Method for processing a base that includes connecting a first base to a second base with an insulating film

Semiconductor module

Optoelectronic headlight, method for production of an optoelectronic headlight and a luminescence diode chip

Structure of embedded active components and manufacturing method thereof

Electronic module having a multi-layer conductor for reducing its resistivity and a method of assembling such a module

Solder contacts and methods of forming same

Interconnect structures with bond-pads and methods of forming bump sites on bond-pads

Packaging structure, method for manufacturing the same, and method for using the same

SEMICONDUCTOR DEVICE PACKAGE

Leadless package

FLEXIBLE SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF

Semiconductor Die Packages Having Solder-free Connections, Systems Using the Same, and Methods of Making the Same

Integrated circuit package system with leadfinger support

Flex clip connector for semiconductor device

Semiconductor device and method of manufacturing the same

Contact element and a contact arrangement

Wiring board for semiconductor device

Printed circuit board and component package having the same

METHOD OF ARRANGING STACKED CHIP BY PHOTO-CURING ADHESIVE

Solar cell and magnetically self-assembled solar cell assembly

Silicon Carrier Including An Integrated Heater For Die Rework And Wafer Probe

Multiple access over proximity communication

Micropad formation for a semiconductor

Semiconductor device having a refractory metal containing film and method for manufacturing the same

Method of forming a bump structure using an etching composition for an under bump metallurgy layer

Removable layer manufacturing method

Method of manufacturing a semiconductor device

Semiconductor device having a chip mounting portion and a plurality of suspending leads supporting the chip mounting portion and each suspension lead having a bent portion

Method for forming a die-attach layer during semiconductor packaging processes

Method for processing a base that includes connecting a first base to a second base

Bonding pad structure and semiconductor device including the bonding pad structure

Package substrate with built-in capacitor and manufacturing method thereof

METHOD OF MANUFACTURING TRANSPONDER FOR WIRELESS CARD, METHOD OF MANUFACTURING WIRELESS CARD, WIRELESS CARD TRANSPONDER, AND WIRELESS CARD

High power integrated RF amplifier

Via offsetting to reduce stress under the first level interconnect (FLI) in microelectronics packaging

Semiconductor device and method of manufacturing the same

Semiconductor device and the method of manufacturing the same

Semiconductor device

Semiconductor device including electrically conductive bump and method of manufacturing the same

Three-dimensional stacked substrate arrangements

I/O PAD STRUCTURE FOR ENHANCING SOLDER JOINT RELIABILITY IN INTEGRATED CIRCUIT DEVICES

Semiconductor device, circuit board, and electronic instrument

Semiconductor device and method of manufacturing the same

Semiconductor Device

Conductive chip-scale package

Semiconductor device and programming method

Semiconductor module

Module with Flat Construction and Method for Placing Components

Substrate for semiconductor device, resin-sealed semiconductor device, method for manufacturing said substrate for semiconductor device and method for manufacturing said resin-sealed semiconductor device

ELECTRONIC COMPONENT, SEMICONDUCTOR PACKAGE, AND ELECTRONIC DEVICE

Silicon heat spreader mounted in-plane with a heat source and method therefor

Semiconductor die packages having overlapping dice, system using the same, and methods of making the same

Semiconductor package with an embedded printed circuit board and stacked die

Multi-chip package

Flexible contactless wire bonding structure and methodology for semiconductor device

Radio frequency over-molded leadframe package

ESD protection semiconductor device having an insulated-gate field-effect transistor

Interposer and method for manufacturing interposer

Method of manufacturing semiconductor device

Adhesive composition and adhesive sheet

Forming a 3-D semiconductor die structure with an intermetallic formation

Electronic apparatus manufacturing method

METHOD FOR MANUFACTURING A FLIP CHIP PACKAGE

Semiconductor Device and Method of Forming the Device Using Sacrificial Carrier

SUBSTRATE FOR MOUNTING DEVICE AND METHOD FOR PRODUCING THE SAME, SEMICONDUCTOR MODULE AND METHOD FOR PRODUCING THE SAME, AND PORTABLE APPARATUS PROVIDED WITH THE SAME

Packaged integrated circuits having inductors and methods to form inductors in packaged integrated circuits

Semiconductor module

PACKAGE SUBSTRATE EMBEDDED WITH SEMICONDUCTOR COMPONENT

Pad in semicondcutor device and fabricating method thereof

RFID tags and processes for producing RFID tags

Encapsulating resin composition for preapplication, semiconductor device made with the same, and process for producing the same

SEMICONDUCTOR DEVICE

Method for cutting and molding in small windows to fabricate semiconductor packages

PACKAGED INTEGRATED CIRCUITS HAVING SURFACE MOUNT DEVICES AND METHODS TO FORM PACKAGED INTEGRATED CIRCUITS

3-D semiconductor die structure with containing feature and method

Semiconductor package including flip chip controller at bottom of die stack

ELECTRICAL BONDING PAD

Semiconductor device using lead-free solder as die bonding material and die bonding material not containing lead

INTER-CONNECTING STRUCTURE FOR SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF THE SAME

Method of manufacturing semiconductor device including mounting and dicing chips

Semiconductor device and method of manufacturing the same

WIRE BONDING OF ALUMINUM-FREE METALLIZATION LAYERS BY SURFACE CONDITIONING

Semiconductor device and method of manufacturing the same

Method and system for providing an aligned semiconductor assembly

High-power semiconductor die packages with integrated heat-sink capability and methods of manufacturing the same

Semiconductor chip having conductive member for reducing localized voltage drop

SEMICONDUCTOR CHIP PACKAGE

METAL COVER ON FLIP-CHIP MATRIX-ARRAY (FCMX) SUBSTRATE FOR LOW COST CPU ASSEMBLY

Package substrate embedded with semiconductor component

SEMICONDUCTOR STACK DEVICE AND MOUNTING METHOD

STACKED WAFER LEVEL PACKAGE HAVING A REDUCED SIZE

Integrated circuit package system with interposer

SENSOR SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME

Semiconductor memory device

Etched surface mount islands in a leadframe package

LEAD FRAME DIE ATTACH PADDLES WITH SLOPED WALLS AND BACKSIDE GROOVES SUITABLE FOR LEADLESS PACKAGES

Leadless package system having external contacts

Integrated circuit package system with shielding

Semiconductor device and manufacturing method thereof

Semiconductor device and its manufacture

Semiconductor device with optical sensor and method of forming interconnect structure on front and backside of the device

WIRE BONDING METHOD AND SEMICONDUCTOR DEVICE

Semiconductor chip

Microball attachment using self-assembly for substrate bumping

Circuit board and process for producing the same

AVOIDING ELECTRICAL SHORTS IN PACKAGING

Electronic assembly manufacturing method

Forming robust solder interconnect structures by reducing effects of seed layer underetching

Method of forming a wafer level package

Semiconductor package board using a metal base

Method for manufacturing metal chips by plasma from a layer comprising several elements

Nanoscale metal paste for interconnect and method of use

METHOD FOR FORMING FILM PATTERN, METHOD FOR FORMING CONTACT HOLE, METHOD FOR FORMING BUMP, AND METHOD FOR MANUFACTURING LIGHT EMITTING DEVICE

Semiconductor device

ELECTRONIC COMPONENTS MOUNTING ADHESIVE, MANUFACTURING METHOD OF AN ELECTRONIC COMPONENTS MOUNTING ADHESIVE, ELECTRONIC COMPONENTS MOUNTED STRUCTURE, AND MANUFACTURING METHOD OF AN ELECTRONIC COMPONENTS MOUNTED STRUCTURE

Semiconductor element chip, ink jet head employing semiconductor element chip, and method for bonding electrodes of semiconductor element chip

Surface-mount type crystal oscillator

Die rearrangement package structure using layout process to form a compliant configuration

Semiconductor element, semiconductor device, and fabrication method thereof

Reconstituted wafer level stacking

Semiconductor device

Introducing a metal layer between SiN and TiN to improve CBD contact resistance for P-TSV

Structure and process for the formation of TSVs

METHOD OF MANUFACTURING A SEMICONDUCOTOR DEVICE

UNDER BUMP METALLURGY STRUCTURE OF SEMICONDUCTOR DEVICE PACKAGE

Semiconductor device employing wafer level chip size package technology

Method of fabricating a power electronic device

Wafer level chip scale packaging

SEMICONDUCTOR MODULE MOUNTING STRUCTURE

Dice rearrangement package structure using layout process to form a compliant configuration

Managed Memory Component

METHOD AND LEADFRAME FOR PACKAGING INTEGRATED CIRCUITS

Semiconductor package with leads on a chip having multi-row of bonding pads

Package with multiple dies

Semiconductor device and automotive AC generator

Conductive ball removing method, conductive ball mounting method, conductive ball removing apparatus, and conductive ball mounting apparatus

Forming solder balls on substrates

Low cost high frequency device package and methods

Electronic component manufacturing apparatus

Circuit arrangements and associated apparatus and methods

Structure for reducing stress for vias and fabricating method thereof

Method of manufacturing semiconductor device having semiconductor formation regions of different planar sizes

ROBUST DIE BONDING PROCESS FOR LED DIES

Multi-die wafer level packaging

Semiconductor device

Thermal mechanical flip chip die bonding

Thermal enhanced low profile package structure and method for fabricating the same

Semiconductor device fabricating method and fabricating apparatus

Method of manufacturing a printed wiring board

Semiconductor device

Wiring substrate and display device including the same

Sensor module and method for manufacturing a sensor module

Semiconductor package

Semiconductor device

Bonding pad for anti-peeling property and method for fabricating the same

Semiconductor package having redistribution layer

Methods of fluxless micro-piercing of solder balls, and resulting devices

Method of forming stacked die package

Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layer

Controller chip mounted on a memory chip with re-wiring lines

Methods and systems for packaging integrated circuits

Integrated circuit package system with interconnect lock

Semiconductor device and manufacturing method of the same

Semiconductor device

SEMICONDUCTOR COMPONENT AND METHOD OF MANUFACTURE

Electronic device

Leadframe having die attach pad with delamination and crack-arresting features

Integrated circuit package system for shielding electromagnetic interference

Method of opening pad in semiconductor device

ROUNDED DIE CONFIGURATION FOR STRESS MINIMIZATION AND ENHANCED THERMO-MECHANICAL RELIABILITY

Electronic device including an inductor

WIRE BONDING METHOD

COLD WELD HERMETIC MEMS PACKAGE AND METHOD OF MANUFACTURE

FORMING EDGE METALLIC CONTACTS AND USING COULOMB FORCES TO IMPROVE OHMIC CONTACT

SEMICONDUCTOR MODULE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

Manufacturing method of contact structure

METHOD FOR PRODUCING A SEMICONDUCTOR DEVICE

Method of forming a crack stop laser fuse with fixed passivation layer coverage

Dicing die-bonding film

Method of manufacturing flexible semiconductor assemblies

ELECTRONIC COMPONENT DEVICE, METHOD FOR MANUFACTURING ELECTRONIC COMPONENT DEVICE, ELECTRONIC COMPONENT ASSEMBLY, AND METHOD FOR MANUFACTURING ELECTRONIC COMPONENT ASSEMBLY

Interconnection element with plated posts formed on mandrel

Levitating substrate being charged by a non-volatile device and powered by a charged capacitor or bonding wire

Forming large planar structures from substrates using edge Coulomb forces

Assembling stacked substrates that can form cylindrical inductors and adjustable transformers

Wire bonding personalization and discrete component attachment on wirebond pads

SEMICONDUCTOR DEVICE

Flip-chip assembly with organic chip carrier having mushroom-plated solder resist opening

Semiconductor device

Top layers of metal for high performance IC's

Flip chip interconnection with double post

Semiconductor device and method of manufacturing the same

SEMICONDUCTOR PACKAGE AND METHOD THEREOF

Semiconductor device having solder-free gold bump contacts for stability in repeated temperature cycles

Fabrication method of semiconductor package

Semiconductor package and method of forming similar structure for top and bottom bonding pads

SYSTEM IN PACKAGE AND FABRICATION METHOD THEREOF

CIRCUIT MEMBER, MANUFACTURING METHOD OF THE CIRCUIT MEMBER, AND SEMICONDUCTOR DEVICE INCLUDING THE CIRCUIT MEMBER

Method for attaching a semiconductor die to a leadframe, and a semiconductor device

Chip-stacked package structure with asymmetrical leadframe

Semiconductor device

Embedded package security tamper mesh

Integrated circuit package system with shield

Integrated circuit package system for electromagnetic isolation

Component attach methods and related device structures

Method for soldering two elements together using a solder material

MULTI-LAYERED WIRING SUBSTRATE, METHOD FOR PRODUCING THE SAME, AND SEMICONDUCTOR DEVICE

Method of fabricating an interconnection element having conductive posts

Method of printing electronic circuits

Reconfigurable system that exchanges substrates using coulomb forces to optimize a parameter

Electrode bonding method and part mounting apparatus

Chip on wafer bonder

Method of manufacturing a semiconductor device

LCD Driver IC and Method for Manufacturing the Same

Touch screen system with light reflection

Wafer level die integration and method

Multi-chip stack structure and method for fabricating the same

Flexible column die interconnects and structures including same

Metal foil interconnection of electrical devices

Flip chip package and method for manufacturing the same

Chip package

Wafer level semiconductor package and method for manufacturing the same

UNDERBUMP METALLURGY EMPLOYING SPUTTER-DEPOSITED NICKEL TITANIUM ALLOY

Soft error rate mitigation by interconnect structure

SEMICONDUCTOR PACKAGE STRUCTURE, APPLICATIONS THEREOF AND MANUFACTURING METHOD OF THE SAME

Semiconductor device having improved solder joint and internal lead lifetimes

Resin-sealed semiconductor device, manufacturing method thereof, base material for the semiconductor device, and layered and resin-sealed semiconductor device

Semiconductor device

Method of fabricating a semiconductor device having a heat sink with an exposed surface

System and Method for Improving Reliability of Integrated Circuit Packages

Edge seal for thru-silicon-via technology

Semiconductor device and method of forming through hole vias in die extension region around periphery of die

Semiconductor device having a stacked multi structure that has layered insulated gate-type bipolar transistors

Semiconductor device including a die region designed for aluminum-free solder bump connection and a test structure designed for aluminum-free wire bonding

METHOD AND DEVICE FOR WIRE BONDING

Method of Forming Conductive Lines and Similar Features

Methods for manufacturing semiconductor devices

Isolating chip-to-chip contact

Low fabrication cost, high performance, high reliability chip scale package

Method for making a device including placing a semiconductor chip on a substrate

Method and apparatus for manufacturing semiconductor module

Chip packaging process including simpification and mergence of burn-in test and high temperature test

Adhesive compostion for die bonding in semiconductor assembly, adhesive film prepared therefrom, dicing die-bonding film prepared therefrom, device package including the same, and associated methods

FILM-LIKE ADHESIVE AND METHOD FOR CARRYING THE SAME

Electronic component with wire bonds in low modulus fill encapsulant

SEMICONDUCTOR PACKAGE, ELECTRONIC DEVICE INCLUDING THE SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE

STRUCTURE OF THREE-DIMENSIONAL STACKED DICE WITH VERTICAL ELECTRICAL SELF-INTERCONNECTIONS AND METHOD FOR MANUFACTURING THE SAME

Semiconductor device and method of manufacturing the same

Method of manufacturing semiconductor device and semiconductor device

Method for fabricating electrical bonding pads on a wafer

Method of producing multiple semiconductor devices

Semiconductor package and packaging method for balancing top and bottom mold flows from window

Semiconductor power device package having a lead frame-based integrated inductor

Device and method including a soldering process

SEMICONDUCTOR APPARATUS

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Electronic component module

Solder ball attachment ring and method of use

Process and Paste for Contacting Metal Surfaces

Soldering Method, Method for Manufacturing Semiconductor Module, and Soldering Apparatus

Soldering Method and Semiconductor Module Manufacturing Method

Work clamp and wire bonding apparatus

UNDERBUMP METALLURGY EMPLOYING SPUTTER-DEPOSITED NICKEL TITANIUM COPPER ALLOY

Multilayered Circuit Board for Connection to Bumps

INTERCONNECT STRUCTURE FOR A MICROELECTRONIC DEVICE, METHOD OF MANFACTURING SAME, AND MICROELECTRONIC STRUCTURE CONTAINING SAME

Electronic circuit device and method for manufacturing same

Epoxy Resin Composition and Die Bonding Material Comprising the Composition

Manufacture of a circuit board containing a component

Semiconductor device

Semiconductor device fabrication method

Protected solder ball joints in wafer level chip-scale packaging

Manufacturing method of redistribution circuit structure

METHOD OF FORMING CONDUCTIVE BUMPS

THREE DIMENSIONAL PACKAGING WITH WAFER-LEVEL BONDING AND CHIP-LEVEL REPAIR

Substrate based unmolded package

RESIN-ENCAPSULATED SEMICONDUCTOR DEVICE AND LEAD FRAME, AND METHOD FOR MANUFACTURING THE SAME

Stacked dual MOSFET package

High-volume on-wafer heterogeneous packaging of optical interconnects

SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE

System for electronic components mounted on a circuit board

Stacked-die package for battery power management

METHOD OF COMPRESSION-MOLDING ELECTRONIC COMPONENTS AND MOLD

Drop-mold conformable material as an encapsulation for an integrated circuit package system

FLIP CHIP WAFER, FLIP CHIP DIE AND MANUFACTURING PROCESSES THEREOF

Semiconductor module

Integrated circuit chip component, multi-chip module, their integration structure, and their fabrication method

Undercut-free BLM process for Pb-free and Pb-reduced C4

Semiconductor device

Copper pillar tin bump on semiconductor chip and method of forming the same

CHIP STRUCTURE, SUBSTRATE STRUCTURE, CHIP PACKAGE STRUCTURE AND PROCESS THEREOF

Semiconductor chip, method of manufacturing semiconductor chip, and semiconductor device

Method and system for providing a reliable semiconductor assembly

Method and System for Providing a Low-Profile Semiconductor Assembly

THERMAL CONDUCTOR LIDS FOR AREA ARRAY PACKAGED MULTI-CHIP MODULES AND METHODS TO DISSIPATE HEAT FROM MULTI-CHIP MODULES

SEMICONDUCTOR MODULE AND IMAGE PICKUP APPARATUS

SEMICONDUCTOR MODULE AND IMAGE PICKUP APPARATUS

METHOD OF CONNECTING A SEMICONDUCTOR PACKAGE TO A PRINTED WIRING BOARD

Semiconductor power module packages with simplified structure and methods of fabricating the same

PACKAGE-ON-PACKAGE WITH IMPROVED JOINT RELIABILITY