PACKAGE-ON-PACKAGE SEMICONDUCTOR STRUCTURE

Solder preform and electronic component

IC PACKAGE WITH WIREBOND AND FLIPCHIP INTERCONNECTS ON THE SAME DIE WITH THROUGH WAFER VIA

Semiconductor device including a pressure-contact section

SEMICONDUCTOR PACKAGE STRUCTURE WITH LAMINATED INTERPOSING LAYER

COL SEMICONDUCTOR PACKAGE

Semiconductor package having a bridged plate interconnection

Semiconductor chip package

Apparatus and method for series connection of two die or chips in single electronics package

Chip package structure and the method thereof with adhering the chips to a frame and forming UBM layers

Chip arrangement and a method of determining an inductivity compensation structure for compensating a bond wire inductivity in a chip arrangement

Semiconductor device and manufacturing method of the same

SEMICONDUCTOR DEVICE WITH CAPACITOR

Method of electrically connecting a microelectronic component

Method of manufacturing wiring substrate and method of manufacturing semiconductor device

Method for manufacturing multilayer film

Dual flat non-leaded semiconductor package

Wafer level IC assembly method

GOLD ALLOY WIRE FOR BONDING WIRE HAVING HIGH INITIAL BONDABILITY, HIGH BONDING RELIABILITY, HIGH ROUNDNESS OF COMPRESSION BALL, HIGH STRAIGHTNESS, HIGH RESIN FLOWABILITY RESISTANCE, AND LOW SPECIFIC RESISTANCE

Adhesive Film for Semiconductor and Semiconductor Device Therewith

Chip structure and stacked chip package as well as method for manufacturing chip structures

Semiconductor device and manufacturing method thereof

WAFER-LEVEL REDISTRIBUTION PACKAGING WITH DIE-CONTAINING OPENINGS

Bump-on-lead flip chip interconnection

Semiconductor device

Flip chip package

Semiconductor package and multi-chip package using the same

Structure, semiconductor structure and method of manufacturing a semiconductor structure and packaging thereof

Mounted body and method for manufacturing the same

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

Semiconductor device

Semiconductor die package including embedded flip chip

Semiconductor die package including multiple semiconductor dice

Semiconductor module

Semiconductor package with penetrable encapsulant joining semiconductor die and method thereof

Support mounted electrically interconnected die assembly

Multi-chips package structure and the method thereof

Advanced quad flat no lead chip package having a protective layer to enhance surface mounting and manufacturing methods thereof

Advanced quad flat no lead chip package having marking and corner lead features and manufacturing methods thereof

SEMICONDUCTOR CHIP PACKAGE HAVING GROUND AND POWER REGIONS AND MANUFACTURING METHODS THEREOF

Semiconductor package having a cavity structure

Leadframe package with dual lead configurations

Semiconductor Device

SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND LID FRAME

Self-assembly of elements using microfluidic traps

Method of bonding

Device for mounting electric component

SOLDER BUMP, ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE ELECTRONIC COMPONENT

DEVICE CAPABLE OF THERMALLY COOLING WHILE ELECTRICALLY INSULATING

Electric components connecting method

Bump forming method and bump forming apparatus

Method of forming an inlay substrate having an antenna wire

Dicing tape and die attach adhesive with patterned backing

Interconnecting a chip and a substrate by bonding pure metal bumps and pure metal spots

Semiconductor module

Semiconductor device and method of manufacturing the same

Method and device for fabricating an assembly of at least two microelectronic chips

Methods of fabricating a composite carbon nanotube thermal interface device

NON-PLANAR SUBSTRATE STRIP AND SEMICONDUCTOR PACKAGING METHOD UTILIZING THE SUBSTRATE STRIP

Semiconductor device

SEMICONDUCTOR DEVICE

Method of fabricating semiconductor components with through interconnects

Semiconductor device and manufacturing method thereof

Semiconductor module molded by resin with heat radiation plate opened outside from mold

Semiconductor device and fabricating method thereof

Semiconductor package having side walls and method for manufacturing the same

Wafer level die integration and method therefor

Integrated circuit with step molded inner stacking module package in package system

Chip package with a dam structure on a die pad

Semiconductor die package including exposed connections

Package structure with embedded die and method of fabricating the same

Semiconductor device with wire-bonding on multi-zigzag fingers

Semiconductor device and semiconductor device manufacturing method

Protection for bonding pads and methods of formation

Semiconductor circuit and method of fabricating the same

Optical semiconductor device and method of manufacturing optical semiconductor device

Semiconductor light-emitting device, light-emitting module and lighting unit

ELECTRONIC COMPONENT MOUNTING METHOD

Lead frame isolation using laser technology

Apparatus and methods for forming wire bonds

Low impedance gold electrode, apparatus, method and electrolyte solution for fabricating the same

Electronic component mounting method

Method of manufacturing wiring board having a semiconductor thereon

Adjusting Apparatus of Gap Width and Method Thereof

Etching Solution And Method For Structuring A UBM Layer System

Method of forming a metal bump on a semiconductor device

Packaging an integrated circuit die using compression molding

Method of manufacturing a semiconductor device

Power electronics assembly with cooling element

Semiconductor integrated circuit device

Methods for bonding and micro-electronic devices produced according to such methods

Wafer-level integrated circuit package with top and bottom side electrical connections

SEMICONDUCTOR DEVICE INCLUDING A PADDING UNIT

Flip chip semiconductor assembly with variable volume solder bumps

OPTIMIZED PASSIVATION SLOPE FOR SOLDER CONNECTIONS

Semiconductor module including a semiconductor device, a device mounting board, and a protecting layer therebetween

Semiconductor module and method of producing the same

Semiconductor device

CHIP PACKAGE AND PROCESS THEREOF

Semiconductor IC-embedded substrate and method for manufacturing same

Board-on-chip type substrates with conductive traces in multiple planes and semiconductor device packages including such substrates

SEMICONDUCTOR DEVICE

Semiconductor module

Semiconductor package having a bridge plate connection

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

Storage medium and semiconductor package

Double-side mountable MEMS package

Lead frame based semiconductor package and a method of manufacturing the same

Device comprising electrode pad

Soldering Method, Soldering Apparatus and Method for Manufacturing Semiconductor Device

WIRE BONDER

METHOD OF PRODUCING ELECTRONIC COMPONENT

Method of manufacturing a device incorporated substrate and method of manufacturing a printed circuit board

Semiconductor device and method for manufacturing the same

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

Semiconductor device manufacturing method

Method of manufacturing electronic component built-in substrate

Manufacturing method of resin-sealed semiconductor device

Board on chip package and method of manufacturing the same

Capacitive isolation circuitry

Semiconductor interconnect structure with stacked vias separated by signal line and method therefor

Semiconductor device

SEMICONDUCTOR STRUCTURE AND METHOD FOR FORMING THE SAME

Carbon nanotube-based conductive connections for integrated circuit devices

Semiconductor device and method of supporting a wafer during backgrinding and reflow of solder bumps

RE-DISTRIBUTION CONDUCTIVE LINE STRUCTURE AND THE METHOD OF FORMING THE SAME

Solder structures including barrier layers with nickel and/or copper

Semiconductor device and manufacturing method thereof

Semiconductor device and a method of manufacturing the same

JOINT RELIABILITY OF SOLDER JOINT BETWEEN Sn-yAg SOLDER AND Ni-P UNDER BUMP METALLIC LAYER BY COBALT ADDITION

Thermal interface material design for enhanced thermal performance and improved package structural integrity

Ball grid array package layout supporting many voltage splits and flexible split locations

SEMICONDUCTOR PACKAGE ACCOMPLISHING FAN-OUT STRUCTURE THROUGH WIRE BONDING

Resin sealed semiconductor device and manufacturing method therefor

Thermally enhanced molded leadless package

Semiconductor device

Package system for shielding semiconductor dies from electromagnetic interference

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD AND MOUNTING METHOD THEREOF

Device including semiconductor chip and leads coupled to the semiconductor chip and manufacturing thereof

SURFACE TREATMENT METHOD

SUBSTRATE MODULE, METHOD FOR MANUFACTURING SUBSTRATE MODULE, AND ELECTRONIC DEVICE

DICING DIE-BONDING FILM

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE AND ULTRASONIC BONDING APPARATUS

Method for forming lead frame land grid array

Chipstack package and manufacturing method thereof

Method of manufacturing semiconductor package

Semiconductor device

High voltage isolation dual capacitor communication system

Semiconductor device with recessed registration marks partially covered and partially uncovered

Semiconductor device including first substrate having plurality of wires and a plurality of first electrodes and a second substrate including a semiconductor chip being mounted thereon, and second electrodes connected with first electrodes of first substrate

Semiconductor device and a method of manufacturing the same

Wirebond over post passivation thick metal

FABRICATING LOW COST SOLDER BUMPS ON INTEGRATED CIRCUIT WAFERS

Solder interconnect pads with current spreading layers

Flip chip device and manufacturing method thereof

Semiconductor device and method of manufacturing semiconductor device

Conductive structure for a semiconductor integrated circuit

ELECTRICAL DEVICE AND METHOD OF MANUFACTURING ELECTRICAL DEVICES USING FILM EMBOSSING TECHNIQUES TO EMBED INTEGRATED CIRCUITS INTO FILM

System and method for integrated waveguide packaging

Electronic parts packaging structure and method of manufacturing the same

SEMICONDUCTOR DEVICE

Method of forming semiconductor chips, the semiconductor chips so formed and chip-stack package having the same

Integrated circuit and method

Intermediate Bond Pad for Stacked Semiconductor Chip Package

Module including a sintered joint bonding a semiconductor chip to a copper surface

Integrated circuit stacked package precursors and stacked packaged devices and systems therefrom

Integrated semiconductor device

Semiconductor device and a method of manufacturing the same

Method of manufacturing printed wiring board with built-in electronic component

Method of mounting electronic components

Method of manufacturing printed wiring board with built-in electronic component

SEMICONDUCTOR DEVICE FABRICATING METHOD

Flip chip mounting method, flip chip mounting apparatus and flip chip mounting body

Flip chip mounting body and method for mounting such flip chip mounting body and bump forming method

Treatment of items

Adhesive film

Multi-component electrical module

Wiring substrate for use in semiconductor apparatus, method for fabricating the same, and semiconductor apparatus using the same

Gap capacitors for monitoring stress in solder balls in flip chip technology

INDUCTANCE ELEMENT IN AN INTEGRATED CIRCUIT PACKAGE

Electrical connecting structure and bonding structure

Electronic packaging method and apparatus

Semiconductor device

Passivated Copper Chip Pads

Integrated circuit having wide power lines

Semiconductor device and method of manufacturing the same

Manufacturing method of semiconductor apparatus and semiconductor apparatus

POLYMER AND SOLDER PILLARS FOR CONNECTING CHIP AND CARRIER

Semiconductor package and method of making the same

Circuit board structure embedded with semiconductor chips

3D smart power module

Semiconductor device and manufacturing method thereof

Method of electrically connecting a microelectronic component

Method of electrically connecting a microelectronic component

Semiconductor device and manufacturing method of the same

Embedded die system and method

Package substrate with built-in capacitor and manufacturing method thereof

Conductive resin composition, connection method between electrodes using the same, and electric connection method between electronic component and circuit substrate using the same

Wire clamp and wire bonding apparatus having the same

Bare microelectronic chip provided with a recess forming a housing for a wire element constituting a flexible mechanical support, fabrication process and microstructure

Method for mounting an electronic component on a preferably soft support, and resulting electronic entity, such as a passport

Electric Component with Two-Phase Cooling Device and Method for Manufacturing

Method for manufacturing board with built-in electronic elements

ADHESIVE FILM FOR SEMICONDUCTOR

Metal-resin-boned structured body and resin-encapsulated semiconductor device, and fabrication method for them

Semiconductor device singulation method

Method for manufacturing stack package using through-electrodes

Device mounting board and manufacturing method therefor, and semiconductor module

Device mounting board, and semiconductor module and manufacturing method therefor

Wiring board for semiconductor devices, semiconductor device, electronic device, and motherboard

System, apparatus, and method for advanced solder bumping

Differential internally matched wire-bond interface

Integrated circuit with supply line intra-chip clock interface and methods for use therewith

Integrated Circuit and Memory Module

Bond pad structure

Semiconductor device including wiring and manufacturing method thereof

Semiconductor device having wiring line and manufacturing method thereof

Electronic device

Method for manufacturing a wafer level package

Wafer level chip scale package and process of manufacture

Semiconductor chip package and method for manufacturing thereof

SEMICONDUCTOR PACKAGE AND METHOD OF ATTACHING SEMICONDUCTOR DIES TO SUBSTRATES

Panel level methods and systems for packaging integrated circuits with integrated heat sinks

Semiconductor device having wiring line and manufacturing method thereof

Integrated module for data processing system

Semiconductor package and method for making the same

Hermetically-packaged devices, and methods for hermetically packaging at least one device at the wafer level

Semiconductor package and methods of fabricating the same

MOLDED PACKAGE ASSEMBLY

Semiconductor device package and method of making a semiconductor device package

Semiconductor device packages with electromagnetic interference shielding

Semiconductor device packages with electromagnetic interference shielding

Semiconductor Device Having Element Portion and Method of Producing the Same

Semiconductor device having antenna over thin film integrated circuit

Wire bonding method

Bondwire design

Wafer processing method for processing wafer having bumps formed thereon

Semiconductor device and manufacturing method thereof

Method for singulating semiconductor devices

SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD OF THE SAME

Electronic device and method of manufacturing same

Apparatus for improved power distribution in wirebond semiconductor packages

Semiconductor device

SEMICONDUCTOR CHIP COMPRESSION MOLDING METHOD AND MOLD FOR COMPRESSION MOLDING

SEMICONDUCTOR DEVICE

STACK CHIP PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Integrated Circuit, Semiconductor Module and Method for Manufacturing a Semiconductor Module

Multi-chip module

ANGLED FLYING LEAD WIRE BONDING PROCESS

SEMICONDUCTOR PACKAGE AND A METHOD FOR MANUFACTURING THE SAME

Methods and systems for packaging integrated circuits

Integrated circuit package system with wafer scale heat slug

Multiphase synchronous buck converter

Wafer Level Chip Scale Packages Including Redistribution Substrates and Methods of Fabricating the Same

Manufacturing process and structure for embedded semiconductor device

Method of manufacturing semiconductor device

Semiconductor chip with chip selection structure and stacked semiconductor package having the same

Semiconductor package with stacked dice for a buck converter

Semiconductor device and manufacturing method of the same

Wiring device for semiconductor device, composite wiring device for semiconductor device, and resin-sealed semiconductor device

Ultra-Thin Semiconductor Package

Semiconductor device

Method of manufacturing electronic device on leadframe

Manufacturing process of semiconductor device and semiconductor device

Circuit connection structure, method for producing the same and semiconductor substrate for circuit connection structure

Mounting substrate

Multilayer wiring board with concave portion for accomodating electronic component

Bonding wire for semiconductor device

Block-Molded Semiconductor Device Singulation Methods and Systems

Method for manufacturing electronic device

Power semiconductor devices having integrated inductor

Dual metal stud bumping for flip chip applications

Manufacturing method of semiconductor device

Semiconductor device packages and methods of fabricating the same

Light-emitting device and its manufacturing method

Method for forming bumps, semiconductor device and method for manufacturing same, substrate processing apparatus, and semiconductor manufacturing apparatus

Dicing tape laminated with adhesive sheet of polymer, thermosetting resin and filler

Semiconductor power device with bias circuit

Large area LED array and method for its manufacture

Liquid epoxy resin composition and flip chip semiconductor device

Module with stacked semiconductor devices

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND A METHOD OF MANUFACTURING THE SAME

Post bump and method of forming the same

Flip chip interconnect solder mask

WAFER LEVEL CHIP SCALE PACKAGE HAVING AN ENHANCED HEAT EXCHANGE EFFICIENCY WITH AN EMF SHIELD AND A METHOD FOR FABRICATING THE SAME

INSULATIVE WIRING BOARD, SEMICONDUCTOR PACKAGE USING THE SAME, AND METHOD FOR PRODUCING THE INSULATIVE WIRING BOARD

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME

Semiconductor package apparatus having redistribution layer

Semiconductor device including semiconductor chips with different thickness

Method of forming a semiconductor package and structure thereof

High performance system-on-chip inductor using post passivation process

Process for producing semiconductor device and apparatus therefor

SUBSTRATE FOR MOUNTING DEVICE AND METHOD FOR PRODUCING THE SAME, SEMICONDUCTOR MODULE AND METHOD FOR PRODUCING THE SAME, AND PORTABLE APPARATUS PROVIDED WITH THE SAME

Method of forming bonding pad opening

Alignment verification for C4NP solder transfer

INTEGRATION SCHEME FOR EXTENSION OF VIA OPENING DEPTH

Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board, and electronic instrument

Lamination device manufacturing method

Method for fabricating a flip chip system in package