Thermo-compression bonded electrical interconnect structure and method

Method of manufacturing device having adhesive film on back-side surface thereof including breaking the adhesive with tension

Manufacturing method of semiconductor apparatus comprising alignment patterns in scribe regions

Thermal intermediate apparatus, systems, and methods

Electromagnetic shield formation for integrated circuit die package

Method of manufacturing a semiconductor device

Process for making microelectronic element chips

Method of bonding chips on a strained substrate and method of placing under strain a semiconductor reading circuit

Method of manufacturing semiconductor device

BALL FILM FOR INTEGRATED CIRCUIT FABRICATION AND TESTING

Electronic component soldering structure and electronic component soldering method

Semiconductor chip package and printed circuit board

Power integrated circuit with high insensitivity to parasitic inductances of wires for connection to a package and package for said integrated circuit

Minimizing the number of external terminals required when compensation is to be provided for signal drop in bond wire of a package in which an integrated circuit is provided

Semiconductor device, and manufacturing method of semiconductor device

Integrated circuit device having a gas-phase deposited insulation layer

Bonding method of semiconductor and laminated structure fabricated thereby

Semiconductor device

Semiconductor device with conductive interconnect

Connecting and bonding adjacent layers with nanostructures

Thermo-compression bonded electrical interconnect structure and method

Semiconductor mounting bonding wire

Integrated circuit, circuit system, and method of manufacturing

Redistribution layer for wafer-level chip scale package and method therefor

Method of forming low stress multi-layer metallurgical structures and high reliable lead free solder termination electrodes

Semiconductor device and method for manufacturing the same

Semiconductor device and method of manufacturing the same

Structure and method for fabricating flip chip devices

SEMICONDUCTOR APPARATUS AND FABRICATION METHOD THEREOF

Structure and method for forming a capacitively coupled chip-to-chip signaling interface

Semiconductor device with inductor

Electronic assemblies providing active side heat pumping

Packaging substrate having heat-dissipating structure

MICROELECTRONIC PACKAGE AND METHOD OF FORMING SAME

Semiconductor device

Multilayer wiring substrate, method of manufacturing the same, and semiconductor device

SEMICONDUCTOR DEVICE

Package for monolithic compound semiconductor (CSC) devices for DC to DC converters

Intergrated circuit packaging with improved die bonding

Integrated circuit package system with dual connectivity

Integrated circuit package system with leads separated from a die paddle

Thermal enhanced upper and dual heat sink exposed molded leadless package

Molded semiconductor device including IC-chip covered with conductor member

Integrated shielding process for precision high density module packaging

NANO-SCALE PARTICLE PASTE FOR WIRING MICROELECTRONIC DEVICES USING INK-JET PRINTING

Apparatus and method for arranging magnetic solder balls

Bonding device

Flip-chip component production method

Printed circuit board having embedded components and method for manufacturing thereof

PACKAGING SUBSTRATE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

Formation of circuitry with modification of feature height

Printed circuit board manufacturing method

Methods for removing contaminants from aluminum-comprising bond pads and integrated circuits therefrom

3D IC method and device

Microelectronic package interconnect and method of fabrication thereof

Manufacturing process for a quad flat non-leaded chip package structure

MANUFACTURING PROCESS FOR A QUAD FLAT NON-LEADED CHIP PACKAGE STRUCTURE

Semiconductor connection component

Manufacturing process for a quad flat non-leaded chip package structure

Manufacturing process for a chip package structure

Manufacturing process for a chip package structure

Electrical Interconnect Formed by Pulsed Dispense

Manufacturing process for a chip package structure

POSITIVE PHOTORESIST COMPOSITION, THICK FILM PHOTORESIST LAMINATE, METHOD FOR PRODUCING THICK FILM RESIST PATTERN, AND METHOD FOR PRODUCING CONNECTING TERMINAL

Electronic device having stack-type semiconductor package and method of forming the same

Semiconductor package having socket function, semiconductor module, electronic circuit module and circuit board with socket

Electronic device mounting structure

Semiconductor chip with crack stop

Stack chip and stack chip package having the same

Package structure for multiple die stack

Semiconductor device and method of manufacturing the same

Methods of forming nano-coatings for improved adhesion between first level interconnects and epoxy under-fills in microelectronic packages and structures formed thereby

Multi-chip semiconductor device

Semiconductor device and methods of manufacturing semiconductor devices

Dual-sided chip attached modules

SEMICONDUCTOR PACKAGE WITH REDUCED VOLUME AND SIGNAL TRANSFER PATH

Semiconductor package with improved size, reliability, warpage prevention, and heat dissipation and method for manufacturing the same

Semiconductor die mount by conformal die coating

Semiconductor package and method of assembling a semiconductor package

Semiconductor device including a coupling conductor having a concave and convex

Semiconductor packaging process using through silicon vias

Semiconductor device and producing method of the same

Conductive metal structure applied to a module IC and method of manufacturing the same

METHOD OF FORMING A SEMICONDUCTOR DIE HAVING A SLOPED EDGE FOR RECEIVING AN ELECTRICAL CONNECTOR

ELECTRONIC DEVICE

Circuit board structure and fabrication method thereof

Printed wiring board

Manufacturing process for a Quad Flat Non-leaded chip package structure

Method for forming bumps on under bump metallurgy

SEMICONDUCTOR PACKAGE HAVING A GRID ARRAY OF PIN-ATTACHED BALLS

Method of packaging an integrated circuit die

Method of manufacturing a semiconductor device including plural semiconductor chips

Method of producing electronic apparatus

Rectifier device for automotive alternator

Imaging device and method for a bonding apparatus

Bidirectional switch module

Semiconductor device

Semiconductor apparatus

Semiconductor apparatus

Semiconductor device having at least two terminals among the plurality of terminals electrically connected to each other while not being adjacent to one other and not being connected to internal circuit

Semiconductor device, method of manufacturing the semiconductor device, flip chip package having the semiconductor device and method of manufacturing the flip chip package

Flip chip for electrical function test and manufacturing method thereof

SEMICONDUCTOR PACKAGE AND APPARATUS USING THE SAME

Semiconductor device with non-overlapped circuits

Packaging substrate structure with electronic components embedded in a cavity of a metal block and method for fabricating the same

UNDER BUMP METALLIZATION STRUCTURE HAVING A SEED LAYER FOR ELECTROLESS NICKEL DEPOSITION

Wire bond pads

Semiconductor module, method for manufacturing semiconductor modules, semiconductor apparatus, method for manufacturing semiconductor apparatuses, and portable device

Method and structure for increased wire bond density in packages for semiconductor chips

Semiconductor integrated circuit device and method of fabricating the same

Semiconductor device and method of manufacturing the same

High strength solder joint formation method for wafer level packages and flip applications

Nail-shaped pillar for wafer-level chip-scale packaging

Semiconductor apparatus including semiconductor chip with stress material selectively provided in region of wiring layer

Electrode structure in semiconductor device and related technology

Semiconductor device and plural semiconductor elements with suppressed bending

Semiconductor device having an increased area of one of the opposing electrode parts for preventing generation of unconnected positions the electrodes on the bonded wafers

IC package having IC-to-PCB interconnects on the top and bottom of the package substrate

Wafer level packaging of semiconductor chips

SEMICONDUCTOR DEVICE

Packaging substrate structure with electronic component embedded therein and method for manufacture of the same

STACKED SEMICONDUCTOR PACKAGE WITH A REDUCED VOLUME

CO-PACKAGED HIGH-SIDE AND LOW-SIDE NMOSFETS FOR EFFICIENT DC-DC POWER CONVERSION

Integrated circuit package system employing an offset stacked configuration

Low cost lead frame package and method for forming same

SEMICONDUCTOR DIE PACKAGE INCLUDING STAND OFF STRUCTURES

Self locking and aligning clip structure for semiconductor die package

THERMALLY ENHANCED THIN SEMICONDUCTOR PACKAGE

Method for forming a packaged semiconductor device

Semiconductor assemblies and methods of manufacturing such assemblies including forming trenches in a first side of the molding material

Semiconductor element mounting substrate, semiconductor device using the same, and method for manufacturing semiconductor element mounting substrate

Method of producing a contactless microelectronic device, such as for an electronic passport

CONDUCTIVE BALL MOUNTING APPARATUS

Integrated circuit package and manufacturing method thereof

Electronic component module

Method for manufacturing multilayer ceramic electronic device

Method of manufacturing electronic component package

STRAP ASSEMBLY COMPRISING FUNCTIONAL BLOCK DEPOSITED THEREIN AND METHOD OF MAKING SAME

Printed board with component mounting pin

Printed board with component mounting pin

Wirebond pad for semiconductor chip or wafer

Method of manufacturing semiconductor package using redistribution substrate

Semiconductor packaging method

Semiconductor device comprising light-emitting element and light-receiving element, and manufacturing method therefor

MANUFACTURING APPARATUS AND METHOD FOR AN ELECTRONIC APPARATUS

ADHESIVE FILM FOR SEMICONDUCTOR USE, METAL SHEET LAMINATED WITH ADHESIVE FILM, WIRING CIRCUIT LAMINATED WITH ADHESIVE FILM, AND SEMICONDUCTOR DEVICE USING SAME, AND METHOD FOR PRODUCING SEMICONDUCTOR DEVICE

CORNER I/O PAD DENSITY

Semiconductor device, substrate and semiconductor device manufacturing method

Package structure and manufacturing method thereof

Semiconductor device and manufacturing method for the same

DIE STACKING IN MULTI-DIE STACKS USING DIE SUPPORT MECHANISMS

Semiconductor device and method for manufacturing the same

Semiconductor package having buss-less substrate

Semiconductor package with pad parts electrically connected to bonding pads through re-distribution layers

Flip-chip type semiconductor device

Electronic device and electronic apparatus

PROCESS FOR FORMING METAL FILM AND RELEASE LAYER ON POLYMER

Fan out type wafer level package structure and method of the same

Semiconductor package structure

LEAD FRAME STRUCTURE

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE

Multi-chip module package

Semiconductor component

Electronic component with buffer layer

Electronic device wafer level scale packages and fabrication methods thereof

Semiconductor device

Switching assembly for an aircraft ignition system

Electronic component mounting method and electronic component mounting device

Method of manufacturing component-embedded printed circuit board

Spiral Contactor

PACKAGING METHOD INVOLVING REARRANGEMENT OF DICE

Components joining method and components joining structure

Packaging substrate structure with electronic components embedded therein and method for manufacturing the same

Microelectronic lithographic alignment using high contrast alignment mark

Method of manufacturing semiconductor device

Multi-substrate region-based package and method for fabricating the same

Semiconductor element and semiconductor device

Microelectronic package

Top layers of metal for high performance IC's

Semiconductor chip package, electronic device including the semiconductor chip package and methods of fabricating the electronic device

Carrier substrate and integrated circuit

Semiconductor device and method for mounting semiconductor chip

Electronic device

Flip chip interconnection

Semiconductor package through-electrode suitable for a stacked semiconductor package and semiconductor package having the same

Semiconductor device including a first land on the wiring substrate and a second land on the sealing portion

Stacked microelectronic devices and methods for manufacturing stacked microelectronic devices

Semiconductor component having maximized bonding areas of electrically conductive members connected to semiconductor device and connected to leadframe and method of producing

SEMICONDUCTOR PACKAGE STRUCTURE AND LEADFRAME THEREOF

Power semiconductor device

INTEGRATED DEVICE AND CIRCUIT SYSTEM

INDIUM-SOLDER-COATED COPPER FOIL RIBBON CONDUCTOR AND METHOD OF CONNECTING THE SAME

Manufacturing method of semiconductor device

PACKAGED INTEGRATED CIRCUITS AND METHODS TO FORM A PACKAGED INTEGRATED CIRCUIT

Method of manufacturing an integrated circuit module

Fabrication method of an organic substrate having embedded active-chips

Multilayer printed circuit board structure comprising an integrated electrical component, and production method therefor

Cascode current sensor for discrete power semiconductor devices

ADHESION STRUCTURE FOR A PACKAGE APPARATUS

Flip-chip package covered with tape

Near chip scale package integration process

Integrated Circuit Having a Plurality of Connection Pads and Integrated Circuit Package

Method of fabricating stacked assembly including plurality of stacked microelectronic elements

Package and the method for making the same, and a stacked package

METHODS AND APPARATUS TO SUPPORT AN OVERHANGING REGION OF A STACKED DIE

Packaged integrated circuit devices with through-body conductive vias, and methods of making same

Power semiconductor component with metal contact layer and production method therefor

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME

Larger than die size wafer-level redistribution packaging process

Electronic element that includes multilayered bonding interface between first electrode having aluminum-containing surface and second electrode composed of metal nanoparticle sintered body

Semiconductor device including a semiconductor chip which is mounted spaning a plurality of wiring boards and manufacturing method thereof

Semiconductor device

Power semiconductor module

Method for fabricating a semiconductor and semiconductor package

WIRING SUBSTRATE AND DISPLAY DEVICE INCLUDING THE SAME

Semiconductor package having buried post in encapsulant and method of manufacturing the same

Leadframe-based semiconductor package

SEMICONDUCTOR DEVICE

Circuit member, manufacturing method for circuit members, semiconductor device, and surface lamination structure for circuit member

Thermally enhanced ball grid array package formed in strip with one-piece die-attached exposed heat spreader

Semiconductor device with semiconductor chip and method for producing it

Semiconductor package with a reduced volume and thickness and capable of high speed operation and method for fabricating the same

Optical communication module

Light source, manufacturing method of light source, lighting apparatus, and display apparatus

Mounting method, electric part-mounted substrate and an electric device

Noncontact information storage medium and method for manufacturing same

BONDING WIRE CLEANING UNIT AND METHOD OF WIRE BONDING USING THE SAME

Mounting method

C4NP servo controlled solder fill head

INTERCONNECT ASSEMBLIES AND METHODS

Method of manufacturing semiconductor device

In-place bonding of microstructures

CHIP PACKAGE AND CHIP PACKAGING PROCESS THEREOF

Apparatus and method for bonding silicon wafer to conductive substrate

Semiconductor element and a producing method for the same, and a semiconductor device and a producing method for the same

Component bonding method, component laminating method and bonded component structure

Method and apparatus for flip-chip bonding

Substrate and manufacturing method of the same, and semiconductor device and manufacturing method of the same

Laying apparatus, contact-making apparatus, movement system, laying and contact-making unit, production system, method for production and a transponder unit

Output control device, and AC/DC power source device, circuit device, LED backlight circuit device, and switching DC/DC converter device each using output control device

Semiconductor device manufacturing method

Semiconductor device and method of providing common voltage bus and wire bondable redistribution

Method and structure to reduce cracking in flip chip underfill

Semiconductor stack package having wiring extension part which has hole for wiring

SEMICONDUCTOR DEVICE

Die stacking apparatus and method

Arrangement of stacked integrated circuit dice having a direct electrical connection

System and method for providing semiconductor device features using a protective layer

Semiconductor devices including a through-substrate conductive member with an exposed end and methods of manufacturing such semiconductor devices

Bridge type pad structure of a semiconductor device

Small area, robust silicon via structure and process

Semiconductor chip package and method for designing the same

Semiconductor device having a stacked bump to reduce kirkendall voids and or cracks and method of manufacturing

SOLDER BUMP ON A SEMICONDUCTOR SUBSTRATE

Electronic device, method of producing the same, and semiconductor device

Substrate, substrate fabrication, semiconductor device, and semiconductor device fabrication

SEMICONDUCTOR CHIP WITH SOLDER BUMP AND METHOD OF FABRICATING THE SAME

Under Bump Routing Layer Method and Apparatus

Conductor bump method and apparatus

METHOD OF FORMING A STUD BUMP OVER PASSIVATION, AND RELATED DEVICE

Redistributed chip packaging with thermal contact to device backside

Integrated circuit packaging system for fine pitch substrates

Integrated Support Structure for Stacked Semiconductors With Overhang

Semiconductor device and lead frame

Integrated circuit package system with multiple devices

TFCC (TM) and SWCC (TM) thermal flex contact carriers

Three-dimensional package module

Compression bonding device and a mounting method

Method of manufacturing a contact arrangement between a microelectronic component and a carrier

Mounting apparatus mounting surface-mounted device on receiving device using ultrasonic vibration

METHODS AND SYSTEMS FOR LASER ASSISTED WIREBONDING

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

WAFER-LEVEL ACA FLIP CHIP PACKAGE USING DOUBLE-LAYERED ACA/NCA

Soldering method for mounting semiconductor device on wiring board to ensure invariable gap therebetween, and soldering apparatus therefor

INTERCONNECT STRUCTURE

Semiconductor die package with internal bypass capacitors

MCU with integrated voltage isolator to provide a galvanic isolation between input and output

Semiconductor device and method of manufacturing same

Semiconductor device

Method of manufacturing an electronic part mounting structure

Flip chip package structure and method for manufacturing the same

CHIP-TO-CHIP PACKAGE AND PROCESS THEREOF

Semiconductor package having a stacked wafer level package and method for fabricating the same

Electrical connections for multichip modules

Bond pad stacks for ESD under pad and active under pad bonding

Semiconductor device having external connection terminals and method of manufacturing the same

SYSTEM IN PACKAGE AND METHOD FOR FABRICATING THE SAME

Semiconductor package and method for manufacturing the same for decreasing number of processes

SEMICONDUCTOR PACKAGE HAVING AN IMPROVED CONNECTION STRUCTURE AND METHOD FOR MANUFACTURING THE SAME

Electronic assembly having a multilayer adhesive structure

Crosstalk-free WLCSP structure for high frequency application

Electronic device and method of manufacturing same

Heat extraction from packaged semiconductor chips, scalable with chip area

Electronic component package and method of manufacturing same

Method for manufacturing and making planar contact with an electronic apparatus, and correspondingly manufactured apparatus

Semiconductor module

Thin plastic leadless package with exposed metal die paddle

Thin semiconductor die packages and associated systems and methods