FORMING EDGE METALLIC CONTACTS AND USING COULOMB FORCES TO IMPROVE OHMIC CONTACT

SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

METHOD FOR PRODUCING A SEMICONDUCTOR DEVICE

Method of forming a crack stop laser fuse with fixed passivation layer coverage

Dicing die-bonding film

Method of manufacturing flexible semiconductor assemblies

Interconnection element with plated posts formed on mandrel

Levitating substrate being charged by a non-volatile device and powered by a charged capacitor or bonding wire

Forming large planar structures from substrates using edge Coulomb forces

Assembling stacked substrates that can form cylindrical inductors and adjustable transformers

Fabricated adhesive microstructures for making an electrical connection

SEMICONDUCTOR DEVICE

Flip-chip assembly with organic chip carrier having mushroom-plated solder resist opening

Semiconductor device

Top layers of metal for high performance IC's

Flip chip interconnection with double post

Semiconductor device having solder-free gold bump contacts for stability in repeated temperature cycles

Semiconductor wafer level interconnect package utilizing conductive ring and pad for separate voltage supplies and method of making the same

Semiconductor package and method of forming similar structure for top and bottom bonding pads

CIRCUIT MEMBER, MANUFACTURING METHOD OF THE CIRCUIT MEMBER, AND SEMICONDUCTOR DEVICE INCLUDING THE CIRCUIT MEMBER

Method for attaching a semiconductor die to a leadframe, and a semiconductor device

Embedded package security tamper mesh

Integrated circuit package system with shield

Component attach methods and related device structures

MULTI-LAYERED WIRING SUBSTRATE, METHOD FOR PRODUCING THE SAME, AND SEMICONDUCTOR DEVICE

Method of fabricating an interconnection element having conductive posts

Method of printing electronic circuits

Reconfigurable system that exchanges substrates using coulomb forces to optimize a parameter

Electrode bonding method and part mounting apparatus

Chip on wafer bonder

Method of manufacturing a semiconductor device

LCD Driver IC and Method for Manufacturing the Same

Flexible column die interconnects and structures including same

Metal foil interconnection of electrical devices

Flip chip package and method for manufacturing the same

Wafer level semiconductor package and method for manufacturing the same

UNDERBUMP METALLURGY EMPLOYING SPUTTER-DEPOSITED NICKEL TITANIUM ALLOY

Semiconductor device having improved solder joint and internal lead lifetimes

Resin-sealed semiconductor device, manufacturing method thereof, base material for the semiconductor device, and layered and resin-sealed semiconductor device

Semiconductor device

Method of fabricating a semiconductor device having a heat sink with an exposed surface

Edge seal for thru-silicon-via technology

Semiconductor device and method of forming through hole vias in die extension region around periphery of die

Semiconductor power module package without temperature sensor mounted thereon and method of fabricating the same

Semiconductor device having a stacked multi structure that has layered insulated gate-type bipolar transistors

Semiconductor device including a die region designed for aluminum-free solder bump connection and a test structure designed for aluminum-free wire bonding

METHOD AND DEVICE FOR WIRE BONDING

Method of Forming Conductive Lines and Similar Features

Methods for manufacturing semiconductor devices

Isolating chip-to-chip contact

Low fabrication cost, high performance, high reliability chip scale package

Method for making a device including placing a semiconductor chip on a substrate

Method and apparatus for manufacturing semiconductor module

Chip packaging process including simpification and mergence of burn-in test and high temperature test

Adhesive compostion for die bonding in semiconductor assembly, adhesive film prepared therefrom, dicing die-bonding film prepared therefrom, device package including the same, and associated methods

FILM-LIKE ADHESIVE AND METHOD FOR CARRYING THE SAME

SEMICONDUCTOR PACKAGE, ELECTRONIC DEVICE INCLUDING THE SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE

Semiconductor device and method of manufacturing the same

Method of manufacturing semiconductor device and semiconductor device

Method of producing multiple semiconductor devices

Adhesive on wire stacked semiconductor package

Semiconductor power device package having a lead frame-based integrated inductor

Device and method including a soldering process

SEMICONDUCTOR APPARATUS

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Electronic component module

Process and Paste for Contacting Metal Surfaces

Soldering Method, Method for Manufacturing Semiconductor Module, and Soldering Apparatus

Soldering Method and Semiconductor Module Manufacturing Method

Work clamp and wire bonding apparatus

UNDERBUMP METALLURGY EMPLOYING SPUTTER-DEPOSITED NICKEL TITANIUM COPPER ALLOY

Multilayered Circuit Board for Connection to Bumps

INTERCONNECT STRUCTURE FOR A MICROELECTRONIC DEVICE, METHOD OF MANFACTURING SAME, AND MICROELECTRONIC STRUCTURE CONTAINING SAME

Electronic circuit device and method for manufacturing same

Epoxy Resin Composition and Die Bonding Material Comprising the Composition

Manufacture of a circuit board containing a component

Semiconductor device

Semiconductor device fabrication method

Protected solder ball joints in wafer level chip-scale packaging

Manufacturing method of redistribution circuit structure

METHOD OF FORMING CONDUCTIVE BUMPS

THREE DIMENSIONAL PACKAGING WITH WAFER-LEVEL BONDING AND CHIP-LEVEL REPAIR

Substrate based unmolded package

Stacked dual MOSFET package

SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE

System for electronic components mounted on a circuit board

Stacked-die package for battery power management

METHOD OF COMPRESSION-MOLDING ELECTRONIC COMPONENTS AND MOLD

Drop-mold conformable material as an encapsulation for an integrated circuit package system

FLIP CHIP WAFER, FLIP CHIP DIE AND MANUFACTURING PROCESSES THEREOF

Semiconductor module

Integrated circuit chip component, multi-chip module, their integration structure, and their fabrication method

Undercut-free BLM process for Pb-free and Pb-reduced C4

Semiconductor device

Copper pillar tin bump on semiconductor chip and method of forming the same

CHIP STRUCTURE, SUBSTRATE STRUCTURE, CHIP PACKAGE STRUCTURE AND PROCESS THEREOF

Semiconductor chip, method of manufacturing semiconductor chip, and semiconductor device

Method and system for providing a reliable semiconductor assembly

Method and System for Providing a Low-Profile Semiconductor Assembly

THERMAL CONDUCTOR LIDS FOR AREA ARRAY PACKAGED MULTI-CHIP MODULES AND METHODS TO DISSIPATE HEAT FROM MULTI-CHIP MODULES

SEMICONDUCTOR MODULE AND IMAGE PICKUP APPARATUS

METHOD OF CONNECTING A SEMICONDUCTOR PACKAGE TO A PRINTED WIRING BOARD

Semiconductor power module packages with simplified structure and methods of fabricating the same

PACKAGE-ON-PACKAGE WITH IMPROVED JOINT RELIABILITY

Power device packages and methods of fabricating the same

LEADFRAME FOR LEADLESS PACKAGE

Integrated circuit package system with insulator over circuitry

Integrated circuit package-in-package system with wire-in-film encapsulant

Back to Back Die Assembly For Semiconductor Devices

Semiconductor chip device having through-silicon-via (TSV) and its fabrication method

Electrical device and method

Methods and apparatus for measuring analytes using large scale FET arrays

Semiconductor apparatus including a radiator for diffusing the heat generated therein

Light-emitting diode

Optoelectronic component with a wireless contacting

DEVICE AND METHOD FOR PRODUCING A BONDING CONNECTION

APPARATUS AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

In-line package apparatuses and methods

Substrate for mounting electronic part and electronic part

Wiring board and method for manufacturing the same

THERMOCOMPRESSION BONDING HEAD AND MOUNTING DEVICE USING THE SAME

Flip chip mounting method and method for connecting substrates

Die-to-robot alignment for die-to-substrate bonding

Electronic component mounting method

Integrated circuit with intra-chip clock interface and methods for use therewith

Method of manufacturing semiconductor device with through hole

Method of manufacturing semiconductor device

Semiconductor device and method of manufacturing semiconductor device

Low profile stacking system and method

Method for removing bubbles from adhesive layer of semiconductor chip package

Imaging device and method for a bonding apparatus

Adhesive composition for semiconductor, semiconductor device making use of the same and process for producing semiconductor device

Semiconductor package and mounting method thereof

Semiconductor device and method for manufacturing thereof

Board adapted to mount an electronic device, semiconductor module and manufacturing method therefor, and portable device

Semiconductor device and a method of manufacturing the same

Chip structure and stacked structure of chips

Carbon nanotube structures for enhancement of thermal dissipation from semiconductor modules

SEMICONDUCTOR MODULE AND IMAGE PICKUP APPARATUS

Stacked semiconductor package

MANUFACTURING METHOD OF SEMICONDUCTOR APPARATUS AND SEMICONDUCTOR APPARATUS

Semiconductor device having spacer formed on semiconductor chip connected with wire

Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic components

Method for manufacturing a printed wiring board

Gold alloy wire for bonding wire having high bonding reliability, high roundness of compression ball, high straightness and high resin flowability resistance

Method for producing substrate

Manufacturing method of semiconductor integrated device with inverting plating cup

Method of forming an inductor on a semiconductor wafer

Flip chip mounting method and bump forming method

Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

Method for micro component self-assembly

Mounting structure

Manufacturing method for RFID tag

Method of processing a contact pad, method of manufacturing a contact pad, and integrated circuit element

Flip chip mounting method and method for connecting substrates

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

Gold wire for semiconductor element connection

C4 joint reliability

Electronic component

Semiconductor package

Multipiece apparatus for thermal and electromagnetic interference (EMI) shielding enhancement in die-up array packages and method of making the same

Robust multi-layer wiring elements and assemblies with embedded microelectronic elements

SEMICONDUCTOR DEVICE HAVING THREE-DIMENSIONAL STACKED STRUCTURE AND METHOD OF FABRICATING THE SAME

Integrated circuit package with integrated heat sink

SEMICONDUCTOR CHIP PACKAGE HAVING METAL BUMP AND METHOD OF FABRICATING SAME

Integrated circuit package

Reduction of package height in a stacked die configuration

SURFACE ACOUSTIC WAVE SENSOR ASSEMBLIES

Electronic device and method of manufacturing same

Electronic component, semiconductor device, methods of manufacturing the same, circuit board, and electronic instrument

Methods for forming connective elements on integrated circuits for packaging applications

Method for manufacturing a semiconductor device

Wafer bonding method

SEMICONDUCTOR CHIP MOUNTING METHOD, SEMICONDUCTOR MOUNTING WIRING BOARD PRODUCING METHOD AND SEMICONDUCTOR MOUNTING WIRING BOARD

Wafer-level chip scale package and method for fabricating and using the same

Method of manufacturing chip-on-chip semiconductor device

Modular chip integration techniques

Adhesive film composition, associated dicing die bonding film, die package, and associated methods

Substrate anchor structure and method

Thin semiconductor device package

Wafer of circuit board and joining structure of wafer or circuit board

Assembly comprising a functional device and a resonator and method of making same

RFID tag and manufacturing method thereof

JUNCTION STRUCTURE AND METHOD OF MANUFACTURING THE SAME

WAFER-LEVEL UNDERFILL PROCESS USING OVER-BUMP-APPLIED RESIN

Wiring board of semiconductor device, semiconductor device, electronic apparatus, mother board, method of manufacturing wiring board of semiconductor device, method of manufacturing mother board and method of manufacturing electronic apparatus

Semiconductor device and method for manufacturing the same

Solder-top enhanced semiconductor device for low parasitic impedance packaging

Chip structure

METAL PAD OF SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE HAVING A FINE PITCH BONDPAD

Flip-Chip Interconnect Structure

SELF-ASSEMBLED STRESS RELIEF INTERFACE

Semiconductor device

SEMICONDUCTOR PACKAGE

Stacked package and method of manufacturing the same

SEMICONDUCTOR DEVICE

Apparatus and method configured to lower thermal stresses

Silicon substrate for package

Semiconductor structure and method of manufacture

Solder Ball Placement Vacuum Tool

PRINTED CIRCUIT BOARD HAVING ADHESIVE LAYER AND SEMICONDUCTOR PACKAGE USING THE SAME

Design structure incorporating semiconductor device structures that shield a bond pad from electrical noise

Semiconductor chip with coil element over passivation layer

Method of forming micro metal bump

Stacked packaging improvements

Image display unit with light emitting devices having a resin surrounding the light emitting devices

Apparatus and method of forming high performance integrated RF optical module

Power recovery circuit based on partial standing waves

Rectifier for automotive alternator

Semiconductor substrate including first and second recognition marks and method for manufacturing semiconductor device

Alignment Marks on the Edge of Wafers and Methods for Same

Electrically enhanced wirebond package

Chip package structure and method of manufacturing the same

BONDING PAD FOR ANTI-PEELING PROPERTY AND METHOD FOR FABRICATING THE SAME

Flip chip connection structure having powder-like conductive substance and method of producing the same

Wafer level stacked die packaging

SEMICONDUCTOR DEVICE

ELECTRONIC DEVICE AND MANUFACTURING METHOD THEREOF

Semiconductor packaging device

Semiconductor device

Gold alloy wire for bonding wire having high initial bondability, high bonding reliability, high roundness of compression ball, high straightness, and high resin flowability resistance

Method for fixing an electronic component on a printed circuit board and system comprising a printed circuit board and at least one electronic component

Electronic device

Metallic laminate and method for preparing the same

Wiring terminal-connecting adhesive

Inductor formed in an integrated circuit

Integrated circuit package including wire bonds

Method of forming premolded lead frame

Method for Singulating a Group of Semiconductor Packages that Contain a Plastic Molded Body

Optical device for reducing disturbance light and manufacturing method thereof

Semiconductor device comprising a housing containing a triggering unit

Semiconductor device and method of manufacturing the same

Method for manufacturing a stacked semiconductor package, and stacked semiconductor package

Semiconductor apparatus, manufacturing method of semiconductor apparatus, and joint material

INTER-CONNECTING STRUCTURE FOR SEMICONDUCTOR PACKAGE AND METHOD OF THE SAME

Semiconductor device and manufacturing method of the same

SEMICONDUCTOR DEVICE AND CIRCUIT DEVICE HAVING THE SAME MOUNTED THEREON

Semiconductor device

Bump I/O contact for semiconductor device

Thermally enhanced wafer level package

Semiconductor package, electronic part and electronic device

Semiconductor device

SEMICONDUCTOR DEVICE AND LEAD FRAME USED FOR THE SAME

Semiconductor apparatus with decoupling capacitor

LIGHT EMITTING DIODE PACKAGE

Light-emitting device

Solder layer, substrate for device joining utilizing the same and method of manufacturing the substrate

Multilayer pillar for reduced stress interconnect and method of making same

Single shot molding method for COB USB/EUSB devices with contact pad ribs

BGA package having half-etched bonding pad and cut plating line and method of fabricating same

Method for producing a semiconductor device using a solder alloy

BONDED SOI SUBSTRATE, AND METHOD FOR MANUFACTURING THE SAME

Method for producing a power semiconductor module comprising surface-mountable flat external contacts

Roll-on encapsulation method for semiconductor packages

Method of manufacturing semiconductor device

Die offset die to bonding

Circuit module and radio communications equipment, and method for manufacturing circuit module

Method of Sealing and Molding an Optical Device With Resin

Dicing die attachment film and method for packaging semiconductor using same

Die offset die to die bonding

Integrated circuit package system including die having relieved active region

SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR SUBSTRATE

Bond pad design for fine pitch wire bonding

Semiconductor device, method for mounting semiconductor device, and mounting structure of semiconductor device

Semiconductor package having marking layer

SEMICONDUCTOR DEVICE AND METHOD OF BUMP FORMATION

METHOD FOR FORMING AND RELEASING INTERCONNECTS

Stable gold bump solder connections

Semiconductor chip package, semiconductor chip assembly, and method for fabricating a device

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Memory Packages Having Stair Step Interconnection Layers

Lead frame, electronic component including the lead frame, and manufacturing method thereof

Semiconductor device having interconnected contact groups

Wireless semiconductor package for efficient heat dissipation

Dual capillary IC wirebonding

Semiconductor devices

Electroconductive particle placement sheet and anisotropic electroconductive film

Multilayer printed wiring board

FLIP-CHIP MOUNTING APPARATUS

Method for producing an electric component-mounted substrate

Proximity communication package for processor, cache and memory

Heat-resistant resin paste and method for producing same

Forming method of electrode and manufacturing method of semiconductor device

Manufacturing process of leadframe-based BGA packages

Method of manufacturing wafer level package

Wafer packaging method

Flip chip package with advanced electrical and thermal properties for high current designs

Method for thin semiconductor packages

Method for Manufacturing Microdevices or Integrated Circuits on Continuous Sheets

Shielding Apparatus and Manufacturing Method Thereof

Method of reducing memory card edge roughness by edge coating

METHOD OF REDUCING MEMORY CARD EDGE ROUGHNESS BY PARTICLE BLASTING

Die warpage control

FLIP-CHIP MOUNTING BODY AND FLIP-CHIP MOUNTING METHOD

Method and arrangement for contact-connecting semiconductor chips on a metallic substrate

Semiconductor packages having interposers, electronic products employing the same, and methods of manufacturing the same

STACK-TYPE SEMICONDUCTOR PACKAGE

Semiconductor device and semiconductor memory device