Wafer level package using stud bump coated with solder

Semiconductor device and method of manufacturing the same

Semiconductor package and manufacturing method thereof

POWER MODULE AND INVERTER FOR VEHICLES

SEMICONDUCTOR MULTI-CHIP PACKAGE

FLIP-CHIP PACKAGE STRUCTURE WITH BLOCK BUMPS AND THE WEDGE BONDING METHOD THEREOF

SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SEMICONDUCTOR DEVICE, AND WIRING BOARD

Semiconductor device

Electronic component built-in substrate and method of manufacturing the same

Electronic component embedded printed circuit board and manufacturing method thereof

Electronic Device and Manufacturing Method for Electronic Device

APPLICATION OF A SELF-ASSEMBLED MONOLAYER AS AN OXIDE INHIBITOR

Manufacturing method for protection circuit module of secondary battery

Methods of Forming Integrated Circuit Contact Pads Using Electroless Plating of Diffusion Barrier Layers

DICING/DIE-BONDING TAPE AND METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP

Solder joint flip chip interconnection having relief structure

Process for spontaneous deposition from an organic solution

Assembling stacked substrates that can form 3-D structures

PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

Through-substrate vias (TSVs) electrically connected to a bond pad design with reduced dishing effect

Semiconductor substrates with unitary vias and via terminals, and associated systems and methods

Electric power semiconductor device

Semiconductor package, semiconductor module, and method for fabricating the semiconductor package

Semiconductor package with a metal post

Semiconductor device and method of manufacturing the same

IC die having TSV and wafer level underfill and stacked IC devices comprising a workpiece solder connected to the TSV

Stackable semiconductor assemblies and methods of manufacturing such assemblies

Thermally improved semiconductor QFN/SON package

Semiconductor integrated circuit device

Semiconductor device and method of forming stepped-down RDL and recessed THV in peripheral region of the device

Semiconductor package with embedded spiral inductor

Chip Module for Installing in Sensor Chip Cards for Fluidic Applications and Method for Producing a Chip Module of This Type

Self-assembly of components

Wire bonding method

Adhesive film, connecting method, and joined structure

ELECTRIC CONTACT AND METHOD FOR PRODUCING THE SAME AND CONNECTOR USING THE ELECTRIC CONTACTS

Wiring board having heat intercepting member

Dicing/die-bonding film, method of fixing chipped work and semiconductor device

Dicing/die bonding film

Electronic device and method for fabricating the same

Bonding apparatus and bonding method

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE AND OPTICAL PICKUP MODULE

METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, OPTICAL PICKUP MODULE AND SEMICONDUCTOR DEVICE

Pad structure of semiconductor integrated circuit apparatus

Semiconductor device

Semiconductor device, manufacturing method thereof, and manufacturing method of semiconductor module

Semiconductor die package including multiple dies and a common node structure

Semiconductor device and method of manufacturing the same

Power semiconductor module with a hermetically tight circuit arrangement and method for producing such a module

Semiconductor device with improved resin configuration

Packaging systems and methods

Bond pad connection to redistribution lines having tapered profiles

Forming solder balls on substrates

Bonding apparatus and bonding method

METHOD AND APPARATUS FOR WAFER BONDING

Arrangement for hermetically sealing components, and method for the production thereof

Semiconductor power conversion apparatus and method of manufacturing the same

LITHOGRAPHIC CONTACT ELEMENTS

METHOD FOR PACKAGING SEMICONDUCTOR

Module having a stacked passive element and method of forming the same

Mounting method using dilatancy fluid

Semiconductor device and method of bonding wires between semiconductor chip and wiring substrate

Semiconductor package having bump ball

Carbon nanotube-reinforced solder caps, and chip packages and systems containing same

Metallic bump structure without under bump metallurgy and manufacturing method thereof

SEMICONDUCTOR DEVICE AND FABRICATION METHOD OF THE SAME

Die rearrangement package structure using layout process to form a compliant configuration

Semiconductor Chip Package System Vertical Interconnect

Module having a stacked passive element and method of forming the same

THIN FOIL FOR USE IN PACKAGING INTEGRATED CIRCUITS

Twin-chip-mounting type diode

Electronic circuit device

Transfer tape strap process

Multilayer circuit board and method for manufacturing the same

Double-sided connector with protrusions

Method for manufacturing semiconductor device having electrode for external connection

Thermosetting die-bonding film

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE WITH EMBEDDED INTERPOSER

Circuit device and method of manufacturing the same

Adhesive tape and semiconductor device using the same

Method for forming three-dimensional structure, method for manufacturing semiconductor device, and semiconductor device

SEMICONDUCTOR MODULE AND METHOD FOR MANUFACTURING THE SEMICONDUCTOR MODULE

Method of forming a semiconductor package including two devices

Microelectronic package with carbon nanotubes interconnect and method of making same

Semiconductor device assemblies, electronic devices including the same and assembly methods

Semiconductor package having ink-jet type dam and method of manufacturing the same

Lead frame and method of manufacturing the same

Device including a power semiconductor chip electrically coupled to a leadframe via a metallic layer

Device including two mounting surfaces

Semiconductor device

On-chip RF shields with front side redistribution lines

Lock and key through-via method for wafer level 3 D integration and structures produced

Substrate structure with die embedded inside and dual build-up layers over both side surfaces and method of the same

SEMICONDUCTOR DEVICE

Device and method for making a semiconductor device including bonding two bonding partners

Printed circuit board including electronic component embedded therein and method of manufacturing the same

ADHESIVE FOR ELECTRONIC COMPONENTS

Method of forming electrode connecting portion

Method and apparatus for fabricating self-assembling microstructures

Thermal barrier layer for integrated circuit manufacture

Part mounting device

Bond pad structure having dummy plugs and/or patterns formed therearound

Connection by fitting together two soldered inserts

Wiring Structure, Semiconductor Device Having the Wiring Structure, and Method for Manufacturing the Semiconductor Device

Wire bonding structure and manufacturing method thereof

Method of forming a wafer level package with RDL interconnection over encapsulant between bump and semiconductor die

Multiple die structure and method of forming a connection between first and second dies in same

Method of manufacturing an electronic system

Semiconductor device

Semiconductor package with a controlled impedance bus and method of forming same

Semiconductor device for battery power voltage control

Semiconductor device and manufacturing method of a semiconductor device

FINE-PITCH OBLONG SOLDER CONNECTIONS FOR STACKING MULTI-CHIP PACKAGES

Low cost die placement

Semiconductor package and method for manufacturing the same

Substrate structure with die embedded inside and dual build-up layers over both side surfaces and method of the same

Top exposed clip with window array

Method of electrically connecting a shielding layer to ground through a conductive via disposed in peripheral region around semiconductor die

Lead frame, and light emitting diode module having the same

LOW COST FLEXIBLE DISPLAY SHEET

Method and apparatus for forming planar alloy deposits on a substrate

Solder ball printing apparatus

Electronic component mounting structure

PACKAGE AND SUBSTRATE STRUCTURE WITH AT LEAST ONE ALIGNMENT PATTERN

Connecting terminal, semiconductor package using connecting terminal and method for manufacturing semiconductor package

Apparatus to manufacture a semiconductor package having a buffer disposed adjacent to a process unit of the apparatus

Low cost die release wafer

Method for the Production of a Windshield Wiping Concentrate in the Form of Tablets, Windshield Wiping Concentrate, and Corresponding Presentation

Wafer temporary bonding method using silicon direct bonding

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Method of manufacturing a semiconductor device

Castellation wafer level packaging of integrated circuit chips

Semiconductor device and a method of manufacturing the same

Fabrication method of package structure with simplified encapsulation structure and simplified wiring

Imaging device for a bonding apparatus

Flexible electronic device and flexible display device

METHOD OF COMPRESSION-MOLDING LIGHT-EMITTING ELEMENTS

Integrated circuit device

Solder joint flip chip interconnection

METHOD OF WIREBONDING THAT UTILIZES A GAS FLOW WITHIN A CAPILLARY FROM WHICH A WIRE IS PLAYED OUT

Power semiconductor module including a multilayer substrate

Resin sheet, circuit device and method of manufacturing the same

Bond pad structures and semiconductor devices using the same

Semiconductor package

Method of manufacturing a semiconductor device

Stacked Semiconductor Chips with Through Substrate Vias

Process for making contact with and housing integrated circuits

Conductive composition

Electronic component mounting apparatus and electronic component mounting method

Wiring board and method of manufacturing the same

CONDUCTIVE PARTICLE, ADHESIVE COMPOSITION, CIRCUIT-CONNECTING MATERIAL, CIRCUIT-CONNECTING STRUCTURE, AND METHOD FOR CONNECTION OF CIRCUIT MEMBER

Low temperature curing acrylate and maleimide based formulations and methods for use thereof

Method of manufacturing a semiconductor device

Interconnection for flip-chip using lead-free solders and having improved reaction barrier layers

Method of fabicating a microelectronic die having a curved surface

Layer having functionality, method for forming flexible substrate having the same, and method for manufacturing semiconductor device

Electronic module with a conductive-pattern layer and a method of manufacturing same

Method of manufacturing stack-type semiconductor device and method of manufacturing stack-type electronic component

Method for producing electronic part package

Composition Containing Porphyrin to Improve Adhesion

Interconnect structures for stacked dies, including penetrating structures for through-silicon vias, and associated systems and methods

SEMICONDUCTOR DEVICE HAVING AN INTERLAYER INSULATING FILM WIRING LAMINATED STRUCTURE SECTION AND METHOD OF FABRICATING THE SAME

PRODUCTION METHOD OF SEMICONDUCTOR DEVICE, PRODUCTION METHOD OF DISPLAY DEVICE, SEMICONDUCTOR DEVICE, PRODUCTION METHOD OF SEMICONDUCTOR ELEMENT, AND SEMICONDUCTOR ELEMENT

Semiconductor device with signal wirings and dummy wirings that pass through under electrode pads and in which the number of dummy wirings near the peripheral portion of the device being greater than at a more centrally located portion

ELECTRONIC COMPONENT PACKAGE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device

Semiconductor chip capable of increased number of pads in limited region and semiconductor package using the same

Adhesive tape, connected structure and semiconductor package

Systems and methods for enabling ESD protection on 3-D stacked devices

Method of forming vertically offset bond on trace interconnects on recessed and raised bond fingers

Stretchable form of single crystal silicon for high performance electronics on rubber substrates

Integrated capacitors in package-level structures, processes of making same, and systems containing same

Method of fabricating a semiconductor device

Wire bonding method, wire bonding apparatus, and wire bonding control program

Method for purifying quench water and scrubbing water from MTO by mini-hydrocyclone and apparatus used for same

Method for producing an LTCC substrate

Microstructure Apparatus and Method for Manufacturing Microstructure Apparatus

Dicing and die attach adhesive

Electrically conductive structure on a semiconductor substrate formed from printing

Fabrication method of semiconductor device

Semiconductor package structures

Method of manufacturing semiconductor device

Thermosetting die-bonding film

Method of manufacturing a semiconductor device

Method of stacking and interconnecting semiconductor packages via electrical connectors extending between adjoining semiconductor packages

Method of stacking and interconnecting semiconductor packages via electrical connectors extending between adjoining semiconductor packages

PROCESS AND PASTE FOR CONTACTING METAL SURFACES

Insulation substrate, power module substrate, manufacturing method thereof, and power module using the same

Wafer level compliant packages for rear-face illuminated solid state image sensors

Isolator with complementary configurable memory

Method of resin sealing electronic part

Electronic component mounting structure and method for manufacturing the same

Semiconductor device and method for fabricating the same

SEMICONDUCTOR DEVICE INCLUDING COLUMNAR ELECTRODES HAVING PLANAR SIZE GREATER THAN THAT OF CONNECTION PAD PORTION OF WIRING LINE, AND MANUFACTURING METHOD THEREOF

Wafer level package and method of manufacturing the same

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING SAME AND METHOD OF REPAIRING SAME

Crystal structure of a solder bump of flip chip semiconductor device

Methods of forming C4 round dimple metal stud bumps for fine pitch packaging applications and structures formed thereby

CHIP SCALE PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF

SURFACE SMOOTHENED ULTRAHIGH CONDUCTIVITY COMPOSITE LID FOR IMPROVED MARKING PERMANENCY OF SEMICONDUCTOR PACKAGED DEVICES

Ball grid array package having one or more stiffeners

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device and method for fabricating semiconductor device

QFN package

ENHANCED WIRE BOND STABILITY ON REACTIVE METAL SURFACES OF A SEMICONDUCTOR DEVICE BY ENCAPSULATION OF THE BOND STRUCTURE

Semiconductor device and method of forming the device using sacrificial carrier

STACK TYPE SEMICONDUCTOR DEVICE WITH REINFORCING RESIN

Semiconductor package which includes an insulating layer located between package substrates which may prevent an electrical short caused by a bonding wire

Flip chip MLP with conductive ink

Resin sealing type semiconductor device and method of manufacturing the same, and lead frame

Resin sealing type semiconductor device and method of manufacturing the same, and resin sealing type electronic device

Low stress cavity package

Molded ultra thin semiconductor die packages, systems using the same, and methods of making the same

Wire bonding device and wire bonding process using same

Circuit substrate for mounting electronic component and circuit substrate assembly having same

CONTROLLING THE POROSITY OF METAL PASTES FOR PRESSURE FREE, LOW TEMPERATURE SINTERING PROCESS

Apparatus and method of substrate to substrate bonding for three dimensional (3D) IC interconnects

Bonded structure and bonding method

Method of fabricating a high Q factor integrated circuit inductor

Electromigration-resistant and compliant wire interconnects, nano-sized solder compositions, systems made thereof, and methods of assembling soldered packages

Integrated conductive structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system

ADHESIVE SHEET FOR PRODUCING A SEMICONDUCTOR DEVICE, AND A METHOD FOR PRODUCING A SEMICONDUCTOR DEVICE USING THE SAME

Integrated circuit apparatus, systems, and methods

MULTI-CHIP PRINTHEAD ASSEMBLER

Stack type surface acoustic wave package, and method for manufacturing the same

Method for fabricating semiconductor component having encapsulated through wire interconnect (TWI)

Electronic Component Union, Electronic Circuit Module Utilizing the Same, and Process for Manufacturing the Same

Multi-component device integrated into a matrix

TRANSIENT LIQUID PHASE EUTECTIC BONDING

Electrical component and film composite laminated on the component and method for production

Method for the fabrication of semiconductor devices including attaching chips to each other with a dielectric material

Semiconductor device and method of manufacturing the same

Electrode connection structure of semiconductor chip, conductive member, and semiconductor device and method for manufacturing the same

SEMICONDUCTOR DEVICE

Semiconductor device and method of fabricating semiconductor device

Integrated thermal structures and fabrication methods thereof facilitating implementing a cell phone or other electronic system

Semiconductor device

Semiconductor chip including a chip via plug penetrating a substrate, a semiconductor stack, a semiconductor device package and an electronic apparatus including the semiconductor chip

CIRCUIT SUBSTRATE, AN ELECTRONIC DEVICE ARRANGEMENT AND A MANUFACTURING PROCESS FOR THE CIRCUIT SUBSTRATE

Semiconductor device having a sealant layer including carbon directly contact the chip and the carrier

Semiconductor light emitting device

Minute ball array apparatus

Electrode structure and method for forming bump

Method of manufacturing printed wiring board with built-in electronic component

Semiconductor device and manufacturing method thereof

Methods of forming semiconductor constructions and assemblies

High-temperature bonding composition, substrate bonding method, and 3-D semiconductor device

Method of manufacturing a single chip semiconductor integrated circuit device including a mask ROM in a short time

LOW FABRICATION COST, HIGH PERFORMANCE, HIGH RELIABILITY CHIP SCALE PACKAGE

Stacked semiconductor device and method

Semiconductor integrated circuit device, mounting structure of semiconductor integrated circuit device, and method for manufacturing semiconductor integrated circuit device

Semiconductor device

INTEGRATED CIRCUIT STRUCTURES AND FABRICATING METHODS THAT USE VOIDS IN THROUGH HOLES AS JOINING INTERFACES

MINIATURE MICROWAVE PACKAGE AND PROCESS FOR FABRICATING THE PACKAGE

Semiconductor package and manufacturing method thereof

Method of packaging and interconnection of integrated circuits

Method for forming terminal of stacked package element and method for forming stacked package

Semiconductor structure with communication element

Ultrasonic bonding apparatus

Processes for forming photovoltaic devices

Method of fabricating a circuit structure

Methods and apparatus for improved thermal performance and electromagnetic interference (EMI) shielding in leadframe integrated circuit (IC) packages

Methods of making compliant semiconductor chip packages

Method of manufacturing stacked semiconductor device

Method for fabricating package structure of stacked chips

Bond pad structure and method for producing same

Semiconductor device with multilayer wiring structure formed within and method of manufacturing the same

Semiconductor chip and semiconductor device

BUMP STRUCTURE FOE SEMICONDUCTOR DEVICE

Three-dimensional conducting structure and method of fabricating the same

Structures and methods for improving solder bump connections in semiconductor devices

Flange package for a semiconductor device

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

Compact co-packaged semiconductor dies with elevation-adaptive interconnection plates

Lead frame package

Through wafer vias and method of making same

Through wafer vias and method of making same

Wafer level semiconductor module and method for manufacturing the same

Assembling of Electronic Members on IC Chip

Radio frequency power semiconductor device comprising matrix of cavities as dielectric isolation structure

Semiconductor device and radio communication device

Semiconductor device and method for making the same

Electrical connection of components

Method of bonding two structures together with an adhesive line of controlled thickness

Method for manufacturing multilayer printed circuit board

Method of fabricating a base layer circuit structure

Maskless Process for Solder Bump Production

DICING DIE-BONDING FILM

Dicing die-bonding film

DICING DIE-BONDING FILM

METHOD OF FABRICATING PRINTED CIRCUIT BOARD HAVING SEMICONDUCTOR COMPONENTS EMBEDDED THEREIN

Conductive bump, method for manufacturing the conductive bump, semiconductor device and method for manufacturing the semiconductor device

DICING DIE-BONDING FILM

Method and apparatus for forming planar alloy deposits on a substrate

Microelectronic packages with small footprints and associated methods of manufacturing

Antennas integrated in semiconductor chips

Integrated Circuit Interconnect Method and Apparatus

Integrated Circuit Interconnect Method and Apparatus

Copper on organic solderability preservative (OSP) interconnect and enhanced wire bonding process

METHOD OF FABRICATING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE