMALLY CONDUCTIVE RESIN SHEET LAMINATE AND METHOD FOR PRODUCING THE SAME

 #6034
20120244347
2012-09-27

METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP, ADHESIVE FILM FOR SEMICONDUCTOR, AND COMPOSITE SHEET USING THE FILM

 #6035
20120244276
2012-09-27

METHOD FOR DEPOSITING A PALLADIUM LAYER SUITABLE FOR WIRE BONDING ON CONDUCTORS OF A PRINTED CIRCUIT BOARD, AND PALLADIUM BATH FOR USE IN SAID METHOD

 #6036
20120243261
2012-09-27

Light-source circuit unit, illumination device, and display device

 #6037
20120243255
2012-09-27

Illumination device and display device

 #6038
20120243223
2012-09-27

Light emitting device package

 #6039
20120242216
2012-09-27

Light emitting device that suppresses color unevenness

 #6040
20120241985
2012-09-27

Method of fabricating a semiconductor chip with supportive terminal pad

 #6041
20120241984
2012-09-27

Semiconductor device and method of forming pad layout for flipchip semiconductor die

 #6042
20120241983
2012-09-27

Integrated circuit packaging system with a flip chip and method of manufacture thereof

 #6043
20120241982
2012-09-27

Packaged semiconductor assemblies and methods for manufacturing such assemblies

 #6044
20120241980
2012-09-27

Integrated circuit packaging system with collapsed multi-integration package and method of manufacture thereof

 #6045
20120241979
2012-09-27

Integrated circuit packaging system with step mold and method of manufacture thereof

 #6046
20120241973
2012-09-27

Integrated circuit packaging system with filled vias and method of manufacture thereof

 #6047
20120241972
2012-09-27

LAYOUT SCHEME FOR AN INPUT OUTPUT CELL

 #6048
20120241971
2012-09-27

Semiconductor device

 #6049
20120241968
2012-09-27

Integrated circuit packaging system with interconnects and method of manufacture thereof

 #6050
20120241967
2012-09-27

Integrated circuit packaging system with embedded conductive structure and method of manufacture thereof

 #6051
20120241966
2012-09-27

Integrated circuit packaging system with plated leads and method of manufacture thereof

 #6052
20120241965
2012-09-27

Solder in cavity interconnection structures

 #6053
20120241964
2012-09-27

Integrated circuit packaging system with interconnects and method of manufacture thereof

 #6054
20120241962
2012-09-27

Integrated circuit packaging system with lead frame etching and method of manufacture thereof

 #6055
20120241961
2012-09-27

Semiconductor apparatus, electronic device, and method of manufacturing semiconductor apparatus

 #6056
20120241960
2012-09-27

Substrate for a microelectronic package and method of fabricating thereof

 #6057
20120241959
2012-09-27

Magnetic integration double-ended converter

 #6058
20120241957
2012-09-27

Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods

 #6059
20120241956
2012-09-27

Techniques for packaging multiple device components

 #6060
20120241955
2012-09-27

Chip scale package assembly in reconstitution panel process format

 #6061
20120241954
2012-09-27

Unpackaged and packaged IC stacked in a system-in-package module

 #6062
20120241952
2012-09-27

Apparatuses and methods to enhance passivation and ILD reliability

 #6063
20120241951
2012-09-27

WAFER BUMPING USING PRINTED UNDER BUMP METALIZATION

 #6064
20120241950
2012-09-27

Semiconductor device, method of manufacturing semiconductor device, and electronic apparatus

 #6065
20120241949
2012-09-27

Semiconductor device, method of manufacturing the same, and method of manufacturing wiring board

 #6066
20120241948
2012-09-27

Integrated circuit packaging system with pads and method of manufacture thereof

 #6067
20120241947
2012-09-27

Integrated circuit packaging system with locking interconnects and method of manufacture thereof

 #6068
20120241946
2012-09-27

Semiconductor Device and Method of Forming High Routing Density Interconnect Sites on Substrate

 #6069
20120241945
2012-09-27

Semiconductor device and method of forming flipchip interconnect structure

 #6070
20120241941
2012-09-27

Semiconductor device and method of forming a thermally reinforced semiconductor die

 #6071
20120241939
2012-09-27

Apparatus for thermally enhanced semiconductor package

 #6072
20120241938
2012-09-27

Organic packaging carrier

 #6073
20120241937
2012-09-27

Package structure having micro-electromechanical element

 #6074
20120241935
2012-09-27

PACKAGE-ON-PACKAGE STRUCTURE

 #6075
20120241934
2012-09-27

SEMICONDUCTOR APPARATUS AND METHOD FOR MANUFACTURING THE SAME

 #6076
20120241933
2012-09-27

Semiconductor memory card

 #6077
20120241931
2012-09-27

Integrated circuit packaging system with interconnects and method of manufacture thereof

 #6078
20120241930
2012-09-27

Folded leadframe multiple die package

 #6079
20120241929
2012-09-27

Leadframe-based mold array package heat spreader and fabrication method therefor

 #6080
20120241928
2012-09-27

Integrated circuit packaging system with flipchip leadframe and method of manufacture thereof

 #6081
20120241926
2012-09-27

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LEVELING STANDOFF AND METHOD OF MANUFACTURE THEREOF

 #6082
20120241925
2012-09-27

Integrated circuit packaging system with an interposer substrate and method of manufacture thereof

 #6083
20120241923
2012-09-27

IC wafer having electromagnetic shielding effects and method for making the same

 #6084
20120241922
2012-09-27

Integrated circuit packaging system for electromagnetic interference shielding and method of manufacture thereof

 #6085
20120241915
2012-09-27

Semiconductor device and method of forming leadframe with notched fingers for stacking semiconductor die

 #6086
20120241888
2012-09-27

Semiconductor device using close proximity wireless communication

 #6087
20120241806
2012-09-27

Light emitting device package

 #6088
20120241804
2012-09-27

Light-emitting device package and method of manufacturing the same

 #6089
20120241797
2012-09-27

Light emitting diode, manufacturing method thereof, light emitting diode module, and manufacturing method thereof

 #6090
20120241795
2012-09-27

Optoelectronic module

 #6091
20120241790
2012-09-27

LED package

 #6092
20120241789
2012-09-27

LED package, method for making the LED package and light source having the same

 #6093
20120241786
2012-09-27

Solid state optoelectronic device with plated support substrate

 #6094
20120241784
2012-09-27

Light-emitting diode (LED) package systems and methods of making the same

 #6095
20120241781
2012-09-27

Solid state lighting component

 #6096
20120241779
2012-09-27

Light-Radiating Semiconductor Component with a Luminescence Conversion Element

 #6097
20120241773
2012-09-27

LED BAR MODULE WITH GOOD HEAT DISSIPATION EFFICIENCY

 #6098
20120241770
2012-09-27

Light emitting device and method for manufacturing the same

 #6099
20120241613
2012-09-27

Infrared imaging device and infrared imaging apparatus using it

 #6100
20120241216
2012-09-27

Compression and cold weld sealing method for an electrical via connection

 #6101
20120241202
2012-09-27

Build-up printed wiring board substrate having a core layer that is part of a circuit

 #6102
20120241197
2012-09-27

Wiring board comprising wirings arranged with crest and trough

 #6103
20120241072
2012-09-27

Component press-bonding apparatus and component press-bonding method

 #6104
20120240674
2012-09-27

Thermal fluid flow sensor and method of manufacturing the same

 #6105
20120238233
2012-09-20

Wireless communication system

 #6106
20120238060
2012-09-20

Semiconductor device and method of manufacturing the same

 #6107
20120238057
2012-09-20

Approach for bonding dies onto interposers

 #6108
20120238056
2012-09-20

Manufacturing method of semiconductor device

 #6109
20120237073
2012-09-20

Packages and methods for packaging MEMS microphone devices

 #6110
20120236893
2012-09-20

Semiconductor laser mounting for improved frequency stability

 #6111
20120236790
2012-09-20

Method and system for real time control of an active antenna over a distributed antenna system

 #6112
20120236582
2012-09-20

Semiconductor light emitting device having a reflective material, wavelength converting layer and optical plate with rough and plane surface regions, and method of manufacturing

 #6113
20120236568
2012-09-20

Light emitting device package and manufacturing method thereof

 #6114
20120236533
2012-09-20

Fluorescent tube type LED lamp

 #6115
20120236532
2012-09-20

LED ENGINE FOR ILLUMINATION

 #6116
20120236531
2012-09-20

Low height display using multilayer printed circuit board with a laminated panel as housing

 #6117
20120236529
2012-09-20

Method And Apparatus For A Light Source

 #6118
20120236524
2012-09-20

Stacked integrated component devices with energization

 #6119
20120236504
2012-09-20

Electronic device for switching currents and method for producing the same

 #6120
20120236230
2012-09-20

DEVICE SUBSTRATE AND METHOD FOR MANUFACTURING SAME

 #6121
20120235751
2012-09-20

Semiconductor device

 #6122
20120235712
2012-09-20

High voltage semiconductor device and driving circuit

 #6123
20120235695
2012-09-20

Socket, and test apparatus and method using the socket

 #6124
20120235584
2012-09-20

AC driven light emitting device connection structure

 #6125
20120235583
2012-09-20

Light emitting element with a plurality of cells bonded, method of manufacturing the same, and light emitting device using the same

 #6126
20120235581
2012-09-20

Light emitting device for AC operation

 #6127
20120235553
2012-09-20

Spherical Light Output LED Lens and Heat Sink Stem System

 #6128
20120235308
2012-09-20

Manufacturing method of semiconductor device, and semiconductor device

 #6129
20120235307
2012-09-20

Integrated circuit packaging system with lead frame stacking module and method of manufacture thereof

 #6130
20120235305
2012-09-20

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

 #6131
20120235303
2012-09-20

Reinforcement structure for flip-chip packaging

 #6132
20120235301
2012-09-20

Semiconductor apparatus including a metal alloy between a first contact and a second contact

 #6133
20120235298
2012-09-20

ELECTRONIC DEVICE AND METHOD FOR PRODUCING A DEVICE

 #6134
20120235296
2012-09-20

IC devices having TSVS including protruding tips having IMC blocking tip ends

 #6135
20120235293
2012-09-20

SEMICONDUCTOR DEVICE INCLUDING A BASE PLATE

 #6136
20120235291
2012-09-20

Semiconductor apparatus and method for manufacturing the same

 #6137
20120235290
2012-09-20

Power module for an automobile

 #6138
20120235289
2012-09-20

Power device with bottom source electrode

 #6139
20120235288
2012-09-20

Semiconductor device and method of manufacturing same

 #6140
20120235287
2012-09-20

High brightness and high contrast plastic leaded chip carrier LED

 #6141
20120235286
2012-09-20

Inserts for directing molding compound flow and semiconductor die assemblies

 #6142
20120235285
2012-09-20

Protection of reactive metal surfaces of semiconductor devices during shipping by providing an additional protection layer

 #6143
20120235278
2012-09-20

SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC SYSTEM USING THE SAME

 #6144
20120235277
2012-09-20

Multiple energization elements in stacked integrated component devices

 #6145
20120235259
2012-09-20

SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME

 #6146
20120235227
2012-09-20

Power semiconductor device

 #6147
20120235200
2012-09-20

LED device having a dome lens

 #6148
20120235199
2012-09-20

Power surface mount light emitting die package

 #6149
20120235198
2012-09-20

Light emitting diode package structure

 #6150
20120235194
2012-09-20

Light emitting diode package

 #6151
20120235193
2012-09-20

LED package with light-absorbing layer

 #6152
20120235192
2012-09-20

Light emitting diode package having multiple luminescent conversion layers

 #6153
20120235188
2012-09-20

Method and Apparatus for a Flat Top Light Source

 #6154
20120235187
2012-09-20

Light source with inner and outer bodies comprising three different encapsulants

 #6155
20120235182
2012-09-20

Light-Emitting Diode Module and Corresponding Manufacturing Method

 #6156
20120235180
2012-09-20

Packaged semiconductor light emitting devices having multiple optical elements and methods of forming the same

 #6157
20120235168
2012-09-20

Semiconductor light emitting device

 #6158
20120235167
2012-09-20

Solid state optoelectronic device with preformed metal support substrate

 #6159
20120235162
2012-09-20

POWER CONVERTER

 #6160
20120235142
2012-09-20

SEMICONDUCTOR LIGHT EMITTING DIODE CHIP, METHOD OF MANUFACTURING THEREOF AND METHOD FOR QUALITY CONTROL THEREOF

 #6161
20120234592
2012-09-20

Package and high frequency terminal structure for the same

 #6162
20120234589
2012-09-20

Wiring substrate and method of manufacturing the same

 #6163
20120234588
2012-09-20

Low cost high frequency device package and methods

 #6164
20120234579
2012-09-20

Method for contacting a chip

 #6165
20120234458
2012-09-20

Method of manufacturing optical module

 #6166
20120233856
2012-09-20

APPARATUS FOR MANUFACTURING LIGHT EMITTING DEVICE PACKAGE AND METHOD OF MANUFACTURING LIGHT EMITTING DEVICE PACKAGE USING THE SAME

 #6167
20120231629
2012-09-13

Template and pattern forming method

 #6168
20120231621
2012-09-13

Manufacturing method of a semiconductor load board

 #6169
20120231586
2012-09-13

Method of manufacturing power semiconductor device

 #6170
20120231585
2012-09-13

Method for packaging a semiconductor structure

 #6171
20120231584
2012-09-13

Semiconductor device manufacturing method

 #6172
20120231583
2012-09-13

DIE-BONDING FILM AND USE THEREOF

 #6173
20120231563
2012-09-13

Operating method of hardwired switch

 #6174
20120231557
2012-09-13

Method of manufacturing film for semiconductor device

 #6175
20120231266
2012-09-13

ADHESIVE SHEET AND ELECTRONIC COMPONENT

 #6176
20120231236
2012-09-13

Dicing film with protecting film

 #6177
20120230670
2012-09-13

Camera module lens holder

 #6178
20120230043
2012-09-13

LED mounting substrate

 #6179
20120230041
2012-09-13

LED bulb

 #6180
20120230010
2012-09-13

FLUORESCENT SUBSTANCE AND LIGHT-EMITTING DEVICE EMPLOYING THE SAME

 #6181
20120229985
2012-09-13

Semiconductor device

 #6182
20120229941
2012-09-13

Semiconductor die with integrated electro-static discharge device

 #6183
20120229132
2012-09-13

STACKED TYPE MAGNETIC FIELD DETECTION SENSOR

 #6184
20120229039
2012-09-13

Backlight unit having light emitting diode

 #6185
20120229016
2012-09-13

Fluorescent substance and light-emitting device employing the same

 #6186
20120228784
2012-09-13

SEMICONDUCTOR DEVICE

 #6187
20120228783
2012-09-13

Mixed wire bonding profile and pad-layout configurations in IC packaging processes for high-speed electronic devices

 #6188
20120228782
2012-09-13

METHOD FOR MANUFACTURING ELECTRONIC DEVICE, ELECTRONIC DEVICE, METHOD FOR MANUFACTURING ELECTRONIC DEVICE PACKAGE AND ELECTRONIC DEVICE PACKAGE

 #6189
20120228781
2012-09-13

Stacked semiconductor component having through wire interconnect (TWI) with compressed wire

 #6190
20120228780
2012-09-13

Semiconductor device and method of manufacturing the same

 #6191
20120228779
2012-09-13

Air-gap C4 fluidic I/O interconnects and methods of fabricating same

 #6192
20120228777
2012-09-13

Through silicon via guard ring

 #6193
20120228776
2012-09-13

Semiconductor device adapted to improve heat dissipation

 #6194
20120228769
2012-09-13

Carrier-free semiconductor package

 #6195
20120228768
2012-09-13

INTEGRATED CIRCUIT PACKAGING SYSTEM USING B-STAGE POLYMER AND METHOD OF MANUFACTURE THEREOF

 #6196
20120228767
2012-09-13

Integrated circuit package system with stackable devices and a method of manufacture thereof

 #6197
20120228766
2012-09-13

Semiconductor device and method of confining conductive bump material during reflow with solder mask patch

 #6198
20120228765
2012-09-13

Solder bump interconnect

 #6199
20120228763
2012-09-13

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

 #6200
20120228761
2012-09-13

Semiconductor device and method for manufacturing the same

 #6201
20120228760
2012-09-13

Systems including an I/O stack and methods for fabricating such systems

 #6202
20120228759
2012-09-13

SEMICONDUCTOR PACKAGE HAVING INTERCONNECTION OF DUAL PARALLEL WIRES

 #6203
20120228756
2012-09-13

Semiconductor housing and method for the production of a semiconductor housing

 #6204
20120228754
2012-09-13

Chip-last embedded interconnect structures

 #6205
20120228753
2012-09-13

Integrated circuit package-on-package system with underfilling structures and method of manufacture thereof

 #6206
20120228752
2012-09-13

Chip package and method for forming the same

 #6207
20120228751
2012-09-13

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

 #6208
20120228750
2012-09-13

Semiconductor device and method for manufacturing semiconductor device

 #6209
20120228749
2012-09-13

Semiconductor device and method of forming shielding layer over semiconductor die mounted to TSV interposer

 #6210
20120228745
2012-09-13

Semiconductor package structure and manufacturing method thereof

 #6211
20120228738
2012-09-13

Protecting element having first and second high concentration impurity regions separated by insulating region

 #6212
20120228696
2012-09-13

STACKED DIE POWER CONVERTER

 #6213
20120228681
2012-09-13

Image and light sensor chip packages

 #6214
20120228662
2012-09-13

Light emitting device

 #6215
20120228660
2012-09-13

Method of manufacturing lead frame for light-emitting device package and light-emitting device package

 #6216
20120228655
2012-09-13

Light emitting diode with large viewing angle and fabricating method thereof

 #6217
20120228650
2012-09-13

Light emitting diode emitter substrate with highly reflective metal bonding

 #6218
20120228645
2012-09-13

LED lamp strip and manufacturing process thereof

 #6219
20120228564
2012-09-13

Reflector for light-emitting device, and light-emitting device

 #6220
20120228026
2012-09-13

Anisotropic conductive film, connection structure and method of producing the same

 #6221
20120228012
2012-09-13

Circuit board and method for manufacturing circuit board

 #6222
20120228011
2012-09-13

Semiconductor Load Board

 #6223
20120227952
2012-09-13

Radiator and method of manufacturing radiator

 #6224
20120225563
2012-09-06

ETCHING LIQUID FOR ETCHING SILICON SUBSTRATE REAR SURFACE IN THROUGH SILICON VIA PROCESS AND METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP HAVING THROUGH SILICON VIA USING THE ETCHING LIQUID

 #6225
20120225523
2012-09-06

Method for attaching wide bus memory and serial memory to a processor within a chip scale package footprint

 #6226
20120225522
2012-09-06

Package 3D interconnection and method of making same

 #6227
20120225514
2012-09-06

Manufacturing method of semiconductor device

 #6228
20120225509
2012-09-06

LED flip-chip package structure with dummy bumps

 #6229
20120225508
2012-09-06

Method of manufacturing package substrate for optical element

 #6230
20120224817
2012-09-06

Optical communication module

 #6231
20120224379
2012-09-06

Light emitting diode device with lens having a cavity

 #6232
20120224372
2012-09-06

Light source unit and lighting system

 #6233
20120224352
2012-09-06

LED lamp

 #6234
20120224335
2012-09-06

Printed circuit board and semiconductor package using the same

 #6235
20120224332
2012-09-06

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH BUMP BONDED DIES AND METHOD OF MANUFACTURE THEREOF

 #6236
20120224331
2012-09-06

LOW PROFILE SOLDER GRID ARRAY TECHNOLOGY FOR PRINTED CIRCUIT BOARD SURFACE MOUNT COMPONENTS

 #6237
20120224328
2012-09-06

Inner-layer heat-dissipating board, multi-chip stack package structure having the inner layer heat-dissipating board and fabrication method thereof

 #6238
20120223738
2012-09-06

Method for fabrication of configurable systems

 #6239
20120223622
2012-09-06

Vibrating device, method for manufacturing vibrating device, and electronic apparatus

 #6240
20120223444
2012-09-06

Semiconductor device with resin mold

 #6241
20120223443
2012-09-06

Active matrix substrate

 #6242
20120223442
2012-09-06

Electronic device with aerogel thermal isolation

 #6243
20120223435
2012-09-06

INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LEADS AND METHOD OF MANUFACTURE THEREOF

 #6244
20120223434
2012-09-06

Co-axial restraint for connectors within flip-chip packages

 #6245
20120223433
2012-09-06

SEMICONDUCTOR PACKAGE INCLUDING CONNECTING MEMBER HAVING CONTROLLED CONTENT RATIO OF GOLD

 #6246
20120223432
2012-09-06

Moisture barrier for a wire bond

 #6247
20120223428
2012-09-06

Semiconductor device and method of forming vertical interconnect structure between semiconductor die and substrate

 #6248
20120223427
2012-09-06

Flip chip package

 #6249
20120223426
2012-09-06

Semiconductor device and method of forming stress relief layer between die and interconnect structure

 #6250
20120223425
2012-09-06

Semiconductor device and fabrication method thereof

 #6251
20120223424
2012-09-06

Semiconductor component and production method

 #6252
20120223422
2012-09-06

Apparatus and methods for reducing impact of high RF loss plating

 #6253
20120223415
2012-09-06

IGBT power semiconductor package having a conductive clip

 #6254
20120223347
2012-09-06

Light emitting device and lighting apparatus having crystal control layer

 #6255
20120223343
2012-09-06

Light emitting diode package

 #6256
20120223326
2012-09-06

Light emitting diode and method for fabricating the same

 #6257
20120223322
2012-09-06

III-nitride transistor stacked with diode in a package

 #6258
20120223321
2012-09-06

III-nitride transistor stacked with FET in a package

 #6259
20120222892
2012-09-06

Wire bond pad system and method

 #6260
20120221759
2012-08-30

Semiconductor device having a bus configuration which reduces electromigration

 #6261
20120220724
2012-08-30

Surface modifying macromolecules with high degradation temperatures and uses thereof

 #6262
20120220123
2012-08-30

Through-hole electrode substrate and method of manufacturing the same

 #6263
20120220118
2012-08-30

Interconnections for fine pitch semiconductor devices and manufacturing method thereof

 #6264
20120220117
2012-08-30

Polymer and solder pillars for connecting chip and carrier

 #6265
20120220091
2012-08-30

Methods related to power semiconductor devices with thick bottom oxide layers

 #6266
20120220082
2012-08-30

Semiconductor packages and methods of packaging semiconductor devices

 #6267
20120220080
2012-08-30

Method for fabricating flip-attached and underfilled semiconductor devices

 #6268
20120220079
2012-08-30

Method for manufacturing semiconductor device

 #6269
20120220065
2012-08-30

Method for reducing tilt of transparent window during manufacturing of image sensor

 #6270
20120220056
2012-08-30

Mechanical coupling in a multi-chip module using magnetic components

 #6271
20120218796
2012-08-30

Compound semiconductor device, method for producing the same, and power supply

 #6272
20120218729
2012-08-30

Methods of forming a microshield on standard QFN package

 #6273
20120218717
2012-08-30

Power module

 #6274
20120218715
2012-08-30

Electronic component and method of manufacturing electronic component

 #6275
20120218714
2012-08-30

Power electronics assemblies, insulated metal substrate assemblies, and vehicles incorporating the same

 #6276
20120218713
2012-08-30

Heat radiation material, electronic device and method of manufacturing electronic device

 #6277
20120218508
2012-08-30

Methods and apparatus for an ophthalmic lens with functional insert layers

 #6278
20120218496
2012-08-30

Red phosphor, method for producing red phosphor, white light source, illuminating device, and liquid crystal display device

 #6279
20120218318
2012-08-30

Light emitting apparatus, illumination apparatus and display apparatus

 #6280
20120218046
2012-08-30

Class-AB power amplifier

 #6281
20120218045
2012-08-30

Class-C power amplifier

 #6282
20120217942
2012-08-30

SEMICONDUCTOR CIRCUIT AND SWITCHING POWER SUPPLY APPARATUS

 #6283
20120217660
2012-08-30

Semiconductor apparatus, method for manufacturing the same and electric device

 #6284
20120217659
2012-08-30

Integrated circuit package with molded cavity

 #6285
20120217658
2012-08-30

Multi-stack semiconductor integrated circuit device

 #6286
20120217657
2012-08-30

MULTI-CHIP MODULE PACKAGE

 #6287
20120217656
2012-08-30

Semiconductor package including multiple chips and separate groups of leads

 #6288
20120217655
2012-08-30

Stacked multi-die electronic device with interposed electrically conductive strap

 #6289
20120217653
2012-08-30

SEMICONDUCTOR DEVICE AND NOISE SUPPRESSING METHOD

 #6290
20120217652
2012-08-30

Semiconductor devices including a through-substrate conductive member with an exposed end

 #6291
20120217645
2012-08-30

Semiconductor device and method of forming interposer and opposing build-up interconnect structure with connecting conductive TMV for electrical interconnect of Fo-WLCSP

 #6292
20120217644
2012-08-30

Semiconductor device and method of forming conductive THV and RDL on opposite sides of semiconductor die for RDL-to-RDL bonding

 #6293
20120217643
2012-08-30

Semiconductor device and method of forming bond wires between semiconductor die contact pads and conductive TOV in peripheral area around semiconductor die

 #6294
20120217642
2012-08-30

Semiconductor device packages having a side-by-side device arrangement and stacking functionality

 #6295
20120217640
2012-08-30

Semiconductor device and method of forming bump structure with insulating buffer layer to reduce stress on semiconductor wafer

 #6296
20120217637
2012-08-30

Semiconductor package having substrate for high speed semiconductor package

 #6297
20120217635
2012-08-30

Packaging Structure and Method

 #6298
20120217634
2012-08-30

Semiconductor Device and Method of Forming the Device Using Sacrificial Carrier

 #6299
20120217632
2012-08-30

Extending metal traces in bump-on-trace structures

 #6300
20120217629
2012-08-30

Semiconductor device and method of forming a wafer level package structure using conductive via and exposed bump